2.5mm pitch JST XAP-04V-1-Y connector for high box type applications and resin coated PC boards
Specifications
Pitch:
2.5mm
Flame Retardant Rating:
UL94V-0
Number Of Rows:
1
Colour:
黄色
With Wings:
不带翅
Reference Series:
XA
Operating Temperature:
-25℃~+85℃
Plastic Material:
PA66
Number Of PINs Per Row:
4
Number Of Positions Or Pins:
1x4P
With Locker:
带锁扣
Row Spacing:
-
Mfr. Part #:
XAP-04V-1-Y
Package:
P=2.5mm
Model Number:
XAP-04V-1-Y
Introduction
Product Overview
The JST XA Connector High Box Type is a disconnectable crimp style connector with a 2.5mm pitch. Designed for high box type applications, it features a mounting height of 19.5mm and a thickness of 6.9mm. This connector is specifically intended for use with resin-coated ("potted") PC boards, offering a robust solution for demanding environments.
Product Attributes
- Brand: JST
- Material (Header): Glass-filled PA 66, UL94V-0, natural (ivory)
- Material (Housing): PA 66, UL94V-0, natural (white)
- Material (Contact): Phosphor bronze, tin-plated (reflow treatment)
- Material (Wafer/Post): Copper alloy, copper-undercoated, tin-plated (reflow treatment)
- Certifications: UL Recognized E60389, CSA Certified LR20812
- Compliance: RoHS
Technical Specifications
| Product Type | Model No. | Circuits | Dimensions (mm) A | Dimensions (mm) B | Q'ty / bag / reel | Material | Applicable PC board thickness | Insulation O.D. (mm) |
|---|---|---|---|---|---|---|---|---|
| Header (High box type) | XMS-xxV | 2-15 | 2.5-35.0 | - | 1,000 | Glass-filled PA 66, UL94V-0, natural (ivory) | 1.6mm | - |
| Housing (Standard type) | XAP-xxV-1 | 2-15 | 2.5-35.0 | 7.3-39.8 | 1,000 | PA 66, UL94V-0, natural (white) | - | - |
| Housing (Retainer mountable type) | XARP-xxV | 2-15 | 2.5-35.0 | 9.8-39.8 | 1,000 / 500 | PA 66, UL94V-0, natural (white) | - | - |
| Contact | SXA-001T-P0.6 | - | - | - | 8,000 / reel | Phosphor bronze, tin-plated (reflow treatment) | - | 0.080.33 |
| Wafer (Shrouded header, Without a boss) | BHxxB-XASK | 2-15 | 2.5-35.0 | 7.5-40.0 | 400-100 | Wafer: Glass-filled PA 66, UL94V-0, natural (ivory) | - | - |
| Wafer (Shrouded header, With a boss) | BHxxB-XASK-BN | 2-15 | 2.5-35.0 | 7.5-40.0 | 400-100 | Wafer: Glass-filled PA 66, UL94V-0, natural (ivory) | - | - |
| Wafer (Shrouded header on radial-tape, Without a boss) | BHxxB-XASS-T | 2-8 | 2.5-17.5 | 7.5-22.5 | 1,000-500 | Wafer: Glass-filled PA 66, UL94V-0, natural (ivory) | - | - |
| Wafer (Shrouded header on radial-tape, With a boss) | BHxxB-XASS-BN-T | 2-8 | 2.5-17.5 | 7.5-22.5 | 1,000-500 | Wafer: Glass-filled PA 66, UL94V-0, natural (ivory) | - | - |
General Specifications
| Specification | Value |
|---|---|
| Current rating | 3A AC, DC (AWG #22) |
| Voltage rating | 250V AC, DC |
| Temperature range | -25C to +85C |
| Contact resistance | Initial: 10m max., After environmental testing: 20m max. |
| Insulation resistance | 1,000M min. |
| Withstanding voltage | 1,000V AC/minute |
| Applicable wire | AWG #28 to #22 |
2401301544_JST-XAP-04V-1-Y_C495657.pdf
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