electrical connector Kinghelm KH-A12501-06Y 1.25 Ultra Thin Series with phosphor bronze contacts and RoHS compliance
Product Overview
The 1.25 Ultra-Thin Series Connector is designed for reliable electrical connections in various applications. This series features robust materials and precise engineering to ensure consistent performance. Key benefits include excellent contact resistance, high insulation resistance, and durability under demanding environmental conditions. Suitable for applications requiring compact and dependable interconnects.
Product Attributes
- Product Series: 1.25 Ultra-Thin Series Connector
- Brand: Kinghelm ()
- Model/Part Number: KH-A12501-06Y
- Environmental Protection: RoHS 2.0
- Housing Material: PBT UL94V-0, White
- Wafer Material: PA9T UL94V-0, Beige
- Terminal Material: Phosphor Bronze
- Contact Material: Phosphor Bronze
- Solder Tab Material: Phosphor Bronze
Technical Specifications
| Category | Item | Specification | Details |
|---|---|---|---|
| General | Scope | 1.25 Ultra-Thin Series Connector | N/A |
| Appearance | No defects, dirt, cracks, or mechanical damage. Contacts free from rust, plating oxidation, or peeling. | N/A | |
| Material & Surface Treatment | Terminal | Phosphor Bronze | Thickness: 0.15mm, Tin Plating: 2.5-5m |
| Housing | PBT | UL94V-0, Color: White | |
| Wafer | PA9T | UL94V-0, Color: Beige | |
| Contact | Phosphor Bronze | Thickness: 0.30mm, Gold Plating: 0.5~1m | |
| Ratings & Applicable Wires | Rated Voltage | 125V AC/DC | N/A |
| Rated Current | 1A AC/DC | N/A | |
| Ambient Temperature Range | -25 to +85 | N/A | |
| Applicable Wire Gauge | AWG28#-32# | N/A | |
| Electrical Performance | Contact Resistance | Initial: 20m Max, After Test: 30m Max | Test Condition: < 20mV open voltage, 100mA current |
| Withstand Voltage | No Breakdown and Flashover | Test Condition: 500V AC for 1 minute between adjacent terminals or ground | |
| Insulation Resistance | 100M Min | Test Condition: 500V DC between adjacent terminals or ground | |
| Mechanical Performance | Terminal Crimping Wire Strength | AWG#28: 13N, AWG#30: 8N, AWG#32: 6N | Axial pull-out force on wire |
| Terminal/Housing Retention Force | 8N Min per contact | Axial pull-out force from housing at 25.43mm/min | |
| Insertion & Withdrawal Force | Refer to Section 8 | Speed: 25.43mm/minute | |
| Pin Retention Force | 2N Min per contact | Axial push-out force from wafer at 25.43mm/min | |
| Endurance Characteristics | Repeated Insertion/Withdrawal | Contact Resistance: 30m Max | 30 cycles at a rate not exceeding 10 cycles/min |
| Temperature Rise | 30 Max | Energized at rated current until thermal stability | |
| Vibration Test | Appearance: No damage, Contact Resistance: 30m Max, Discontinuity: 1 micro-second Max | Amplitude: 1.5mm P-P, 10~55~10 Hz, 2 hours per X,Y,Z axis | |
| Heat Resistance | Appearance: No damage, Contact Resistance: 30m Max | 852, 96 hours | |
| Cold Resistance | Appearance: No damage, Contact Resistance: 30m Max | -253, 96 hours | |
| Humidity | Appearance: No damage, Contact Resistance: 30m Max, Withstand Voltage: No Breakdown/Flashover, Insulation Resistance: 100M Min | 602, 90~95% RH, 96 hours | |
| Temperature Cycling | Appearance: No damage, Contact Resistance: 30m Max | 5 cycles (-25 30 min to +85 30 min) | |
| Salt Spray | Appearance: No damage, Contact Resistance: 30m Max | 51% salt solution at 352 for 241 hours | |
| Solderability | Solder Wetting: 95% immersion area | Soldering Time: 3-5 sec, Temperature: 2455 | |
| Solder Resistance | Appearance: No damage | SMT reflow soldering: Time 5-10 sec, Temperature: 2555 (Refer to 9.1) | |
| Insertion/Withdrawal Force | See table below | N/A |
| No. of CTK PIN | At Initial | At 30th Cycle | ||
|---|---|---|---|---|
| I.F (N Max) | W.F (N Min) | I.F (N Max) | W.F (N Min) | |
| 2 | 4.5 | 0.4 | N/A | 0.3 |
| 3 | 6.5 | 0.6 | N/A | 0.5 |
| 4 | 9 | 0.8 | N/A | 0.6 |
| 5 | 11 | 1.0 | N/A | 0.8 |
| 6 | 13 | 1.2 | N/A | 0.9 |
| 7 | 15.5 | 1.4 | N/A | 1.1 |
| 8 | 17.5 | 1.6 | N/A | 1.2 |
| 9 | 20 | 1.8 | N/A | 1.5 |
| 10 | 22 | 2.0 | N/A | 1.5 |
| 11 | 24 | 2.2 | N/A | 1.7 |
| 12 | 26.5 | 2.4 | N/A | 1.8 |
| 13 | 28.5 | 2.6 | N/A | 2.0 |
| 14 | 31 | 2.8 | N/A | 2.1 |
| 15 | 33 | 3.0 | N/A | 2.3 |
| 16 | 35 | 3.2 | N/A | 2.4 |
| 17 | 37 | 3.4 | N/A | 2.6 |
| 18 | 39 | 3.6 | N/A | 2.7 |
| 19 | 41 | 3.8 | N/A | 2.9 |
| 20 | 44 | 4.0 | N/A | 3.0 |
SMT Lead-Free Process Temperature Curve: Refer to Section 9.1. Notes: Reflow soldering conditions may vary based on soldering devices, P.C. boards, etc. Pre-check conditions with your equipment.
Caution: Plastic material is hygroscopic. After opening the package, avoid exposure to environments with temperatures above 30 and humidity above 60% RH. Use within 24 hours after opening to prevent foaming and deformation during reflow or wave soldering.
2507241130_kinghelm-KH-A12501-06Y_C49424493.pdf