Connector product hanxia HX NANO SIM 7P H1.37 nano sim card holder with environmental and provisions
Manufacturer:
hanxia
Description:
Card Connector NANO SIM Push-Push Surface Mount
Category:
PC Card Sockets/PC Card Sockets
Specifications
Operating Temperature:
-40℃~+70℃
Card Connection Mode:
自弹式
Height Above Board:
1.37mm
Connector Type:
卡座
Card Type:
NanoSIM卡
Mfr. Part #:
HX NANO SIM 7P H1.37
Package:
SMD
Model Number:
HX NANO SIM 7P H1.37
Introduction
Product Overview
This product specification details the characteristics and test methods for connector products designed and manufactured by Shenzhen Hanxia Electronic Co., Ltd. It covers scope, reference documents, features, dimensions, environmental requirements, performance, and quality assurance provisions.
Product Attributes
- Brand: HX
- Origin: Shenzhen, China
- Material: Conforms to RoHS directive requirements.
- Certifications: UL498 (implied for temperature rise)
Technical Specifications
| Part No. | Product Name | Rev. | Page No. | SCOPE | REFERENCE DOCUMENTS | FEATURE & DIMENSIONS | MATERIAL | MECHANICAL & ELECTRICAL CHARACTERISTIC | PACKAGING | MARKING | TRANSPORTATION | STORAGE | ENVIRONMENTAL | PERFORMANCE AND TEST DESCRIPTION | QUALITY ASSURANCE PROVISIONS | PERFORMANCE REQUIREMENTS | TEST SEQUENCE |
| HX NANO SIM 7P H1.37 | NANO SIM Card Holder | A/0 | 1/8 | This product specification specifies the characteristics and test methods of the connector products designed and manufactured by the Company. | MIL-STD-1344A, MIL-STD-202F, EIA364, JIS C 0051, MIL-G-45204C, IEC-512-3, QQ-N-290A, MIL-P-81728A, MIL-T-10727B, UL498, EN/ISO5961, EN1122, EN13346, EPA3052 | PRODUCT DIMENSION: Refer to customer drawing. PCB/PANEL LAYOUT: Refer to customer drawing. | Harmful material can follow the requirement of RoHS. | Refer to Table I. | Packaged according to purchase order requirements. Tray or carrier tape to meet proper specification per purchase order. Container and packaging specification shown in customer drawing. Reel packaging specified. | Manufacturers name, industry recognized logo, or customer approved marks. | Any vehicle, moisture-proof, no mechanical damage. | Temperature: -40~+70, Relative humidity: 80%, Not to storage in corrosive environments. Re-qualification test after 6 months. | SOLDERABILITY: Meets MIL-STD-202F. RESISTANCE TO SOLDER HEAT: Wave Soldering (Preheat 4/sec, Soldering 250/5s, Cool Down to 20-25). INFRARED REFLOW (Preheat 4/sec, Soldering 183/90s max, 260/10s max, Cool Down 6/sec). CLEANING: Resists cleaning process. Aqueous Cleaning: 3 cycles (1 min @ 54-66 demineralized water, 60-90s air dry @ 93-121). | Product is designed to meet electrical, mechanical, and environmental performance requirements specified in Table I. Test Condition: Ambient environmental conditions. Sample Selection: Random from current production, pre-conditioned with 10 cycles durability, 5 samples per group. Test Sequence: As shown in Table II. | Company is responsible for the quality of the part as it is delivered to customer. Failing lots will be return or other supplier corrective action. | TABLE I: Contact resistance (100 m Max. initial), Insulation resistance (1000 M Min.), Dielectric Strength (500 V AC/1 min, 1.0 mA max.), Durability (Contact Resistance: 150 m Max. after 5000 cycles), Temperature rise (30C Max. @ 0.3A per contact), Vibration (No electrical discontinuity greater then 1 s). | TABLE II: Product Qualification Test Sequence. |
2410121352_hanxia-HX-NANO-SIM-7P-H1-37_C19189031.pdf
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