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Electrical Connector Kinghelm KH A12501 09Y 1.25 Ultra Thin Series with Excellent Contact Resistance

Manufacturer:
kinghelm
Description:
1.25mm 1 -25℃~+85℃ 9 Non-Latching P=1.25mm Rectangular Connector Housings RoHS
Category:
Arrays, Edge Type, Mezzanine (Board to Board)/Rectangular Connector Housings
Specifications
Pitch:
1.25mm
Flame Retardant Rating:
UL94V-0
Colour:
白色
Number Of Rows:
1
With Wings:
不带翅
Operating Temperature:
-25℃~+85℃
Number Of PINs Per Row:
9
Plastic Material:
PBT
Number Of Positions Or Pins:
1x9P
With Locker:
不带锁扣
Mfr. Part #:
KH-A12501-09Y
Package:
P=1.25mm
Model Number:
KH-A12501-09Y
Introduction

Product Overview

The 1.25 Ultra-Thin Series Connector is designed for reliable electrical connections in various applications. This series offers a compact and ultra-thin profile, making it suitable for space-constrained designs. It features robust materials and precise engineering to ensure consistent performance, including excellent contact resistance, high dielectric strength, and secure terminal retention. The connectors are built to withstand environmental challenges such as temperature fluctuations, humidity, and vibration, making them ideal for demanding industrial and electronic environments.

Product Attributes

  • Product Series: 1.25 Ultra-Thin Series Connector
  • Brand: Kinghelm ()
  • Website: www.kinghelm.com
  • Model/Part Number Reference: KH-A12501-09Y
  • Housing Material: PBT, UL94V-0, White
  • Wafer Material: PA9T, UL94V-0, Beige
  • Terminal Material: Phosphor Bronze
  • Contact Material: Phosphor Bronze
  • Environmental Protection: RoHS2.0

Technical Specifications

Specification Details
Scope 1.25 Ultra-thin series connector specifications
Appearance Product surface without defects, dirt, cracks, or mechanical damage. Contacts without rust, plating not oxidized or peeled.
Dimensions According to drawings
Material & Surface Treatment
  • Terminal: Phosphor Bronze (0.15mm thick), Tin Plating (2.5-5m)
  • Housing: PBT, UL94V-0, White
  • Wafer: PA9T, UL94V-0, Beige
  • Contact: Phosphor Bronze (0.30mm thick), Gold Plating (0.5~1m)
  • Solder Tab: Phosphor Bronze (0.20mm thick), Tin Plating (2.5~5m)
Ratings
  • Rated Voltage: 125V AC/DC
  • Rated Current: 1A AC/DC
  • Ambient Temperature Range: -25 to +85
  • Applicable Wire Gauge: AWG28#-32#
Electrical Performance
  • Contact Resistance: Initial: 20m Max; After Test: 30m Max
  • Withstand Voltage: 500V AC for 1 minute (No Breakdown/Flashover)
  • Insulation Resistance: 100M Min (at 500V DC)
Mechanical Performance
  • Terminal Crimping Wire Strength: AWG#28: >13N; AWG#30: >8N; AWG#32: >6N
  • Terminal/Housing Retention Force: Per contact: 8N Min
  • Insertion & Withdrawal Force: Refer to Section 8
  • Pin Retention Force: Per contact: 2N Min
Endurance Characteristics
  • Repeated Insertion/Withdrawal (30 cycles): Contact Resistance: 30 m Max
  • Temperature Rise: 30 Max (at rated current)
  • Vibration Test: Amplitude: 1.5mm P-P; Frequency: 10-55-10 Hz; Duration: 2 hours/axis; Contact Resistance: 30 m Max; Discontinuity: 1 micro-second Max.
  • Heat Resistance (852, 96 hours): Contact Resistance: 30 m Max
  • Cold Resistance (-253, 96 hours): Contact Resistance: 30 m Max
  • Humidity (602, 90-95% RH, 96 hours): Contact Resistance: 30 m Max; Withstand Voltage: No Breakdown/Flashover; Insulation Resistance: 100M Min
  • Temperature Cycling (5 cycles, -25 to +85): Contact Resistance: 30 m Max
  • Salt Spray (352, 51% solution, 241 hours): Contact Resistance: 30 m Max
  • Solderability: Solder Wetting: >95% immersion area (Soldering Time: 3-5 sec, Temp: 2455)
  • Solder Resistance (SMT Reflow): Refer to Section 9.1 temperature curve (Soldering Time: 5-10 sec, Temp: 2555)
Insertion/Withdrawal Force (Section 8)
No. of CTK PIN Initial I.F (N Max) Initial W.F (N Min) 30th I.F (N Max) 30th W.F (N Min)
24.50.42.40.3
36.50.62.60.5
490.82.80.6
5111.03.00.8
6131.23.20.9
715.51.43.41.1
817.51.63.61.2
9201.83.81.5
10222.04.01.5
11242.24.21.7
1226.52.44.41.8
1328.52.64.62.0
14312.84.82.1
15333.05.02.3
16353.25.22.4
17373.45.42.6
18393.65.62.7
19413.85.82.9
20444.06.03.0
SMT Lead-free Process Temperature Curve (Section 9) Refer to provided temperature curve. Note: Reflow soldering conditions may vary based on soldering devices, P.C. boards, etc. Pre-check with own equipment is recommended.
Caution (Section 10) Plastic components are hygroscopic. After opening the package, avoid exposure to environments with temperatures > 30 and humidity > 60% RH. Use all components within 24 hours after opening to prevent foaming and deformation during reflow or wave soldering processes.

2507241130_kinghelm-KH-A12501-09Y_C49424496.pdf

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