Home > Products > Arrays, Edge Type, Mezzanine (Board to Board) >Arrays, Edge Type, Mezzanine (Board to Board) > High Speed Board to Board Connector 0.5mm Pitch FOXCONN QT002206-4141-3H with Copper Alloy Contacts

High Speed Board to Board Connector 0.5mm Pitch FOXCONN QT002206-4141-3H with Copper Alloy Contacts

Manufacturer:
FOXCONN
Description:
0.5mm 2 220P -40℃~+85℃ 500mA Surface Mount,Vertical SMD,P=0.5mm Arrays, Edge Type, Mezzanine (Board to Board) RoHS
Category:
Arrays, Edge Type, Mezzanine (Board to Board)/Arrays, Edge Type, Mezzanine (Board to Board)
Specifications
Pitch:
0.5mm
Number Of Rows:
2
Number Of Pins:
220P
Operating Temperature:
-40℃~+85℃
Contact Plating:
Current Rating:
500mA
Mounting Type:
立贴
Contact Material:
铜合金
Mfr. Part #:
QT002206-4141-3H
Package:
SMD,P=0.5mm
Model Number:
QT002206-4141-3H
Introduction

Product Overview

The QT00 Series is a 0.5mm pitch board-to-board connector designed for high-speed applications. It is intended to be mated with the QT01 Series.

Product Attributes

  • Brand: Foxconn
  • Housing Material: LCP
  • Housing Color: Black
  • Contact Material: Copper Alloy
  • Metal Ear Material: Copper Alloy
  • Plating: 6u min. Gold Plating on Contact Area
  • Operating Temperature: -40 to +85

Technical Specifications

SpecificationDetails
SeriesQT00
Pitch0.5mm
ApplicationHigh Speed
Mating SeriesQT01
Mating Force40kgf max.
Unmating Force4.4kgf min.
Durability30 Cycles
Current Rating0.5A max. per contact
Contact Resistance55m max. (Initial), 75m max. (After)
Dielectric Withstanding Voltage200 VAC for 1 minute
Insulation Resistance100 mega ohms min. at 500 VDC

2501091644_FOXCONN-QT002206-4141-3H_C42432911.pdf

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