FPC connector HRS FH55-22S-0.5SH offering GSSG layout and high speed transmission up to 16 plus Gbps
Product Overview
The HIROSE FH55/FH55M Series is a 0.4/0.5mm pitch, 1.5mm height, bottom contact FPC connector featuring a front flip design for high-speed signal transmission. It supports speeds up to 16+ Gbps with a GSSG layout and offers impedance-matched contact design for enhanced performance. The fully enclosed molded structure and flip-lock system ensure reliable FPC security and ease of use. Compatible with 0.3mm thick FPC, it supports automatic mounting and is halogen-free.
Product Attributes
- Brand: HIROSE
- Series: FH55/FH55M
- Contact Pitch: 0.4mm / 0.5mm
- Height: 1.5mm
- Contact Type: Bottom Contact
- Actuation: Front Flip Design
- Material (Insulator): LCP (UL94V-0)
- Material (Contact): Phosphorous Bronze (Gold Plating)
- Material (Retention Tab): Brass (Pure Tin Reflow Plating)
- Certifications: Halogen-free (IEC 61249-2-21 compliant)
Technical Specifications
| Specification | Details |
|---|---|
| High-Speed Transmission | Up to 16+ Gbps (GSSG layout) |
| Impedance | 50ps rise time (20-80%): 9015 (Differential) |
| Rated Current | 0.5A (0.5mm Pitch), 0.4A (0.4mm Pitch) |
| Operating Temperature | -55 to +85 |
| Operating Humidity | RH 90% Max. (No Condensation) |
| Rated Voltage | 50Vrms AC (0.5mm Pitch), 40Vrms AC (0.4mm Pitch) |
| Storage Temperature | -10 to +50 |
| Storage Humidity | RH 90% Max. (No Condensation) |
| Compatible FPC/FFC Thickness | t=0.3 0.03 mm |
| Insulation Resistance | Min. 500M (at 100V DC) |
| Withstanding Voltage | 150Vms AC (0.5mm pitch) / 120Vms AC (0.4mm pitch) for 1 min. |
| Contact Resistance | Max. 100m (Includes FPC conductor resistance, at 1mA) |
| Mating Durability | 20 times |
| Vibration Resistance | No electrical discontinuity of 1s or more |
| Shock Resistance | No electrical discontinuity of 1s or more |
| Steady-State Moisture Resistance | Contact Resistance: Max. 100m, Insulation Resistance: Min. 50M (96 hours at +40, 90-95% RH) |
| Temperature Cycle | Contact Resistance: Max. 100m, Insulation Resistance: Min. 50M (5 cycles) |
| Solder Heat Resistance | No deformation (Reflow: peak 250 Max., Soldering iron: 35010 for 5 sec) |
| Transmission Standards Support | USB4 Gen.2 (10+Gbps), PCI Express Gen.4 (16+Gbps), HDMI 1.4a Embedded Display-Port 1.3, Serial ATA Gen. 3 (Status may vary with FPC specification) |
| Automatic Mounting | Available via emboss packaging (5,000 pcs/reel) |
| Part Number Structure | FH55(M)-[No. of Pos.]S-[Pitch]SH |
| Available Positions (0.5mm Pitch) | 10 to 61 positions |
| Available Positions (0.4mm Pitch) | 10 to 79 positions |
2410121526_HRS-FH55-22S-0-5SH_C5182313.pdf