Durable JST PHR-6-BK connector featuring 2.0mm pitch and low profile design for pcb wire connections
PH Connector 2.0mm Pitch
This is a thin, low-profile 2.0mm pitch connector, 8.0mm in height after mounting and 4.5mm in width. It is designed to meet the demand for high-density connection of internal wires to printed circuit boards. It is compact, highly reliable, and low in cost, offering reliable contact, a fully shrouded header, a printed circuit board retention mechanism, and surface mount models (SMT).
Product Attributes
- Brand: JST
- Certifications: UL Recognized E60389, Certified LR20812, R75087
- RoHS Compliant: Yes
Technical Specifications
| Model No. | Circuits | Applicable Wire (mm) | Applicable Wire (AWG) | Insulation O.D. (mm) | Q'ty / Reel | Material and Finish | Dimensions (mm) A | Dimensions (mm) B | Q'ty / Box | Material | Type |
| PHR-2 to PHR-16 | 2-16 | - | - | - | 1,000 | PA 66, UL94V-0, natural (white) | 2.0 to 30.0 | 5.8 to 33.8 | 1,000 | - | - |
| SPH-002T-P0.5S | - | 0.05 0.22 | 3024 | 0.91.5 | 8,000 | Phosphor bronze, tin-plated (reflow treatment) | - | - | - | - | Contact |
| SPH-002T-P0.5L | - | 0.08 0.22 | 2824 | 0.81.5 | 10,000 | Phosphor bronze, tin-plated (reflow treatment) | - | - | - | - | Contact (Low Insertion Force) |
| SPH-004T-P0.5S | - | 0.0320.08 | 3228 | 0.50.9 | - | Phosphor bronze, tin-plated (reflow treatment) | - | - | - | - | Contact |
| S2B-PH-K-S to S16B-PH-K-S | 2-16 | - | - | - | - | Post: Brass, copper-undercoated, tin-plated (reflow treatment) Wafer: PA 66, UL94V-0, natural (white) | 2.0 to 30.0 | 5.9 to 33.9 | 1,000 (2-6 circuits), 500 (7-11 circuits), 400 (12-16 circuits) | - | Top Entry Type |
| B2B-PH-K-S to B16B-PH-K-S | 2-16 | - | - | - | - | Post: Brass, copper-undercoated, tin-plated (reflow treatment) Wafer: PA 66, UL94V-0, natural (white) | 2.0 to 30.0 | 5.9 to 33.9 | 1,000 (2-6 circuits), 500 (7-11 circuits), 400 (12-16 circuits) | - | Side Entry Type |
| S2B-PH-KL to S16B-PH-KL | 2-16 | - | - | - | - | Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA 66, UL94V-0, gray | 2.0 to 30.0 | 5.9 to 33.9 | 1,000 (2-6 circuits), 500 (7-11 circuits), 400 (12-16 circuits) | - | Top Entry Type (Low Insertion Force) |
| B2B-PH-KL to B16B-PH-KL | 2-16 | - | - | - | - | Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA 66, UL94V-0, gray | 2.0 to 30.0 | 5.9 to 33.9 | 1,000 (2-6 circuits), 500 (7-11 circuits), 400 (12-16 circuits) | - | Side Entry Type (Low Insertion Force) |
| B2B-PH-SM4-TB to B16B-PH-SM4-TB | 2-16 | - | - | - | - | Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA, UL94V-0, natural (ivory) Solder tab: Brass, copper-undercoated, tin-plated (reflow treatment) | 2.0 to 30.0 | 7.95 to 35.95 | 1,000 | - | SMT Type Top Entry |
| S2B-PH-SM4-TB to S15B-PH-SM4-TB | 2-15 | - | - | - | - | Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA, UL94V-0, natural (ivory) Solder tab: Brass, copper-undercoated, tin-plated (reflow treatment) | 2.0 to 28.0 | 7.9 to 33.9 | 1,000 | - | SMT Type Side Entry |
Specifications
- Current rating: 2A AC, DC (AWG #24)
- Voltage rating: 100V AC, DC
- Temperature range: -25C to +85C (including temperature rise in applying electrical current)
- Contact resistance: Initial value/ 10m max. After environmental testing/ 20m max.
- Insulation resistance: 1,000M min.
- Withstanding voltage: 800V AC/ minute
- Applicable wire: AWG #32 to #24
- Applicable PC board thickness: 0.8 to 1.6mm
2006051707_JST-PHR-6-BK_C495651.pdf