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Durable JST PHR-6-BK connector featuring 2.0mm pitch and low profile design for pcb wire connections

Manufacturer:
JST
Description:
Connector Housing 6 Position 2mm Pitch Single Row PH Series PA66 -25℃~+85℃
Category:
Arrays, Edge Type, Mezzanine (Board to Board)/Rectangular Connector Housings
Specifications
Flame Retardant Rating:
UL94V-0
Pitch:
2mm
Colour:
黑色
Number Of Rows:
1
With Wings:
不带翅
Reference Series:
PH
Operating Temperature:
-25℃~+85℃
Plastic Material:
PA66
Number Of PINs Per Row:
6
Number Of Positions Or Pins:
1x6P
Row Spacing:
-
With Locker:
不带锁扣
Mfr. Part #:
PHR-6-BK
Package:
P=2mm
Model Number:
PHR-6-BK
Introduction

PH Connector 2.0mm Pitch

This is a thin, low-profile 2.0mm pitch connector, 8.0mm in height after mounting and 4.5mm in width. It is designed to meet the demand for high-density connection of internal wires to printed circuit boards. It is compact, highly reliable, and low in cost, offering reliable contact, a fully shrouded header, a printed circuit board retention mechanism, and surface mount models (SMT).

Product Attributes

  • Brand: JST
  • Certifications: UL Recognized E60389, Certified LR20812, R75087
  • RoHS Compliant: Yes

Technical Specifications

Model No.CircuitsApplicable Wire (mm)Applicable Wire (AWG)Insulation O.D. (mm)Q'ty / ReelMaterial and FinishDimensions (mm) ADimensions (mm) BQ'ty / BoxMaterialType
PHR-2 to PHR-162-16---1,000PA 66, UL94V-0, natural (white)2.0 to 30.05.8 to 33.81,000--
SPH-002T-P0.5S-0.05 0.2230240.91.58,000Phosphor bronze, tin-plated (reflow treatment)----Contact
SPH-002T-P0.5L-0.08 0.2228240.81.510,000Phosphor bronze, tin-plated (reflow treatment)----Contact (Low Insertion Force)
SPH-004T-P0.5S-0.0320.0832280.50.9-Phosphor bronze, tin-plated (reflow treatment)----Contact
S2B-PH-K-S to S16B-PH-K-S2-16----Post: Brass, copper-undercoated, tin-plated (reflow treatment)
Wafer: PA 66, UL94V-0, natural (white)
2.0 to 30.05.9 to 33.91,000 (2-6 circuits), 500 (7-11 circuits), 400 (12-16 circuits)-Top Entry Type
B2B-PH-K-S to B16B-PH-K-S2-16----Post: Brass, copper-undercoated, tin-plated (reflow treatment)
Wafer: PA 66, UL94V-0, natural (white)
2.0 to 30.05.9 to 33.91,000 (2-6 circuits), 500 (7-11 circuits), 400 (12-16 circuits)-Side Entry Type
S2B-PH-KL to S16B-PH-KL2-16----Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment)
Wafer: PA 66, UL94V-0, gray
2.0 to 30.05.9 to 33.91,000 (2-6 circuits), 500 (7-11 circuits), 400 (12-16 circuits)-Top Entry Type (Low Insertion Force)
B2B-PH-KL to B16B-PH-KL2-16----Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment)
Wafer: PA 66, UL94V-0, gray
2.0 to 30.05.9 to 33.91,000 (2-6 circuits), 500 (7-11 circuits), 400 (12-16 circuits)-Side Entry Type (Low Insertion Force)
B2B-PH-SM4-TB to B16B-PH-SM4-TB2-16----Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment)
Wafer: PA, UL94V-0, natural (ivory)
Solder tab: Brass, copper-undercoated, tin-plated (reflow treatment)
2.0 to 30.07.95 to 35.951,000-SMT Type Top Entry
S2B-PH-SM4-TB to S15B-PH-SM4-TB2-15----Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment)
Wafer: PA, UL94V-0, natural (ivory)
Solder tab: Brass, copper-undercoated, tin-plated (reflow treatment)
2.0 to 28.07.9 to 33.91,000-SMT Type Side Entry

Specifications

  • Current rating: 2A AC, DC (AWG #24)
  • Voltage rating: 100V AC, DC
  • Temperature range: -25C to +85C (including temperature rise in applying electrical current)
  • Contact resistance: Initial value/ 10m max. After environmental testing/ 20m max.
  • Insulation resistance: 1,000M min.
  • Withstanding voltage: 800V AC/ minute
  • Applicable wire: AWG #32 to #24
  • Applicable PC board thickness: 0.8 to 1.6mm

2006051707_JST-PHR-6-BK_C495651.pdf

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