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Kinghelm KH A12501 03Y 1.25 Ultra Thin Series Connector Suitable For Various Electrical Applications

Manufacturer:
kinghelm
Description:
1.25mm 1 -25℃~+85℃ 3 Non-Latching P=1.25mm Rectangular Connector Housings RoHS
Category:
Arrays, Edge Type, Mezzanine (Board to Board)/Rectangular Connector Housings
Specifications
Pitch:
1.25mm
Flame Retardant Rating:
UL94V-0
Colour:
白色
Number Of Rows:
1
With Wings:
不带翅
Operating Temperature:
-25℃~+85℃
Number Of PINs Per Row:
3
Plastic Material:
PBT
Number Of Positions Or Pins:
1x3P
With Locker:
不带锁扣
Mfr. Part #:
KH-A12501-03Y
Package:
P=1.25mm
Model Number:
KH-A12501-03Y
Introduction

Product Overview

The 1.25 Ultra-Thin Series Connector is designed for reliable electrical connections, offering a compact and efficient solution for various applications. This series features robust materials and precise engineering to ensure consistent performance. Key specifications include a rated voltage of 125V AC/DC and a rated current of 1A AC/DC, with an operating temperature range of -25 to +85. The connectors are built to withstand environmental stresses, including humidity, temperature fluctuations, and vibration, while maintaining excellent electrical and mechanical integrity.

Product Attributes

  • Series: 1.25 Ultra-Thin Series Connector
  • Brand: Kinghelm ()
  • Website: www.kinghelm.com
  • Model/Part Number Reference: KH-A12501-03Y
  • Environmental Protection: RoHS 2.0

Technical Specifications

Specification Details
Scope 1.25 Ultra-thin series connector specifications
Appearance Product surface without defects, dirt, cracks, or mechanical damage. Contacts without rust, plating not oxidized or peeled.
Dimensions According to drawings
Material and Surface Treatment
Terminal Material: Phosphor bronze (0.15mm thick)
Finish: Tin Plating (2.5-5m)
Environmental Protection: RoHS 2.0
Housing Material: PBT UL94V-0
Color: White
Wafer Material: PA9T UL94V-0
Color: Beige
Contact (Pin) Material: Phosphor bronze (0.30mm thick)
Finish: Gold Plating (0.5~1)
Solder Tab Material: Phosphor bronze (0.20mm thick)
Finish: Tin Plating (2.5~5m)
Ratings and Applicable Wires
Rated Voltage 125V AC/DC
Rated Current 1A AC/DC
Ambient Temperature Range -25 to +85
Applicable Wire Gauge AWG28#-32#
Electrical Performance
Contact Resistance Initial: 20m Max
After Test: 30m Max
Withstand Voltage 500V AC for 1 minute (No Breakdown and Flashover)
Insulation Resistance 100M Min (at 500V DC)
Mechanical Performance
Terminal Crimping Wire Strength AWG#28: More than 13N
AWG#30: More than 8N
AWG#32: More than 6N
Terminal/Housing Retention Force 8N Min per contact
Insertion & Withdrawal Force Refer to Section 8
Pin Retention Force 2N Min per contact
Endurance Characteristics
Repeated Insertion/Withdrawal 30 cycles:
Contact Resistance: 30 m Max
Temperature Rise 30 Max (at rated current until thermal stability)
Vibration Test Amplitude: 1.5mm P-P
Frequency: 10~55~10 Hz/min
Duration: 2 hours per axis (X, Y, Z)
Requirements: No damage, Contact Resistance 30 m Max, Discontinuity 1 micro-second Max.
Heat Resistance 852, 96 hours:
Requirements: No damage, Contact Resistance 30 m Max
Cold Resistance -253, 96 hours:
Requirements: No damage, Contact Resistance 30 m Max
Humidity Test 602, 90~95% RH, 96 hours:
Requirements: No damage, Contact Resistance 30 m Max, Withstand Voltage: No Breakdown, Insulation Resistance 100M Min
Temperature Cycling 5 cycles (-25 for 30 min to +85 for 30 min):
Requirements: No damage, Contact Resistance 30 m Max
Salt Spray Test 352, 51% salt solution, 241 hours:
Requirements: No damage, Contact Resistance 30 m Max
Solderability Soldering Time: 3-5 sec, Temperature: 2455
Solder Wetting: Above 95% immersion area
Solder Resistance (SMT) Reflow Soldering:
Time: 5~10 sec, Temperature: 2555
Refer to 9.1 for temperature curve.
Requirements: No damage.
Insertion/Withdrawal Force (Section 8)
Number of Positions Initial I.F (N Max) | Initial W.F (N Min) | 30th I.F (N Max) | 30th W.F (N Min)
2 4.5 0.4 0.3 -
3 6.5 0.6 0.5 -
4 9 0.8 0.6 -
5 11 1.0 0.8 -
6 13 1.2 0.9 -
7 15.5 1.4 1.1 -
8 17.5 1.6 1.2 -
9 20 1.8 1.5 -
10 22 2.0 1.5 -
11 24 2.2 1.7 -
12 26.5 2.4 1.8 -
13 28.5 2.6 2.0 -
14 31 2.8 2.1 -
15 33 3.0 2.3 -
16 35 3.2 2.4 -
17 37 3.4 2.6 -
18 39 3.6 2.7 -
19 41 3.8 2.9 -
20 44 4.0 3.0 -
SMT Lead-free Process Temperature Curve (Section 9)
Notes: Please check the reflow soldering condition by your own devices beforehand. The condition changes by soldering devices, P.C. boards, and so on.
Caution (Section 10)
Plastic has water absorption characteristics. After opening the package, avoid exposure to environments with temperatures higher than 30 and humidity higher than 60%RH. Use all parts within 24 hours after opening the package to prevent foaming and deformation during subsequent reflow or wave soldering processes.

2507241130_kinghelm-KH-A12501-03Y_C49424490.pdf

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