compact 2.0mm pitch connector JST PHR-5-Y for high density internal wiring on printed circuit boards
Manufacturer:
JST
Description:
Connector Housing 5 Position 2mm Pitch Single Row PH Series PA66 -25℃~+85℃
Category:
Arrays, Edge Type, Mezzanine (Board to Board)/Rectangular Connector Housings
Specifications
Flame Retardant Rating:
UL94V-0
Pitch:
2mm
Colour:
黄色
Number Of Rows:
1
With Wings:
不带翅
Reference Series:
PH
Operating Temperature:
-25℃~+85℃
Plastic Material:
PA66
Number Of PINs Per Row:
5
Number Of Positions Or Pins:
1x5P
With Locker:
不带锁扣
Row Spacing:
-
Mfr. Part #:
PHR-5-Y
Package:
P=2mm
Model Number:
PHR-5-Y
Introduction
Product Overview
This is a thin, low-profile 2.0mm pitch connector, measuring 8.0mm in height after mounting and 4.5mm in width. It is designed to meet the demand for high-density connection of internal wires to printed circuit boards. It is compact, highly reliable, and low in cost, featuring a reliable contact, fully shrouded header, printed circuit board retention mechanism, and surface mount model (SMT) option.
Product Attributes
- Brand: JST
- Certifications: UL Recognized E60389, Certified LR20812, R75087
- RoHS Compliance: Yes
Technical Specifications
| Part Type | Model No. | Circuits | Dimensions (mm) A | Dimensions (mm) B | Material and Finish | Q'ty / box | Q'ty / reel | Applicable wire (mm) | Applicable wire (AWG) | Insulation O.D. (mm) |
| Contact | SPH-002T-P0.5S | - | - | - | Phosphor bronze, tin-plated (reflow treatment) | - | 8,000 | 0.05 0.22 | 3024 | 0.91.5 |
| Contact | SPH-002T-P0.5L | - | - | - | Phosphor bronze, tin-plated (reflow treatment) | - | 10,000 | 0.08 0.22 | 2824 | 0.81.5 |
| Contact | SPH-004T-P0.5S | - | - | - | Phosphor bronze, tin-plated (reflow treatment) | - | 8,000 | 0.0320.08 | 3228 | 0.50.9 |
| Receptacle Housing | PHR-2 | 2 | 2.0 | 5.8 | PA 66, UL94V-0, natural (white) | 1,000 | - | - | - | - |
| Receptacle Housing | PHR-3 | 3 | 4.0 | 7.8 | PA 66, UL94V-0, natural (white) | 1,000 | - | - | - | - |
| Receptacle Housing | PHR-16 | 16 | 30.0 | 33.8 | PA 66, UL94V-0, natural (white) | 1,000 | - | - | - | - |
| Through-hole header (Top entry) | B2B-PH-K-S | 2 | 2.0 | 5.9 | Post: Brass, copper-undercoated, tin-plated (reflow treatment) Wafer: PA 66, UL94V-0, natural (white) | 1,000 | - | - | - | - |
| Through-hole header (Top entry) | B3B-PH-K-S | 3 | 4.0 | 7.9 | Post: Brass, copper-undercoated, tin-plated (reflow treatment) Wafer: PA 66, UL94V-0, natural (white) | 1,000 | - | - | - | - |
| Through-hole header (Top entry) | B16B-PH-K-S | 16 | 30.0 | 33.9 | Post: Brass, copper-undercoated, tin-plated (reflow treatment) Wafer: PA 66, UL94V-0, natural (white) | 250 | - | - | - | - |
| Through-hole header (Side entry) | S2B-PH-K-S | 2 | 2.0 | 5.9 | Post: Brass, copper-undercoated, tin-plated (reflow treatment) Wafer: PA 66, UL94V-0, natural (white) | 1,000 | - | - | - | - |
| Through-hole header (Side entry) | S3B-PH-K-S | 3 | 4.0 | 7.9 | Post: Brass, copper-undercoated, tin-plated (reflow treatment) Wafer: PA 66, UL94V-0, natural (white) | 1,000 | - | - | - | - |
| Through-hole header (Side entry) | S16B-PH-K-S | 16 | 30.0 | 33.9 | Post: Brass, copper-undercoated, tin-plated (reflow treatment) Wafer: PA 66, UL94V-0, natural (white) | 250 | - | - | - | - |
| Through-hole header (Top entry, Low insertion force) | B2B-PH-KL | 2 | 2.0 | 5.9 | Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA 66, UL94V-0, gray | 1,000 | - | - | - | - |
| Through-hole header (Top entry, Low insertion force) | B16B-PH-KL | 16 | 30.0 | 33.9 | Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA 66, UL94V-0, gray | 250 | - | - | - | - |
| SMT header (Top entry) | B2B-PH-SM4-TB | 2 | 2.0 | 7.95 | Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA, UL94V-0, natural (ivory) Solder tab: Brass, copper-undercoated, tin-plated (reflow treatment) | 1,000 | - | - | - | - |
| SMT header (Top entry) | B16B-PH-SM4-TB | 16 | 30.0 | 35.95 | Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA, UL94V-0, natural (ivory) Solder tab: Brass, copper-undercoated, tin-plated (reflow treatment) | 1,000 | - | - | - | - |
| SMT header (Side entry) | S2B-PH-SM4-TB | 2 | 2.0 | 7.9 | Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA, UL94V-0, natural (ivory) Solder tab: Brass, copper-undercoated, tin-plated (reflow treatment) | 1,000 | - | - | - | - |
| SMT header (Side entry) | S15B-PH-SM4-TB | 15 | 28.0 | 33.9 | Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA, UL94V-0, natural (ivory) Solder tab: Brass, copper-undercoated, tin-plated (reflow treatment) | 1,000 | - | - | - | - |
Specifications
Current rating: 2A AC, DC (AWG #24)
Voltage rating: 100V AC, DC
Temperature range: -25C to +85C (including temperature rise in applying electrical current)
Contact resistance: Initial value/ 10m max. After environmental testing/ 20m max.
Insulation resistance: 1,000M min.
Withstanding voltage: 800V AC/ minute
Applicable wire: AWG #32 to #24
Applicable PC board thickness: 0.8 to 1.6mm
1912111437_JST-PHR-5-Y_C398550.pdf
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