Standard Type Header Connector JST XAP-04V-1 2.5mm Pitch 4 Circuits PA 66 UL94V-0 White
Manufacturer:
JST
Description:
Connector Housing 4 Position 2.5mm Pitch Single Row XA Series PA66 -25℃~+85℃
Category:
Arrays, Edge Type, Mezzanine (Board to Board)/Rectangular Connector Housings
Specifications
Flame Retardant Rating:
UL94V-0
Pitch:
2.5mm
Colour:
白色
Number Of Rows:
1
With Wings:
不带翅
Reference Series:
XA
Operating Temperature:
-25℃~+85℃
Plastic Material:
PA66
Number Of PINs Per Row:
4
Number Of Positions Or Pins:
1x4P
With Locker:
带锁扣
Row Spacing:
-
Mfr. Part #:
XAP-04V-1
Package:
P=2.5mm
Model Number:
XAP-04V-1
Introduction
Product Overview
The JST XA Connector High Box Type is a disconnectable crimp style connector designed for 2.5mm pitch applications. It is specifically engineered for use with resin-coated (potted) PC boards, offering a high box type configuration with a mounting height of 19.5mm and a thickness of 6.9mm. This connector ensures reliable electrical connections with high current and voltage ratings, suitable for a wide temperature range.
Product Attributes
- Brand: JST
- Certifications: UL Recognized E60389, CSA Certified LR20812
- RoHS Compliant: Yes
Technical Specifications
| Type | Model No. | Circuits | Dimensions (mm) A | Dimensions (mm) B | Material | Q'ty / bag | Notes |
| Header (High box type) | XMS-02V to XMS-15V | 2-15 | 2.5 to 35.0 | - | Glass-filled PA 66, UL94V-0, natural (ivory) | 1,000 | With a boss / Without a boss |
| Header (Standard type) | XAP-02V-1 to XAP-15V-1 | 2-15 | 2.5 to 35.0 | 7.3 to 39.8 | PA 66, UL94V-0, natural (white) | 1,000 | Standard type |
| Header (Retainer mountable type) | XARP-02V to XARP-15V | 2-15 | 2.5 to 35.0 | 9.8 to 42.3 | PA 66, UL94V-0, natural (white) | 1,000 | Retainer mountable type |
| Contact | SXA-001T-P0.6 | - | - | - | Phosphor bronze, tin-plated (reflow treatment) | 8,000 / reel | Applicable wire: AWG #28 to #22, Insulation O.D. (mm): 0.6 |
| Shrouded header (Without a boss) | BH02B-XASK to BH15B-XASK | 2-15 | 2.5 to 35.0 | 7.5 to 40.0 | Post: Copper alloy, tin-plated; Wafer: Glass-filled PA 66, UL94V-0, natural (ivory) | 400-100 | - |
| Shrouded header (With a boss) | BH02B-XASK-BN to BH15B-XASK-BN | 2-15 | 2.5 to 35.0 | 10.0 to 42.5 | Post: Copper alloy, tin-plated; Wafer: Glass-filled PA 66, UL94V-0, natural (ivory) | 400-100 | - |
| Shrouded header on radial-tape (Without a boss) | BH02B-XASS-T to BH08B-XASS-T | 2-8 | 2.5 to 17.5 | 7.5 to 22.5 | Post: Copper alloy, tin-plated; Wafer: Glass-filled PA 66, UL94V-0, natural (ivory) | 1,000-500 | Taping specifications |
| Shrouded header on radial-tape (With a boss) | BH02B-XASS-BN-T to BH08B-XASS-BN-T | 2-8 | 2.5 to 17.5 | 10.0 to 25.0 | Post: Copper alloy, tin-plated; Wafer: Glass-filled PA 66, UL94V-0, natural (ivory) | 1,000-500 | Taping specifications |
| Specification | Value |
| Pitch | 2.5mm |
| Current Rating | 3A AC, DC (AWG #22) |
| Voltage Rating | 250V AC, DC |
| Temperature Range | -25C to +85C |
| Contact Resistance | Initial: 10mmax., After environmental testing: 20mmax. |
| Insulation Resistance | 1,000M min. |
| Withstanding Voltage | 1,000V AC/minute |
| Applicable PC board thickness | 1.6mm |
2304140030_JST-XAP-04V-1_C111519.pdf
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