hanxia HX MICRO SIM 8 1P H1.5 SIM card connector offering robust electrical insulation and low resistance
HX MICRO SIM 8+1P H1.5 SIM Card Connector
This document specifies the characteristics and test methods for the HX MICRO SIM 8+1P H1.5 connector, designed and manufactured by Shenzhen Hanxia Electronic Co., Ltd. This product is a SIM card holder designed for various electronic applications requiring reliable connectivity.
Product Attributes
- Brand: HX MICRO
- Origin: Shenzhen, China
- Manufacturer: Shenzhen Hanxia Electronic Co., Ltd
- Material Compliance: RoHS compliant
Technical Specifications
| Item | Requirements | Test Methods |
| Product Confirmation | Product shall be conforming to the requirements of applicable product drawing. | Visually, dimensions and functionally inspected per applicable product drawing. |
| Contact resistance (Low Level) | 150 m Max. initial | Subject mated contacts assembled in housing to closed circuit of 10 mA max. at open circuit voltage of 20 mV max. |
| Insulation resistance | 1000 M Min. | Measure by applying test potential between the adjacent contacts, and between the contacts and ground in the mated connector. MIL-STD-202, Method 302, Condition B (100 V DC10%). |
| Dielectric Strength | 500 V AC for 1 minute. Current leakage must be 1.0 mA max. | Measure by applying test potential between the adjacent contacts, and between the contacts and ground in the mated connector. MIL-STD-202, Method 301. |
| Durability (Repeated Mating/Unmating) | Contact Resistance: 100 m Max. after testing | Mate and unmate connector for 1500 cycle |
| Temperature rise | 30C Max. | Carry rated current load. 0.3A per contact. (UL498) |
| Vibration Sinusoidal Low Frequency | No electrical discontinuity greater then |
Environmental Requirements
Solderability
Connectors solderability can meet MIL-STD-202F standard. Finish shall be free of contaminants.
Resistance to Solder Heat
Wave Soldering
- Preheat: Increase in temperature not to exceed 4 per second. Final preheat temperature will be within 125 of solder temperature.
- Soldering: Device leads will be exposed to solder wave at 250 for a maximum of 5 seconds.
- Cool Down: Cool down in ambient air at approximately 20 to 25.
Infrared Reflow Soldering
- Preheat: Increase in temperature not to exceed 4 per second.
- Soldering: Maximum allowable time above reflow temperature of 183 is 90 seconds. Maximum temperature in this interval is 260, not to exceed 10 seconds.
- Cool Down: Cool down shall not exceed 6 per second.
Note: Device temperature measurements are referenced from the top-center of the package outer surface.
Cleaning
Connectors resist to cleaning process. Aqueous Cleaning: Three cycles; each cycle consisting of a maximum of one minute exposure to 54 to 66 demineralized tap water at a maximum pressure of 30 psi; followed by air drying for 60 to 90 seconds at 93 to 121.
Storage and Transportation
Storage
Temperature: -20~+70, Relative humidity: 80%, Not to storage in corrosive environments. A re-qualification test shall be conducted immediately while the storage duration exceed 6 months.
Transportation
Any vehicle can be adopted for the transportation, but moisture-proof and no mechanical damage.
2510131431_hanxia-HX-MICRO-SIM-8-1P-H1-5_C19189030.pdf
