Home > Products > Arrays, Edge Type, Mezzanine (Board to Board) >Headers, Male Pins > electrical wafer dip connector LXWCONN HY-4A with bright tin plated copper alloy pins and pa66 housing

electrical wafer dip connector LXWCONN HY-4A with bright tin plated copper alloy pins and pa66 housing

Manufacturer:
LXWCONN
Description:
HY 1x4P 2mm Through Hole Through Hole,P=2mm Headers, Male Pins RoHS
Category:
Arrays, Edge Type, Mezzanine (Board to Board)/Headers, Male Pins
Specifications
Reference Series:
HY
Pins Structure:
1x4P
Pitch:
2mm
Mounting Type:
直插
Mfr. Part #:
HY-4A
Package:
Through Hole,P=2mm
Model Number:
HY-4A
Introduction

Product Overview

The HY2.0 Series Wafer DIP connectors are designed for reliable electrical connections. This series offers various pin configurations and is suitable for a range of applications requiring robust and precise interconnects.

Product Attributes

  • Brand: HY (Implied by product name)
  • Series: HY2.0 Series
  • Type: Wafer DIP
  • Material (Housing): PA66 (UL94V-0)
  • Material (Pins): Copper Alloy
  • Plating: Bright Tin 60u"MIN
  • Certifications: UL94V-0 (for Housing Material)

Technical Specifications

ModelHousing DescriptionPin CountDimension A (mm)Dimension B (mm)Dimension C (mm)Dimension D (mm)Dimension E (mm)Dimension X (mm)Dimension Y (mm)Dimension Z (mm)Hole Diameter (mm)Date
HY2.0A 2PHousing210.96.03.5 0.22.06.00.5 0.052.0 +0.1 02020-05-28
HY2.0A 3PHousing38.98.03.5 0.24.08.00.5 0.052.0 +0.1 02020-05-28
HY2.0A 4PHousing46.910.03.5 0.26.010.00.5 0.052.0 +0.1 02020-05-28
HY2.0A 5PHousing54.912.03.5 0.28.012.00.5 0.052.0 +0.1 02020-05-28
HY2.0A 6PHousing612.914.03.5 0.210.014.00.5 0.052.0 +0.1 02020-05-28
HY2.0A 7PHousing714.916.03.5 0.212.016.00.5 0.052.0 +0.1 02020-05-28
HY2.0A 8PHousing816.918.03.5 0.214.018.00.5 0.052.0 +0.1 02020-05-28
HY2.0A 9PHousing918.920.03.5 0.216.020.00.5 0.052.0 +0.1 02020-05-28
HY2.0A 10PHousing1020.922.03.5 0.218.022.00.5 0.052.0 +0.1 02020-05-28
HY2.0A 11PHousing1122.924.03.5 0.220.024.00.5 0.052.0 +0.1 02020-05-28
HY2.0A 12PHousing1224.926.03.5 0.222.026.00.5 0.052.0 +0.1 02020-05-28
HY2.0A 13PHousing1326.928.03.5 0.224.028.00.5 0.052.0 +0.1 02020-05-28
HY2.0A 14PHousing1428.930.03.5 0.226.030.00.5 0.052.0 +0.1 02020-05-28
HY2.0A 15PHousing1530.932.03.5 0.228.032.00.5 0.052.0 +0.1 02020-05-28

Technical Requirements

  • Material: Refer to attached table.
  • Plating: Refer to attached table.
  • Plastic Parts Surface: Flat, smooth, free from burrs, bubbles, scorching, deformation. Gate areas free from pulling, excess material, or shortage.

General Tolerances

DimensionTolerance
X.X0.35
X.XX0.15
X.XXX0.25
X.1.00
X.X2.00
X.XX3.00

2512151700_LXWCONN-HY-4A_C53055450.pdf

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