0.4mm Pitch Board to Board Connectors with Reinforced LCP Insulator JMEconn 5001 BF0460 40 00 Series
Manufacturer:
JMEconn
Description:
60 Position Board to Board Connector Surface Mount,P=0.4mm Gold
Category:
Arrays, Edge Type, Mezzanine (Board to Board)/Arrays, Edge Type, Mezzanine (Board to Board)
Specifications
Pitch:
0.4mm
System Fit Height:
4mm
Number Of Pins:
60P
Contact Plating:
金
Mounting Type:
立贴
Contact Material:
磷青铜
Mfr. Part #:
5001-BF0460-40-00
Package:
SMD,P=0.4mm
Model Number:
5001-BF0460-40-00
Introduction
Product Overview
This document details the specifications for 0.4MM BTB (Board-to-Board) connectors, available in male and female configurations with various mating heights (1.5H, 2.0H, 2.5H, 3.0H, 3.5H, 4.0H). These connectors are designed for high-density applications requiring reliable electrical connections between PCBs. They feature a LCP (Liquid Crystal Polymer) insulator with glass fiber reinforcement and a gold flash over nickel underplating for excellent conductivity and durability.
Product Attributes
- Brand: Not specified
- Origin: (Shenzhen Wenzhang Jimei Technology Co., Ltd.)
- Material: LCP Black Glass:30% (Insulator), C5191H (Male Pin), C5240ESH (Female Pin)
- Color: Black (Insulator)
- Plating: GOLD FLASH OVERALL Ni 50~90u"UNDERPLATING
- Certifications: Not specified
Technical Specifications
| Part Name | Part Number | Mate Height | Material (Insulator) | Material (Contact) | Finish | Rated Current | Contact Resistance | Insulation Resistance | Withstanding Voltage | Operation Temperature | Durability | Normal Insert Force |
| 0.4MM BTB 1.5H Male Conn | BM04**150* | 1.5mm | LCP Black Glass:30% | C5191H | GOLD FLASH OVERALL Ni 50~90u"UNDERPLATING | 0.5A | 90 m Max. | 50 M min. | 100 VAC for 1 MINUTE MIN. | -35 to +85 | 30 CYCLES | 5N MAX |
| 0.4MM BTB 1.5H Female Conn | BF04**150* | 1.5mm | LCP Black Glass:30% | C5240ESH | GOLD FLASH OVERALL Ni 50~90u"UNDERPLATING | 0.5A | 90 m Max. | 50 M min. | 100 VAC for 1 MINUTE MIN. | -35 to +85 | 30 CYCLES | 5N MAX |
| 0.4MM BTB 2.0H Female Conn | BF04**200* | 2.0mm | LCP Black Glass:30% | C5240ESH | GOLD FLASH OVERALL Ni 50~90u"UNDERPLATING | 0.5A | 90 m Max. | 50 M min. | 100 VAC for 1 MINUTE MIN. | -35 to +85 | 30 CYCLES | 5N MAX |
| 0.4MM BTB 2.5H Female Conn | BF04**250* | 2.5mm | LCP Black Glass:30% | C5240ESH | GOLD FLASH OVERALL Ni 50~90u"UNDERPLATING | 0.5A | 90 m Max. | 50 M min. | 100 VAC for 1 MINUTE MIN. | -35 to +85 | 30 CYCLES | 5N MAX |
| 0.4MM BTB 3.0H Female Conn | BF04**300* | 3.0mm | LCP Black Glass:30% | C5240ESH | GOLD FLASH OVERALL Ni 50~90u"UNDERPLATING | 0.5A | 90 m Max. | 50 M min. | 100 VAC for 1 MINUTE MIN. | -35 to +85 | 30 CYCLES | 5N MAX |
| 0.4MM BTB 3.5H Female Conn | BF04**350* | 3.5mm | LCP Black Glass:30% | C5240ESH | GOLD FLASH OVERALL Ni 50~90u"UNDERPLATING | 0.5A | 90 m Max. | 50 M min. | 100 VAC for 1 MINUTE MIN. | -35 to +85 | 30 CYCLES | 5N MAX |
| 0.4MM BTB 4.0H Female Conn | BF04**400* | 4.0mm | LCP Black Glass:30% | C5240ESH | GOLD FLASH OVERALL Ni 50~90u"UNDERPLATING | 0.5A | 90 m Max. | 50 M min. | 100 VAC for 1 MINUTE MIN. | -35 to +85 | 30 CYCLES | 5N MAX |
2505071655_JMEconn-5001-BF0460-40-00_C48688846.pdf
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