Electronic connector LXWCONN HY-5A wafer DIP with 4 millimeter pitch and multiple pin configurations

Product Overview

The HY2.0 SERIES HY-XXA is a range of wafer DIP connectors designed for various applications. These connectors offer reliable electrical connections with different pin configurations and pitch options.

Product Attributes

• Brand: HY (Implied by series name)
• Material (Housing): PA66 (UL94V-0)
• Material (Pin): Copper Alloy
• Plating (Pin): Bright Tin 60u"MIN
• Certifications: UL94V-0 (for housing material)

Technical Specifications

Technical Requirements:

1) Material: Refer to attached table;

2) Plating: Refer to attached table;

3) Plastic parts surface should be flat, smooth, free of burrs, bubbles, scorching, deformation, gating without pulling, over-molding or under-molding defects.

General Tolerances:

X.X: 0.35

X.XX: 0.15

X.XXX: 0.25

X.: 0.05

Dimensional Tolerances:

DIM A 0.2

DIM B 0.2

DIM C 0.2

3.5 0.2

0.5 0.05

Angular Tolerances:

X.X: 1.00

X.XX: 2.00

X.XXX: 3.00

X: 3.00