electrical connector HOAUC HYCW63F-BTB2X20-065B with black LCP housing gold plated copper alloy contacts
Manufacturer:
HOAUC
Description:
0.35mm 2 40P -35℃~+85℃ 4A Surface Mount,Vertical SMD Arrays, Edge Type, Mezzanine (Board to Board) RoHS
Category:
Arrays, Edge Type, Mezzanine (Board to Board)/Arrays, Edge Type, Mezzanine (Board to Board)
Specifications
Voltage Rating:
30V
Pitch:
0.35mm
Number Of Rows:
2
Number Of Pins:
40P
Operating Temperature:
-35℃~+85℃
Current Rating:
4A
Mounting Type:
立贴
Mfr. Part #:
HYCW63F-BTB2X20-065B
Package:
SMD
Model Number:
HYCW63F-BTB2X20-065B
Introduction
Product Overview
This product features power and signal contacts within a black LCP housing, designed for robust electrical connections. It is suitable for applications requiring reliable performance under specified voltage, current, and temperature conditions, with gold plating over nickel for enhanced conductivity and durability.
Product Attributes
- Housing Material: LCP
- Housing Color: Black
- Certification: UL 94 V-0
- Contact Material: Copper Alloy
- Contact Plating: Gold Plating Over Nickel
- Carrier Tape Material: Polyester
- Cover Tape Material: PS
- Packaging: Embossed Carrier Tape, Reel
Technical Specifications
| Specification | Value |
|---|---|
| Voltage | 30V AC/DC |
| Current (Signal Contact) | 0.3A |
| Current (Power Contact) | 4A |
| Operation Temperature | -35C to 85C |
| Contact Resistance (Signal Contact) | 50m |
| Contact Resistance (Power Contact) | 30m |
| Insulation Resistance | 50M MIN Initial |
| Dielectric Withstanding Voltage | 100V AC for one minute |
| Durability | 30 Cycles |
| IR Reflow Cycle | 2 Cycles Max. |
| Recommended Reflow Temperature Profile | Using Lead-Free Solder Paste |
| Mating Height | 8.270.10 mm |
| PCB Layout Dimensions | Refer to diagram (e.g., 10.360.20, 10.150.10) |
| Metal Dimensions (Thickness) | 0.08 mm |
| Part Number | HYCW63F-BTB2X20-065B, HYC-2511201655 |
| Reel Quantity | 15000 Connectors Per Reel |
2511281600_HOAUC-HYCW63F-BTB2X20-065B_C53058932.pdf
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