Electrical connector 1.25 Ultra Thin Series Connector kinghelm KH A12501 05Y rated current 1A AC DC
Manufacturer:
kinghelm
Description:
1.25mm 1 -25℃~+85℃ 5 Non-Latching P=1.25mm Rectangular Connector Housings RoHS
Category:
Arrays, Edge Type, Mezzanine (Board to Board)/Rectangular Connector Housings
Specifications
Pitch:
1.25mm
Flame Retardant Rating:
UL94V-0
Colour:
白色
Number Of Rows:
1
With Wings:
不带翅
Operating Temperature:
-25℃~+85℃
Number Of PINs Per Row:
5
Plastic Material:
PBT
Number Of Positions Or Pins:
1x5P
With Locker:
不带锁扣
Mfr. Part #:
KH-A12501-05Y
Package:
P=1.25mm
Model Number:
KH-A12501-05Y
Introduction
Product Overview
The 1.25 Ultra-Thin Series Connector is designed for reliable electrical connections in a compact form factor. This series offers robust performance with specifications including a rated voltage of 125V AC/DC and a rated current of 1A AC/DC, operating within an ambient temperature range of -25 to +85. It is suitable for applications utilizing wires from AWG28# to 32#.
Product Attributes
- Product Series: 1.25 Ultra-Thin Series Connector
- Brand: Kinghelm ()
- Origin: China
- Environmental Protection Grade: RoHS2.0
Technical Specifications
| Category | Item | Material | Finish | Specification | Requirement |
|---|---|---|---|---|---|
| Material & Surface Treatment | Terminal | Phosphor bronze | Tin Plating: 2.5-5m | Thickness: 0.15mm | |
| Housing | PBT | UL94V-0 | Color: White | ||
| Wafer | PA9T | UL94V-0 | Color: Beige | ||
| Contact | Phosphor bronze | Gold Plating: 0.5~1 | Thickness: 0.30mm | ||
| Electrical Performance | Contact Resistance | Initial: 20m Max; After Test: 30m Max | Test Mode: Male/female cooperation, open voltage < 20mV, current 100mA | ||
| Withstand Voltage | No Breakdown and Flashover | Test Mode: Mate connectors, 500V AC for 1 minute between adjacent terminals or ground | |||
| Insulation Resistance | 100M Min | Test Mode: Mate connectors, 500V DC between adjacent terminals or ground | |||
| Mechanical Performance | Terminal crimping wire strength | AWG#28: > 13N; AWG#30: > 8N; AWG#32: > 6N | Test Mode: Axial pull out force on wire | ||
| Terminal/ Housing Retention Force | 8N Min per contact | Test Mode: Axial pull out force at 25.43mm/minute | |||
| Pin Retention Force | 2N Min per contact | Test Mode: Axial push force at 25.43mm/minute | |||
| Endurance Characteristics | Repeated Insertion/ Withdrawal | Contact Resistance: 30m Max | Test Mode: 30 cycles at 10 cycles/minute | ||
| Temperature Rise | 30 Max | Test Mode: Energized at rating current until thermal stability | |||
| Vibration Test | Appearance: No damage; Contact Resistance: 30m Max; Discontinuity: 1 micro-second Max | Test Mode: Amplitude 1.5mm P-P, 10~55~10 HZ, 2 hours per X,Y,Z axis | |||
| Heat Resistance | Appearance: No damage; Contact Resistance: 30m Max | Test Mode: 852, 96 hours | |||
| Cold Resistance | Appearance: No damage; Contact Resistance: 30m Max | Test Mode: -253, 96 hours | |||
| Humidity | Appearance: No damage; Contact Resistance: 30m Max; Withstand Voltage: No Breakdown/Flashover; Insulation Resistance: 100M Min | Test Mode: 602, 90~95% RH, 96 hours | |||
| Temperature Cycling | Appearance: No damage; Contact Resistance: 30m Max | Test Mode: 5 cycles of -25 (30 min) to +85 (30 min) | |||
| Salt Spray | Appearance: No damage; Contact Resistance: 30m Max | Test Mode: 51% solution at 352 for 241 hours | |||
| Solderability | Solder Wetting: 95% Immersion area | Test Mode: Soldering Time 3-5sec, Temperature 2455 | |||
| Solder-Resistance | Appearance: No damage | Test Mode: SMT reflow, Soldering time 5-10sec, Temperature 2555 (Refer to 9.1 curve) | |||
| Ratings | Rated Voltage | 125V AC/DC | |||
| Rated Current | 1A AC/DC | ||||
| Ambient Temperature Range | -25 to +85 | ||||
| Applicable Wire Diameter | AWG28#-32# |
Important Notes
- SMT Lead-Free Process: Refer to section 9 for the SMT lead-free process temperature curve. Users are advised to verify reflow soldering conditions with their own equipment due to variations in soldering devices and PC boards.
- Handling Precautions: Due to the hygroscopic nature of the plastic, avoid exposure to environments with temperatures above 30 and humidity above 60% RH after opening the package. Ensure all product is used within 24 hours of unpacking to prevent foaming and deformation during reflow or wave soldering processes.
2507241130_kinghelm-KH-A12501-05Y_C49424492.pdf
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