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sim card holder connector hanxia HX MICRO SIM 7P H1.35 with rohs compliance and ul498 certification

Manufacturer:
hanxia
Description:
Card Connector MICRO SIM Push-Push Surface Mount
Category:
PC Card Sockets/PC Card Sockets
Specifications
Operating Temperature:
-40℃~+70℃
Card Connection Mode:
自弹式
Height Above Board:
1.35mm
Connector Type:
卡座
Card Type:
MicroSIM卡
Mfr. Part #:
HX MICRO SIM 7P H1.35
Package:
SMD
Model Number:
HX MICRO SIM 7P H1.35
Introduction

Product Overview

This specification details the characteristics and test methods for the HX MICRO SIM 7P H1.35 connector, designed and manufactured by Shenzhen Hanxia Electronic Co., Ltd. It is a SIM card holder designed for various applications requiring reliable electrical and mechanical performance.

Product Attributes

  • Brand: Shenzhen Hanxia Electronic Co., Ltd
  • Origin: China
  • Material: Conforms to RoHS directive requirements.
  • Certifications: UL498 (mentioned in Table I for Temperature Rise)

Technical Specifications

Part No. Product Name Rev. Page No. SCOPE REFERENCE DOCUMENTS FEATURE & DIMENSIONS MATERIAL MECHANICAL & ELECTRICAL CHARACTERISTIC PACKAGING MARKING TRANSPORTATION STORAGE ENVIRONMENTAL PERFORMANCE AND TEST DESCRIPTION QUALITY ASSURANCE PROVISIONS
HX MICRO SIM 7P H1.35 SIM (SIM Card Holder) A 1/8, 2/8, 3/8, 4/8, 5/8 This product specification specifies the characteristics and test methods of the connector products designed and manufactured by the Company. MIL-STD-1344A, MIL-STD-202F, EIA364, JIS C 0051, MIL-G-45204C, IEC-512-3, QQ-N-290A, MIL-P-81728A, MIL-T-10727B, UL498, EN/ISO5961, EN1122, EN13346, EPA3052 Refer to customer drawing for dimensions and PCB/Panel layout. Harmful material can follow the requirement of RoHS. As described in Table I. Packaged according to purchase order requirements; tray or carrier tape per PO; container and packaging specification per customer drawing. Manufacturers name, industry recognized logo, or customer approved marks. Any vehicle can be adopted for transportation, but moisture-proof and no mechanical damage. Temperature: -20~+70; Relative humidity: 80%; Not to storage in corrosive environments. Re-qualification test after 6 months. Solderability: Meets MIL-STD-202F, finish free of contaminants. Resistance to Solder Heat: Wave Soldering (Preheat, Soldering 250/5s, Cool Down); Infrared Reflow (Preheat, Soldering 183+/90s, Max 260/10s, Cool Down 6/s). Cleaning: Resists cleaning process (Aqueous Cleaning details provided). Company is responsible for quality of delivered parts. Failing lots will be returned or corrected by supplier.

TABLE I: PERFORMANCE REQUIREMENTS

Items Requirements Test Methods
1. Confirmation of Product Product shall be conforming to the requirements of applicable product drawing. Visually, dimensions and functionally inspected per applicable product drawing.
2. Contact resistance (Low Level) 100 m Max. initial Subject mated contacts assembled in housing to closed circuit of 10 mA max. at open circuit voltage of 20 mV max.
3. Insulation resistance 1000 M Min. Measure by applying test potential between the adjacent contacts, and between the contacts and ground in the mated connector. MIL-STD-202, Method 302, Condition B (100 V DC10%).
4. Dielectric Strength 500 V AC for 1 minute. Current leakage must be 1.0 mA max. Measure by applying test potential between the adjacent contacts, and between the contacts and ground in the mated connector. MIL-STD-202, Method 301.
5. Durability (Repeated Mating/Unmating) Contact Resistance: 100 m Max. after testing Mate and unmate connector for 3000 cycle.
6. Temperature rise 30C Max. Carry rated current load. 0.3A per contact. (UL498)
7. Vibration Sinus (Data not provided in source) (Data not provided in source)

TABLE II: PRODUCT QUALIFICATION TEST SEQUENCE

(Data not provided in source)

TABLE III: REFLOW SOLDERING PROFILE

(Data not provided in source)


2510131431_hanxia-HX-MICRO-SIM-7P-H1-35_C19188978.pdf

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