Durable Connector with PA66 Housing and Copper Alloy Pins LXWCONN HY-8AW Electrical Connection Solution
Manufacturer:
LXWCONN
Description:
HY 1x8P 2mm Right Angle Through Hole,Right Angle,P=2mm Headers, Male Pins RoHS
Category:
Arrays, Edge Type, Mezzanine (Board to Board)/Headers, Male Pins
Specifications
Reference Series:
HY
Pins Structure:
1x8P
Pitch:
2mm
Mounting Type:
弯插
Mfr. Part #:
HY-8AW
Package:
Through Hole,Right Angle,P=2mm
Model Number:
HY-8AW
Introduction
Product Overview
The HY2.0 Series is a range of connectors designed for various applications. This product line offers different pin configurations and is built with durable materials to ensure reliable performance.
Product Attributes
- Series: HY2.0
- Material (Housing): PA66 (UL94V-0)
- Material (Pins): Copper Alloy
- Plating (Pins): Bright Tin 60u"MIN
- Origin: Not specified
- Color: Not specified
- Certifications: UL94V-0
Technical Specifications
| Model | Pins | Dimension A (mm) | Dimension B (mm) | Dimension C (mm) | Wafer Type | Housing Type |
| HY2.0-2P | 2 | 5.1 | 6.0 | 6.65 | HY2.0AW | WAFER |
| HY2.0-3P | 3 | 5.1 | 8.0 | 6.65 | HY2.0AW | WAFER |
| HY2.0-4P | 4 | 5.1 | 10.0 | 6.65 | HY2.0AW | WAFER |
| HY2.0-5P | 5 | 5.1 | 12.0 | 6.65 | HY2.0AW | WAFER |
| HY2.0-6P | 6 | 5.1 | 14.0 | 6.65 | HY2.0AW | WAFER |
| HY2.0-7P | 7 | 5.1 | 16.0 | 6.65 | HY2.0AW | WAFER |
| HY2.0-8P | 8 | 5.1 | 18.0 | 6.65 | HY2.0AW | WAFER |
| HY2.0-9P | 9 | 5.1 | 20.0 | 6.65 | HY2.0AW | WAFER |
| HY2.0-10P | 10 | 5.1 | 22.0 | 6.65 | HY2.0AW | WAFER |
| HY2.0-11P | 11 | 5.1 | 24.0 | 6.65 | HY2.0AW | WAFER |
| HY2.0-12P | 12 | 5.1 | 26.0 | 6.65 | HY2.0AW | WAFER |
| HY2.0-13P | 13 | 5.1 | 28.0 | 6.65 | HY2.0AW | WAFER |
| HY2.0-14P | 14 | 5.1 | 30.0 | 6.65 | HY2.0AW | WAFER |
| HY2.0-15P | 15 | 5.1 | 32.0 | 6.65 | HY2.0AW | WAFER |
| HY-XXAW | N/A | N/A | N/A | N/A | HY-XXAW | DIP |
2512151700_LXWCONN-HY-8AW_C53055455.pdf
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