Compact low profile 2.0mm pitch connector JST PHR-6 designed for pcb internal wire connection needs
Product Description
This is a thin, low-profile 2.0mm pitch connector, 8.0mm in height after mounting and 4.5mm in width. It is designed to meet the demand for high-density connection of internal wires to printed circuit boards. It is compact, highly reliable, and low in cost. Key features include reliable contact, a fully shrouded header, a printed circuit board retention mechanism, and a surface mount model (SMT).
Product Attributes
- Brand: JST
- Compliance: RoHS
- Certifications: UL Recognized E60389, CSA Certified LR20812, R75087
Technical Specifications
| Component Type | Model No. | Circuits | Dimensions (mm) A | Dimensions (mm) B | Material / Finish | Q'ty / Box/Reel | Notes |
| Contact | SPH-002T-P0.5S | - | - | - | Phosphor bronze, tin-plated (reflow treatment) | 8,000 / reel | Standard type |
| Contact | SPH-002T-P0.5L | - | - | - | Phosphor bronze, tin-plated (reflow treatment) | 10,000 / reel | Low insertion force type |
| Contact | SPH-004T-P0.5S | - | - | - | Phosphor bronze, tin-plated (reflow treatment) | 8,000 / reel | - |
| Receptacle Housing | PHR-2 | 2 | 2.0 | 5.8 | PA 66, UL94V-0, natural (white) | 1,000 / box | - |
| Receptacle Housing | PHR-3 | 3 | 4.0 | 7.8 | PA 66, UL94V-0, natural (white) | 1,000 / box | - |
| Receptacle Housing | PHR-16 | 16 | 30.0 | 33.8 | PA 66, UL94V-0, natural (white) | 1,000 / box | - |
| Header (Through-hole) | PHR-2 | 2 | 2.0 | 5.8 | Post: Brass, copper-undercoated, tin-plated (reflow treatment) Wafer: PA 66, UL94V-0, natural (white) | 1,000 / box | - |
| Header (Through-hole) | PHR-16 | 16 | 30.0 | 33.8 | Post: Brass, copper-undercoated, tin-plated (reflow treatment) Wafer: PA 66, UL94V-0, natural (white) | 1,000 / box | - |
| Header (Top Entry) | S2B-PH-K-S | 2 | 2.0 | 5.9 | Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA 66, UL94V-0, natural (white) | 1,000 / box | - |
| Header (Top Entry) | S16B-PH-K-S | 16 | 30.0 | 33.9 | Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA 66, UL94V-0, natural (white) | 250 / box | - |
| Header (Side Entry) | B2B-PH-K-S | 2 | 2.0 | 5.9 | Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA 66, UL94V-0, natural (white) | 1,000 / box | - |
| Header (Side Entry) | B16B-PH-K-S | 16 | 30.0 | 33.9 | Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA 66, UL94V-0, natural (white) | 250 / box | - |
| Header (Through-hole, Low Insertion Force) | B2B-PH-KL | 2 | 2.0 | 5.9 | Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA 66, UL94V-0, gray | 1,000 / box | (LF)(SN) |
| Header (Through-hole, Low Insertion Force) | B16B-PH-KL | 16 | 30.0 | 33.9 | Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA 66, UL94V-0, gray | 250 / box | (LF)(SN) |
| Header (SMT Type) | B2B-PH-SM4-TB | 2 | 2.0 | 7.95 | Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA, UL94V-0, natural (ivory) Solder tab: Brass, copper-undercoated, tin-plated (reflow treatment) | 1,000 / reel | (LF)(SN) |
| Header (SMT Type) | B16B-PH-SM4-TB | 16 | 30.0 | 35.95 | Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA, UL94V-0, natural (ivory) Solder tab: Brass, copper-undercoated, tin-plated (reflow treatment) | 1,000 / reel | (LF)(SN) |
| Header (SMT Type) | S2B-PH-SM4-TB | 2 | 2.0 | 7.9 | Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA, UL94V-0, natural (ivory) Solder tab: Brass, copper-undercoated, tin-plated (reflow treatment) | 1,000 / reel | - |
| Header (SMT Type) | S15B-PH-SM4-TB | 15 | 28.0 | 33.9 | Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA, UL94V-0, natural (ivory) Solder tab: Brass, copper-undercoated, tin-plated (reflow treatment) | 1,000 / reel | - |
Specifications
Current rating: 2A AC, DC (AWG #24)
Voltage rating: 100V AC, DC
Temperature range: -25C to +85C (including temperature rise in applying electrical current)
Contact resistance: Initial value/ 10m max. After environmental testing/ 20m max.
Insulation resistance: 1,000M min.
Withstanding voltage: 800V AC/ minute
Applicable wire: AWG #32 to #24
Applicable PC board thickness: 0.8 to 1.6mm
2304140030_JST-PHR-6_C157952.pdf