Compact and hanxia HX MICRO SIM 6P H1.35 SIM card holder suitable for various PCB panel applications
Specifications
Operating Temperature:
-40℃~+70℃
Card Connection Mode:
自弹式
Height Above Board:
1.35mm
Connector Type:
卡座
Card Type:
MicroSIM卡
Mfr. Part #:
HX MICRO SIM 6P H1.35
Package:
SMD
Model Number:
HX MICRO SIM 6P H1.35
Introduction
Product Overview
This specification details the characteristics and testing methods for the HX MICRO SIM 6P H1.35 connector, designed and manufactured by Shenzhen Hanxia Electronic Co., Ltd. It is a SIM card holder designed for specific PCB/panel layouts and adheres to RoHS material requirements.
Product Attributes
- Brand: HX
- Origin: Shenzhen, China
- Material: Compliant with RoHS directive.
- Certifications: UL498 (mentioned in Temperature Rise specification)
Technical Specifications
| Item | Requirements | Test Methods |
| Product Confirmation | Product shall be conforming to the requirements of applicable product drawing. Visually, dimensions and functionally inspected per applicable product drawing. | Visually, dimensions and functionally inspected per applicable product drawing. |
| Contact resistance (Low Level) | 100 m Max. initial | Subject mated contacts assembled in housing to closed circuit of 10 mA max. at open circuit voltage of 20 mV max. |
| Insulation resistance | 1000 M Min. | Measure by applying test potential between the adjacent contacts, and between the contacts and ground in the mated connector. MIL-STD-202, Method 302, Condition B (100 V DC10%). |
| Dielectric Strength | 500 V AC for 1 minute. Current leakage must be 1.0 mA max. | Measure by applying test potential between the adjacent contacts, and between the contacts and ground in the mated connector. MIL-STD-202, Method 301. |
| Durability (Repeated Mating/Unmating) | Contact Resistance: 100 m Max. after testing | Mate and unmate connector for 3000 cycles. |
| Temperature rise | 30C Max. | Carry rated current load. 0.3A per contact. (UL498) |
2510131431_hanxia-HX-MICRO-SIM-6P-H1-35_C19188977.pdf
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