Robust hanxia HX MICRO SIM 6 1P H1.5 connector suitable for electronic devices requiring SIM card interfacing
Specifications
Operating Temperature:
-40℃~+70℃
Card Connection Mode:
自弹式
Height Above Board:
1.5mm
Connector Type:
卡座
Card Type:
MicroSIM卡
Mfr. Part #:
HX MICRO SIM 6+1P H1.5
Package:
SMD
Model Number:
HX MICRO SIM 6+1P H1.5
Introduction
Product Overview
This document specifies the characteristics and test methods for the HX MICRO SIM 6+1P H1.5 connector, designed and manufactured by Shenzhen Hanxia Electronic Co., Ltd. It is a Micro SIM card connector with a 6+1 pin configuration, suitable for various electronic applications requiring reliable data and power connections.
Product Attributes
- Brand: Shenzhen Hanxia Electronic Co., Ltd.
- Origin: China
- Material: High-temp thermoplastic, Stainless Steel, Copper Alloy
- Color: Black
- Certifications: RoHS compliant
Technical Specifications
| Item | Description | Material | Finish | Dimensions (L x W x H) | Weight | Durability | Operating Temperature | Operating Humidity | Contact Resistance | Insulation Resistance | Switch Resistance |
|---|---|---|---|---|---|---|---|---|---|---|---|
| Housing | High-temp thermoplastic UL94V-0 | Thermoplastic | N/A | 15.75mm x 17.17mm x 1.50mm | Approx 0.40.1g | 1500 cycles min. | -20'C to +70'C | 10% to 95% RH | 500m max | >100M/500V DC | 150m |
| Contact | Copper Alloy | Gold plated | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A |
| Coil Spring | Stainless Steel | Gold plated | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A |
| Heart Cam | Stainless Steel | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A |
Soldering Characteristics
| Method | Temperature | Time |
|---|---|---|
| Vapor Phase | 215'C | 30 sec. Max |
| IR Reflow | 250'C | 5 sec. Max |
| Manual Soldering | 370'C | 3 sec. Max |
2510131431_hanxia-HX-MICRO-SIM-6-1P-H1-5_C19188979.pdf
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