0.4mm Pitch BTB Connectors Featuring JMEconn 5001 BF0450 20 00 for Demanding Electronic Applications
Manufacturer:
JMEconn
Description:
50 Position Board to Board Connector Surface Mount,P=0.4mm Gold
Category:
Arrays, Edge Type, Mezzanine (Board to Board)/Arrays, Edge Type, Mezzanine (Board to Board)
Specifications
System Fit Height:
2mm
Pitch:
0.4mm
Number Of Pins:
50P
Contact Plating:
金
Mounting Type:
立贴
Contact Material:
磷青铜
Mfr. Part #:
5001-BF0450-20-00
Package:
SMD,P=0.4mm
Model Number:
5001-BF0450-20-00
Introduction
0.4MM BTB Connectors
A series of 0.4mm pitch BTB (Board-to-Board) connectors designed for high-density applications. Available in male and female configurations with various mating heights (1.5H, 2.0H, 2.5H, 3.0H, 3.5H, 4.0H) for flexible design solutions. These connectors offer reliable electrical performance and robust mechanical characteristics, suitable for demanding electronic assemblies.
Product Attributes
- Brand: Not specified
- Origin: (Shenzhen Wenzhou Jimei Technology Co., Ltd.)
- Material: LCP (Liquid Crystal Polymer) with Glass Fiber reinforcement
- Color: Black
- Certifications: Not specified
Technical Specifications
| Part Name | Type | Mate Height (mm) | Pitch (mm) | Rated Current (A) | Contact Resistance (m) | Insulation Resistance (M) | Withstanding Voltage (VAC) | Durability (Cycles) | Operation Temperature (C) | Material | Finish | Pin Spacing (mm) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BM04**150* | Male | 1.5 | 0.4 | 0.5 | 90 Max. | 50 min. | 100 | 30 | -35 to +85 | LCP Black Glass:30% | GOLD FLASH OVER Ni 50~90u"UNDERPLATING | 5.08 |
| BF04**150* | Female | 1.5 | 0.4 | 0.5 | 90 Max. | 50 min. | 100 | 30 | -35 to +85 | LCP Black Glass:30% | GOLD FLASH OVER Ni 50~90u"UNDERPLATING | 5.08 |
| BF04**200* | Female | 2.0 | 0.4 | 0.5 | 90 Max. | 50 min. | 100 | 30 | -35 to +85 | LCP Black Glass:30% | GOLD FLASH OVER Ni 50~90u"UNDERPLATING | 5.08 |
| BF04**250* | Female | 2.5 | 0.4 | 0.5 | 90 Max. | 50 min. | 100 | 30 | -35 to +85 | LCP Black Glass:30% | GOLD FLASH OVER Ni 50~90u"UNDERPLATING | 5.08 |
| BF04**300* | Female | 3.0 | 0.4 | 0.5 | 90 Max. | 50 min. | 100 | 30 | -35 to +85 | LCP Black Glass:30% | GOLD FLASH OVER Ni 50~90u"UNDERPLATING | 5.08 |
| BF04**350* | Female | 3.5 | 0.4 | 0.5 | 90 Max. | 50 min. | 100 | 30 | -35 to +85 | LCP Black Glass:30% | GOLD FLASH OVER Ni 50~90u"UNDERPLATING | 5.08 |
| BF04**400* | Female | 4.0 | 0.4 | 0.5 | 90 Max. | 50 min. | 100 | 30 | -35 to +85 | LCP Black Glass:30% | GOLD FLASH OVER Ni 50~90u"UNDERPLATING | 5.08 |
2505071655_JMEconn-5001-BF0450-20-00_C48688793.pdf
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