2 millimeter pitch PH connector JST PHR-2-BL compact size with brass copper alloy tin plated contacts
Manufacturer:
JST
Description:
Connector Housing 2 Position 2mm Pitch Single Row PH Series PA66 -25℃~+85℃
Category:
Arrays, Edge Type, Mezzanine (Board to Board)/Rectangular Connector Housings
Specifications
Flame Retardant Rating:
UL94V-0
Pitch:
2mm
Colour:
蓝色
Number Of Rows:
1
With Wings:
不带翅
Reference Series:
PH
Operating Temperature:
-25℃~+85℃
Plastic Material:
PA66
Number Of PINs Per Row:
2
Number Of Positions Or Pins:
1x2P
Row Spacing:
-
With Locker:
不带锁扣
Mfr. Part #:
PHR-2-BL
Package:
P=2mm
Model Number:
PHR-2-BL
Introduction
PH CONNECTOR
This is a thin, low-profile 2.0mm pitch connector, 8.0mm in height after mounting and 4.5mm in width. It is designed to meet the demand for high-density connection of internal wires to printed circuit boards. It is compact, highly reliable, and low in cost, offering reliable contact, a fully shrouded header, and a printed circuit board retention mechanism. Available in Surface Mount (SMT) models.
Product Attributes
- Brand: JST
- Material (Wafer): PA 66, UL94V-0, natural (white/ivory)
- Material (Post): Brass/Copper alloy, copper-undercoated, tin-plated (reflow treatment)
- Material (Solder tab): Brass, copper-undercoated, tin-plated (reflow treatment)
- Certifications: UL Recognized E60389, CSA Certified LR20812, R75087
- RoHS Compliant: Yes
Technical Specifications
| Model Type | Model No. | Circuits | Dimensions (mm) A | Dimensions (mm) B | Q'ty / Box | Material and Finish | Applicable Wire (mm) | Applicable Wire (AWG) | Insulation O.D. (mm) | Q'ty / reel | Notes |
| Contact | SPH-002T-P0.5S | - | - | - | - | Phosphor bronze, tin-plated (reflow treatment) | 0.05 0.22 | 3024 | 0.91.5 | 8,000 | - |
| Contact | SPH-002T-P0.5L | - | - | - | - | Phosphor bronze, tin-plated (reflow treatment) | 0.08 0.22 | 2824 | 0.81.5 | 10,000 | Low insertion force type |
| Contact | SPH-004T-P0.5S | - | - | - | - | Phosphor bronze, tin-plated (reflow treatment) | 0.0320.08 | 3228 | 0.50.9 | - | - |
| Receptacle Housing | PHR-2 | 2 | 2.0 | 5.8 | 1,000 | PA 66, UL94V-0, natural (white) | - | - | - | - | - |
| Receptacle Housing | PHR-16 | 16 | 30.0 | 33.8 | 1,000 | PA 66, UL94V-0, natural (white) | - | - | - | - | - |
| Through-hole Header (Top Entry) | B2B-PH-K-S | 2 | 2.0 | 5.9 | 1,000 | Post: Brass, copper-undercoated, tin-plated (reflow treatment) Wafer: PA 66, UL94V-0, natural (white) | - | - | - | - | - |
| Through-hole Header (Top Entry) | B16B-PH-K-S | 16 | 30.0 | 33.9 | 250 | Post: Brass, copper-undercoated, tin-plated (reflow treatment) Wafer: PA 66, UL94V-0, natural (white) | - | - | - | - | - |
| Through-hole Header (Side Entry) | S2B-PH-K-S | 2 | 2.0 | 5.9 | 1,000 | Post: Brass, copper-undercoated, tin-plated (reflow treatment) Wafer: PA 66, UL94V-0, natural (white) | - | - | - | - | - |
| Through-hole Header (Side Entry) | S16B-PH-K-S | 16 | 30.0 | 33.9 | 250 | Post: Brass, copper-undercoated, tin-plated (reflow treatment) Wafer: PA 66, UL94V-0, natural (white) | - | - | - | - | - |
| Through-hole Header (Top Entry, Low Insertion Force) | B2B-PH-KL | 2 | 2.0 | 5.9 | 1,000 | Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA 66, UL94V-0, gray | - | - | - | - | (LF)(SN) |
| Through-hole Header (Top Entry, Low Insertion Force) | B16B-PH-KL | 16 | 30.0 | 33.9 | 250 | Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA 66, UL94V-0, gray | - | - | - | - | (LF)(SN) |
| Through-hole Header (Side Entry, Low Insertion Force) | S2B-PH-KL | 2 | 2.0 | 5.9 | 1,000 | Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA 66, UL94V-0, gray | - | - | - | - | (LF)(SN) |
| Through-hole Header (Side Entry, Low Insertion Force) | S16B-PH-KL | 16 | 30.0 | 33.9 | 250 | Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA 66, UL94V-0, gray | - | - | - | - | (LF)(SN) |
| SMT Header (Top Entry) | B2B-PH-SM4-TB | 2 | 2.0 | 7.95 | 1,000 | Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA, UL94V-0, natural (ivory) Solder tab: Brass, copper-undercoated, tin-plated (reflow treatment) | - | - | - | - | (LF)(SN) |
| SMT Header (Top Entry) | B16B-PH-SM4-TB | 16 | 30.0 | 35.95 | 1,000 | Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA, UL94V-0, natural (ivory) Solder tab: Brass, copper-undercoated, tin-plated (reflow treatment) | - | - | - | - | (LF)(SN) |
| SMT Header (Side Entry) | S2B-PH-SM4-TB | 2 | 2.0 | 7.9 | 1,000 | Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA, UL94V-0, natural (ivory) Solder tab: Brass, copper-undercoated, tin-plated (reflow treatment) | - | - | - | - | (LF)(SN) |
| SMT Header (Side Entry) | S15B-PH-SM4-TB | 15 | 28.0 | 33.9 | 1,000 | Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA, UL94V-0, natural (ivory) Solder tab: Brass, copper-undercoated, tin-plated (reflow treatment) | - | - | - | - | (LF)(SN) |
General Specifications
| Specification | Value |
| Pitch | 2.0mm |
| Current Rating | 2A AC, DC (AWG #24) |
| Voltage Rating | 100V AC, DC |
| Temperature Range | -25C to +85C |
| Contact Resistance | Initial: 10mmax. After environmental testing: 20mmax. |
| Insulation Resistance | 1,000Mmin. |
| Withstanding Voltage | 800V AC/ minute |
| Applicable PC board thickness | 0.8 to 1.6mm |
2004071209_JST-PHR-2-BL_C495693.pdf
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