0.4MM BTB Connector Featuring 1.5MM Mate Height and LCP Black Glass Material JMEconn 5001-BM0440-15-00
Manufacturer:
JMEconn
Description:
40 Position Board to Board Connector Surface Mount,P=0.4mm Gold
Category:
Arrays, Edge Type, Mezzanine (Board to Board)/Board Spacers, Stackers (Board to Board)
Specifications
Pitch:
0.4mm
System Fit Height:
1.5mm;2mm;2.5mm;3mm;3.5mm;4mm
Number Of Pins:
40P
Mounting Type:
立贴
Contact Plating:
金
Contact Material:
磷青铜
Mfr. Part #:
5001-BM0440-15-00
Package:
SMD,P=0.4mm
Model Number:
5001-BM0440-15-00
Introduction
Product Overview
This series of 0.4MM BTB connectors offers male and female configurations with varying pin mate heights (1.5H, 2.0H, 2.5H, 3.0H, 3.5H, 4.0H). Designed for reliable electrical connections, these connectors feature gold flash plating over nickel underplating for enhanced durability and conductivity. They are suitable for applications requiring a mating height of 1.5mm and are constructed from LCP Black Glass:30% for robust performance.
Product Attributes
- Brand: Not specified
- Origin:
- Material: LCP Black Glass:30%
- Color: Black
- Certifications: Not specified
Technical Specifications
| Part Name | Part Number | Mate Height | Material | Finish | Rated Current | Contact Resistance | Insulation Resistance | Withstanding Voltage | Operation Temperature | Durability | Q'TY |
| 0.4MM BTB 1.5H Male Conn | BM04**150* | 1.5mm | LCP Black Glass:30% | GOLD FLASH OVER Ni 50~90u"UNDERPLATING | 0.5A | 90 m Max. | 50 M min. | 100 VAC for 1 MINUTE MIN. | -35 TO +85 | 30 CYCLES | 1 |
| 0.4MM BTB 1.5H Female Conn | BF04**150* | 1.5mm | LCP Black Glass:30% | GOLD FLASH OVER Ni 50~90u"UNDERPLATING | 0.5A | 90 m Max. | 50 M min. | 100 VAC for 1 MINUTE MIN. | -35 TO +85 | 30 CYCLES | 1 |
| 0.4MM BTB 2.0H Female Conn | BF04**200* | 2.0mm | LCP Black Glass:30% | GOLD FLASH OVER Ni 50~90u"UNDERPLATING | 0.5A | 90 m Max. | 50 M min. | 100 VAC for 1 MINUTE MIN. | -35 TO +85 | 30 CYCLES | 1 |
| 0.4MM BTB 2.5H Female Conn | BF04**250* | 2.5mm | LCP Black Glass:30% | GOLD FLASH OVER Ni 50~90u"UNDERPLATING | 0.5A | 90 m Max. | 50 M min. | 100 VAC for 1 MINUTE MIN. | -35 TO +85 | 30 CYCLES | 1 |
| 0.4MM BTB 3.0H Female Conn | BF04**300* | 3.0mm | LCP Black Glass:30% | GOLD FLASH OVER Ni 50~90u"UNDERPLATING | 0.5A | 90 m Max. | 50 M min. | 100 VAC for 1 MINUTE MIN. | -35 TO +85 | 30 CYCLES | 1 |
| 0.4MM BTB 3.5H Female Conn | BF04**350* | 3.5mm | LCP Black Glass:30% | GOLD FLASH OVER Ni 50~90u"UNDERPLATING | 0.5A | 90 m Max. | 50 M min. | 100 VAC for 1 MINUTE MIN. | -35 TO +85 | 30 CYCLES | 1 |
| 0.4MM BTB 4.0H Female Conn | BF04**400* | 4.0mm | LCP Black Glass:30% | GOLD FLASH OVER Ni 50~90u"UNDERPLATING | 0.5A | 90 m Max. | 50 M min. | 100 VAC for 1 MINUTE MIN. | -35 TO +85 | 30 CYCLES | 1 |
2505071655_JMEconn-5001-BM0440-15-00_C48688766.pdf
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