HMTCONN HMT NANO 1306 High Temperature Thermoplastic SIM Card Connector with Copper Alloy Terminals
Specifications
Mfr. Part #:
HMT-NANO-1306
Package:
SMD
Model Number:
HMT-NANO-1306
Introduction
Product Overview
This product is a high-temperature thermoplastic SIM card connector designed for Micro SIM and Nano SIM cards. It features a robust construction with gold-plated terminals and a stainless steel shell, ensuring reliable performance in a wide operating temperature range. The connector includes a card detect switch for added functionality.
Product Attributes
- Brand: Shenzhen Huamingtong Electronics Co., Ltd
- Origin: China
- Housing Material: High Temperature Thermoplastic UL94V-0
- Terminal Material: Copper Alloy
- Shell Material: Stainless Steel
- Color: Black
- Plating: AU/Ni, Gold on Contact Area and Solder Tails
Technical Specifications
| Part Name | Description | Material | Thickness (mm) | Plating |
|---|---|---|---|---|
| BASE INSULATOR | Housing | LCP+GF30% | ||
| TERMINAL | C5210-EH | 0.12 | Gold on Contact Area and Solder Tails | |
| SHELL | SUS304-H | 0.15 | AU/Ni | |
| Peg | Gold on Solder Tails |
| Specification | Value |
|---|---|
| Rated Current | 0.5A |
| Rated Voltage | 50V |
| Contact Resistance | 80m MAX |
| Insulation Resistance | 100M MIN (100V DC) |
| Dielectric Withstanding Voltage | 100V AC |
| Solder Ability | 2455C, 50.5s |
| Operating Temperature | -40C ~ +85C |
| Operating Humidity | 80% R.H MAX |
| Card Compatibility | Micro SIM, Nano SIM |
| Card Detect Switch | Yes |
2512121540_HMTCONN-HMT-NANO-1306_C53121341.pdf
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