Home > Products > Arrays, Edge Type, Mezzanine (Board to Board) >Rectangular Connector Housings > Kinghelm KH A12501 04Y 1.25 ultra thin series connector offering excellent insulation and durability

Kinghelm KH A12501 04Y 1.25 ultra thin series connector offering excellent insulation and durability

Manufacturer:
kinghelm
Description:
1.25mm 1 -25℃~+85℃ 4 Non-Latching P=1.25mm Rectangular Connector Housings RoHS
Category:
Arrays, Edge Type, Mezzanine (Board to Board)/Rectangular Connector Housings
Specifications
Pitch:
1.25mm
Flame Retardant Rating:
UL94V-0
Colour:
白色
Number Of Rows:
1
With Wings:
不带翅
Operating Temperature:
-25℃~+85℃
Number Of PINs Per Row:
4
Plastic Material:
PBT
Number Of Positions Or Pins:
1x4P
With Locker:
不带锁扣
Mfr. Part #:
KH-A12501-04Y
Package:
P=1.25mm
Model Number:
KH-A12501-04Y
Introduction

Product Overview

The 1.25 Ultra-Thin Series Connector is designed for reliable electrical connections in various applications. This series offers a compact and thin profile, making it suitable for space-constrained environments. Key features include robust contact resistance, high dielectric strength, and excellent insulation properties, ensuring stable performance under demanding conditions. The connectors are constructed from high-quality materials with specific plating for durability and corrosion resistance. They are rated for 125V AC/DC and 1A AC/DC, with an operating temperature range of -25 to +85, compatible with AWG28#-32# wires. Applications include electronic devices requiring compact and dependable interconnect solutions.

Product Attributes

  • Product Series: 1.25 Ultra-Thin Series Connector
  • Brand: Kinghelm ()
  • Housing Material: PBT UL94V-0, White
  • Wafer Material: PA9T UL94V-0, Beige
  • Terminal Material: Phosphor Bronze
  • Contact Material: Phosphor Bronze
  • Terminal Finish: Tin Plating (2.5-5m)
  • Contact Finish: Gold Plating (0.5-1)
  • Solder Tab Finish: Tin Plating (2.5-5m)
  • Environmental Protection: RoHS 2.0
  • Origin: China

Technical Specifications

Item Specification Details
Scope 1.25 Ultra-Thin Series Connector Specification
Appearance & Dimension Appearance Product surface without defect, dirt, crack, and mechanical damage; Contact without rust, plating not oxidized and not peeled.
Dimension According to drawings
Material & Surface Treatment Terminal Material Phosphor bronze, thickness 0.15mm
Housing Material PBT UL94V-0, White
Wafer Material PA9T UL94V-0, Beige
Contact Material Phosphor bronze, thickness 0.30mm
Ratings & Applicable Wires Rated Voltage 125V AC/DC
Rated Current 1A AC/DC
Ambient Temperature Range -25 to +85
Applicable Wire Gauge AWG28#-32#
Electrical Performance Contact Resistance (Initial) 20m Max
Contact Resistance (After Test) 30m Max
Withstand Voltage 500V AC for 1 minute (No Breakdown/Flashover)
Insulation Resistance 100M Min (at 500V DC)
Mechanical Performance Terminal Crimping Wire Strength (AWG#28) 13N
Terminal Crimping Wire Strength (AWG#30) 8N
Terminal Crimping Wire Strength (AWG#32) 6N
Terminal/Housing Retention Force 8N Min per contact
Insertion & Withdrawal Force Refer to Section 8
Pin Retention Force 2N Min per contact
Endurance Characteristics Repeated Insertion/Withdrawal (30 cycles) Contact Resistance 30 m Max
Temperature Rise (at rated current) 30 Max
Vibration Test Appearance: No damage; Contact Resistance 30 m Max; Discontinuity 1 micro-second Max.
Heat Resistance (852, 96 hours) Appearance: No damage; Contact Resistance 30 m Max
Cold Resistance (-253, 96 hours) Appearance: No damage; Contact Resistance 30 m Max
Humidity (602, 90-95% RH, 96 hours) Appearance: No damage; Contact Resistance 30 m Max; Withstand Voltage: No Breakdown/Flashover; Insulation Resistance 100M Min
Temperature Cycling (5 cycles: -25 to +85) Appearance: No damage; Contact Resistance 30 m Max
Salt Spray (352, 51% solution, 241 hours) Appearance: No damage; Contact Resistance 30 m Max
Solderability (2455, 3-5 sec) Solder Wetting 95%
Solder Resistance (SMT reflow, 2555, 5-10 sec) Refer to Section 9.1 for temperature curve; Appearance: No damage
Insertion/Withdrawal Force See table in Section 8
SMT Lead-Free Process Refer to Section 9 for temperature curve. Pre-check reflow soldering conditions with own equipment.
Caution Avoid exposure to temperatures >30, humidity >60%RH after opening package. Use within 24 hours to prevent foaming/deformation during reflow/wave soldering.

Section 8: Insertion/Withdrawal Force Table

No. of CTK PIN At Initial At 30th Cycle
I.F (N Max) W.F (N Min) I.F (N Max) W.F (N Min)
2 4.5 0.4 0.3 12
3 6.5 0.6 0.5 13
4 9 0.8 0.6 14
5 11 1.0 0.8 15
6 13 1.2 0.9 16
7 15.5 1.4 1.1 17
8 17.5 1.6 1.2 18
9 20 1.8 1.5 19
10 22 2.0 1.5 20
11 24 2.2 1.7 26.5
12 26.5 2.4 1.8 28.5
13 28.5 2.6 2.0 31
14 31 2.8 2.1 33
15 33 3.0 2.3 35
16 35 3.2 2.4 37
17 37 3.4 2.6 39
18 39 3.6 2.7 41
19 41 3.8 2.9 44
20 44 4.0 3.0

Section 9: SMT Lead-Free Process Temperature Curve

Notes: Please check the reflow soldering condition by your own devices beforehand. Because the condition changes by the soldering devices, P.C. boards, and so on.


2507241130_kinghelm-KH-A12501-04Y_C49424491.pdf

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