Secure and hanxia HX SD CARD 11P connector ideal for demanding electronic data transfer applications
Manufacturer:
hanxia
Description:
Standard SD card Connector and Ejector Push-Pull Surface Mount
Category:
PC Card Sockets/PC Card Sockets
Specifications
Operating Temperature:
-40℃~+70℃
Card Connection Mode:
拔插式
Height Above Board:
2.9mm
Card Detection:
有
Connector Type:
卡座
Card Type:
标准SD卡
Mfr. Part #:
HX SD-CARD 11P
Package:
SMD
Model Number:
HX SD-CARD 11P
Introduction
Product Overview
This product specification details the characteristics and test methods for the HX SD-CARD 11P connector, designed and manufactured by Shenzhen Hanxia Electronic Co., Ltd. It is a high-quality SD card connector suitable for various applications requiring reliable data transfer and connectivity.
Product Attributes
- Brand: HX
- Origin: Shenzhen, China
- Manufacturer: Shenzhen Hanxia Electronic Co., Ltd.
- Material Compliance: RoHS
Technical Specifications
| Item | Requirements | Test Methods |
|---|---|---|
| Product Confirmation | Product shall be conforming to the requirements of applicable product drawing. | Visually, dimensions and functionally inspected per applicable product drawing. |
| Contact Resistance (Low Level) | 40 m Max. initial | Subject mated contacts assembled in housing to closed circuit of 10 mA max. at open circuit voltage of 20 mV max. |
| Insulation Resistance | 1000 M Min. | Measure by applying test potential between the adjacent contacts, and between the contacts and ground in the mated connector. MIL-STD-202, Method 302, Condition B (100 V DC10%). |
| Dielectric Strength | Connector must withstand test potential of 500 V AC for 1 minute. Current leakage must be 1.0 mA max. | Measure by applying test potential between the adjacent contacts, and between the contacts and ground in the mated connector. MIL-STD-202, Method 301. |
| Durability (Repeated Mating/Unmating) | Contact Resistance: 150 m Max. after testing. Mate and unmate connector for 5000 cycles. | Completed mating/unmating tests. |
| Temperature Rise | 30C Max. | Carry rated current load. 0.3A per contact. (UL498) |
| Vibration Sinusoidal Low Frequency | No electrical discontinuity greater than 1 s. | MIL-STD-202, Method 204, Condition D. |
| Shock | No electrical discontinuity greater than 1 s. | MIL-STD-202, Method 213, Condition A. |
| Solderability | Connectors solderability can meet MIL-STD-202F standard. Finish shall be free of contaminants. | N/A |
| Resistance to Solder Heat (Wave Soldering) | Preheat: Increase in temperature not to exceed 4 per second. Final preheat temperature will be within 125 of solder temperature. Soldering: Device leads will be exposed to solder wave at 250 for a maximum of 5 seconds. Cool Down: Cool down in ambient air at approximately 20 to 25. | N/A |
| Resistance to Solder Heat (Infrared Reflow) | Preheat: Increase in temperature not to exceed 4 per second. Soldering: Maximum allowable time above reflow temperature of 183 is 90 seconds. Maximum temperature in this interval is 260, not to exceed 10 seconds. Cool Down: Cool down shall not exceed 6 per second. | N/A |
| Cleaning | Connectors resist to cleaning process. Aqueous Cleaning: Three cycles; each cycle consisting of a maximum of one minute exposure to 54 to 66 demineralized tap water at a maximum pressure of 30 psi; followed by air drying for 60 to 90 seconds at 93 to 121. | N/A |
2510131431_hanxia-HX-SD-CARD-11P_C19189040.pdf
Send RFQ
Stock:
MOQ:
