Compact wire to board connector TE Connectivity 2367197-8 with 1.0mm pitch and secure latch mechanism
Manufacturer:
TE Connectivity
Description:
Connector Header 1mm Pitch 1A Surface Mount,Vertical -40℃~+105℃
Category:
Arrays, Edge Type, Mezzanine (Board to Board)/Headers, Male Pins
Specifications
Flame Retardant Rating:
UL94V-0
Number Of Rows:
1
Mounting Type:
立贴
Pitch:
1mm
Number Of PINs:
8P
Operating Temperature:
-40℃~+85℃
Contact Material:
铜合金
Color:
黑色
Current Rating:
1A
Contact Plating:
锡
Voltage Rating (Max):
50V
Mfr. Part #:
2367197-8
Package:
SMD,P=1mm
Model Number:
2367197-8
Introduction
Product Overview
The TE Connectivity 1.0mm Pitch Wire to Board Connector with Latch is designed for reliable wire-to-board connections. This low-profile connector series offers a secure latching mechanism and is suitable for applications requiring compact and robust interconnect solutions. It is engineered to meet stringent electrical, mechanical, and environmental performance requirements, making it ideal for various industrial and electronic applications.
Product Attributes
- Brand: TE Connectivity
- Material (Housing): Thermoplastic or Thermoplastic High Temp., UL94V-0
- Material (Contact): High performance copper alloy
- Material (Fitting Nail): Copper Alloy
- Certifications: RoHS compliant
Technical Specifications
| Product Part No. | Description | Pitch | Configuration | Working Voltage (per pin) | Voltage (AC, per pin) | Current Rating (AWG #28, per pin) | Operating Temperature | Applicable Wire Size | Recommended Insulation Diameter |
|---|---|---|---|---|---|---|---|---|---|
| *-2367196-* | Board side of Wire to Board Connector with Latch | 1.0mm | Right Angle | < 36 Volts | 50 Volts | 1 Ampere | -40 to +85 | AWG #28 | UL 3302 and equivalent |
| *-2367197-* | Board side of Vertical Wire to Board Connector with Latch | 1.0mm | Vertical | < 36 Volts | 50 Volts | 1 Ampere | -40 to +85 | AWG #28 | UL 3302 and equivalent |
| *-2367198-* | Cable end housing of Wire to Board Connector with Latch | 1.0mm | N/A | N/A | N/A | N/A | N/A | N/A | N/A |
| *-2367199-* | Cable end contact of Wire to Board Connector with Latch | 1.0mm | N/A | N/A | N/A | N/A | N/A | N/A | N/A |
| Performance Requirements: | |||||||||
| Electrical: | |||||||||
| Termination Resistance (Initial) | 10 m Max. | ||||||||
| Termination Resistance (Final) | R 20 m Max. | ||||||||
| Dielectric Withstanding Voltage | 250V AC for 1 minute (1mA Max. leakage) | ||||||||
| Insulation Resistance | 100 M Min. (500VDC for 1 minute) | ||||||||
| Temperature Rising | 30 Max. | ||||||||
| Mechanical: | |||||||||
| Connector Mating/Unmating Force | Refer to Item 5 (Operation Speed: 25.4 3 mm/minute) | ||||||||
| Durability (Repeated Mate/Unmating) | 30 cycles (25.4 3 mm/min) | ||||||||
| Contact Retention Force (Board Side) | 0.40 Kgf Min. (Operation Speed: 25.4 3 mm/minute) | ||||||||
| Crimping Terminal / Housing Retention Force (Cable Side) | 0.7 Kgf MIN. (Speed rate: 25.4 3 mm/minute) | ||||||||
| Crimping Pull Out Force (AWG #28) | 1.0 Kgf Min. (Operation Speed: 25.4 3 mm/minute) | ||||||||
| Vibration (Low Frequency) | No electrical discontinuity > 1 sec. (10-55 Hz, 0.76mm amplitude, 2 hours per direction) | ||||||||
| Physical Shock | No electrical discontinuity > 1 sec. (50 G's peak, 11ms duration, 3 shocks per axis) | ||||||||
| Environmental: | |||||||||
| Resistance to Wave Soldering Heat (Board Side) | Refer to Product Qualification and Test Sequence Group 10 (Lead Free) | ||||||||
| Resistance to Reflow Soldering Heat (Board Side) | Refer to Product Qualification and Test Sequence Group 10 (Lead Free) | ||||||||
| Thermal Shock | Refer to Product Qualification and Test Sequence Group 4 | ||||||||
| Humidity, Steady State | Refer to Product Qualification and Test Sequence Group 4 (40, 90-95% RH, 96 hours) | ||||||||
| Temperature Life | Refer to Product Qualification and Test Sequence Group 5 (85 for 96 hours) | ||||||||
| Salt Spray (Only For Gold Plating) | Refer to Product Qualification and Test Sequence Group (8-96 hours depending on plating thickness) | ||||||||
| Solder ability (Board Side) | Tin plating: Min. 95% coverage; Gold plating: Min. 75% coverage (245 5, 4-5 sec.) | ||||||||
| Hand Soldering Temperature Resistance (Board Side) | Appearance: No damage (T350 , 3 sec.) | ||||||||
2411041608_TE-Connectivity-2367197-8_C6916241.pdf
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