Durable electrical connector LXWCONN HY-6A wafer dip type with copper alloy pins and UL94V-0 housing
Specifications
Reference Series:
HY
Pins Structure:
1x6P
Pitch:
2mm
Mounting Type:
直插
Mfr. Part #:
HY-6A
Package:
Through Hole,P=2mm
Model Number:
HY-6A
Introduction
Product Overview
The HY2.0 Series Wafer DIP connectors are designed for reliable electrical connections. This series offers various pin configurations and dimensions to suit different application needs.
Product Attributes
- Brand: HY
- Series: HY2.0
- Model: HY-XXA
- Type: Wafer DIP
- Certifications: UL94V-0 (for Housing)
Technical Specifications
| P/N | Series | Type | Housing Material | Pin Material | Pin Plating | Number of Pins | Dimension A (mm) | Dimension B (mm) | Dimension C (mm) | Dimension D (mm) | Dimension E (mm) | Dimension F (mm) | Dimension G (mm) | Dimension H (mm) | Dimension X (mm) | Dimension Y (mm) | Dimension Z (mm) | Tolerance X.X (mm) | Tolerance X.XX (mm) | Tolerance X.XXX (mm) | General Tolerance +/-0.35 (mm) | General Tolerance +/-0.15 (mm) | General Tolerance +/-0.25 (mm) |
| HY2.0A 2P | HY2.0 | Wafer DIP | PA66 (UL94V-0) | Copper Alloy | Bright Tin 60u"MIN | 2 | 2.0 | 10.9 | 6.0 | 3.5 0.2 | 0.5 0.05 | 0.7 +0.1 / 0 | 11 | 10 | 9 | 8 | 7 | 6 | 5 | 4 | 3 | 2 | 1 |
| HY2.0A 3P | HY2.0 | Wafer DIP | PA66 (UL94V-0) | Copper Alloy | Bright Tin 60u"MIN | 3 | 4.0 | 8.9 | 8.0 | 3.5 0.2 | 0.5 0.05 | 0.7 +0.1 / 0 | 11 | 10 | 9 | 8 | 7 | 6 | 5 | 4 | 3 | 2 | 1 |
| HY2.0A 4P | HY2.0 | Wafer DIP | PA66 (UL94V-0) | Copper Alloy | Bright Tin 60u"MIN | 4 | 6.0 | 6.9 | 10.0 | 3.5 0.2 | 0.5 0.05 | 0.7 +0.1 / 0 | 11 | 10 | 9 | 8 | 7 | 6 | 5 | 4 | 3 | 2 | 1 |
| HY2.0A 5P | HY2.0 | Wafer DIP | PA66 (UL94V-0) | Copper Alloy | Bright Tin 60u"MIN | 5 | 8.0 | 4.9 | 12.0 | 3.5 0.2 | 0.5 0.05 | 0.7 +0.1 / 0 | 11 | 10 | 9 | 8 | 7 | 6 | 5 | 4 | 3 | 2 | 1 |
| HY2.0A 6P | HY2.0 | Wafer DIP | PA66 (UL94V-0) | Copper Alloy | Bright Tin 60u"MIN | 6 | 10.0 | 12.9 | 14.0 | 3.5 0.2 | 0.5 0.05 | 0.7 +0.1 / 0 | 11 | 10 | 9 | 8 | 7 | 6 | 5 | 4 | 3 | 2 | 1 |
| HY2.0A 7P | HY2.0 | Wafer DIP | PA66 (UL94V-0) | Copper Alloy | Bright Tin 60u"MIN | 7 | 12.0 | 14.9 | 16.0 | 3.5 0.2 | 0.5 0.05 | 0.7 +0.1 / 0 | 11 | 10 | 9 | 8 | 7 | 6 | 5 | 4 | 3 | 2 | 1 |
| HY2.0A 8P | HY2.0 | Wafer DIP | PA66 (UL94V-0) | Copper Alloy | Bright Tin 60u"MIN | 8 | 14.0 | 16.9 | 18.0 | 3.5 0.2 | 0.5 0.05 | 0.7 +0.1 / 0 | 11 | 10 | 9 | 8 | 7 | 6 | 5 | 4 | 3 | 2 | 1 |
| HY2.0A 9P | HY2.0 | Wafer DIP | PA66 (UL94V-0) | Copper Alloy | Bright Tin 60u"MIN | 9 | 16.0 | 18.9 | 20.0 | 3.5 0.2 | 0.5 0.05 | 0.7 +0.1 / 0 | 11 | 10 | 9 | 8 | 7 | 6 | 5 | 4 | 3 | 2 | 1 |
| HY2.0A 10P | HY2.0 | Wafer DIP | PA66 (UL94V-0) | Copper Alloy | Bright Tin 60u"MIN | 10 | 18.0 | 20.9 | 22.0 | 3.5 0.2 | 0.5 0.05 | 0.7 +0.1 / 0 | 11 | 10 | 9 | 8 | 7 | 6 | 5 | 4 | 3 | 2 | 1 |
| HY2.0A 11P | HY2.0 | Wafer DIP | PA66 (UL94V-0) | Copper Alloy | Bright Tin 60u"MIN | 11 | 20.0 | 22.9 | 24.0 | 3.5 0.2 | 0.5 0.05 | 0.7 +0.1 / 0 | 11 | 10 | 9 | 8 | 7 | 6 | 5 | 4 | 3 | 2 | 1 |
| HY2.0A 12P | HY2.0 | Wafer DIP | PA66 (UL94V-0) | Copper Alloy | Bright Tin 60u"MIN | 12 | 22.0 | 24.9 | 26.0 | 3.5 0.2 | 0.5 0.05 | 0.7 +0.1 / 0 | 11 | 10 | 9 | 8 | 7 | 6 | 5 | 4 | 3 | 2 | 1 |
| HY2.0A 13P | HY2.0 | Wafer DIP | PA66 (UL94V-0) | Copper Alloy | Bright Tin 60u"MIN | 13 | 24.0 | 26.9 | 28.0 | 3.5 0.2 | 0.5 0.05 | 0.7 +0.1 / 0 | 11 | 10 | 9 | 8 | 7 | 6 | 5 | 4 | 3 | 2 | 1 |
| HY2.0A 14P | HY2.0 | Wafer DIP | PA66 (UL94V-0) | Copper Alloy | Bright Tin 60u"MIN | 14 | 26.0 | 28.9 | 30.0 | 3.5 0.2 | 0.5 0.05 | 0.7 +0.1 / 0 | 11 | 10 | 9 | 8 | 7 | 6 | 5 | 4 | 3 | 2 | 1 |
| HY2.0A 15P | HY2.0 | Wafer DIP | PA66 (UL94V-0) | Copper Alloy | Bright Tin 60u"MIN | 15 | 28.0 | 30.9 | 32.0 | 3.5 0.2 | 0.5 0.05 | 0.7 +0.1 / 0 | 11 | 10 | 9 | 8 | 7 | 6 | 5 | 4 | 3 | 2 | 1 |
Technical Requirements:
- 1) Material: See attached table;
- 2) Plating: See attached table;
- 3) Plastic parts surface should be flat, smooth, free of burrs, bubbles, scorching, deformation, and without pulling, over-molding, or short-shot defects at the gate.
2512151700_LXWCONN-HY-6A_C53055452.pdf
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