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Home > Products > Arrays, Edge Type, Mezzanine (Board to Board) >Headers, Male Pins > Electrical connector LXWCONN HY-8A wafer DIP series with copper alloy pins and PA66 housing material

Electrical connector LXWCONN HY-8A wafer DIP series with copper alloy pins and PA66 housing material

quality Electrical connector LXWCONN HY-8A wafer DIP series with copper alloy pins and PA66 housing material factory
quality Electrical connector LXWCONN HY-8A wafer DIP series with copper alloy pins and PA66 housing material factory
Manufacturer:
LXWCONN
Description:
HY 1x8P 2mm Through Hole Through Hole,P=2mm Headers, Male Pins RoHS
Category:
Arrays, Edge Type, Mezzanine (Board to Board)/Headers, Male Pins
Specifications
Reference Series:
HY
Pins Structure:
1x8P
Pitch:
2mm
Mounting Type:
直插
Mfr. Part #:
HY-8A
Package:
Through Hole,P=2mm
Model Number:
HY-8A
Introduction

Product Overview

The HY2.0 Series Wafer DIP connectors are designed for reliable electrical connections. This series offers various pin configurations and is suitable for a range of electronic applications.

Product Attributes

  • Brand: HY
  • Series: HY2.0
  • Type: WAFER DIP
  • Material (Housing): PA66 (UL94V-0)
  • Material (Pins): Copper Alloy
  • Plating (Pins): Bright Tin 60u"MIN

Technical Specifications

ModelPinsDimension A (mm)Dimension B (mm)Dimension C (mm)Dimension D (mm)Dimension E (mm)Dimension () (mm)Tolerance ATolerance BTolerance CGeneral Tolerance X.X (mm)General Tolerance X.XX (mm)General Tolerance X.XXX (mm)General Tolerance XGeneral Tolerance X.XGeneral Tolerance X.XXGeneral Tolerance X.XXXGeneral Tolerance 1.00General Tolerance 2.00General Tolerance 3.00
HY2.0A2P2.010.96.03.5 0.20.5 0.050.7 +0.1 / 00.20.20.20.350.150.25N/AN/AN/AN/AN/AN/AN/A
HY2.0A3P4.08.98.03.5 0.20.5 0.050.7 +0.1 / 00.20.20.20.350.150.25N/AN/AN/AN/AN/AN/AN/A
HY2.0A4P6.06.910.03.5 0.20.5 0.050.7 +0.1 / 00.20.20.20.350.150.25N/AN/AN/AN/AN/AN/AN/A
HY2.0A5P8.04.912.03.5 0.20.5 0.050.7 +0.1 / 00.20.20.20.350.150.25N/AN/AN/AN/AN/AN/AN/A
HY2.0A6P10.012.914.03.5 0.20.5 0.050.7 +0.1 / 00.20.20.20.350.150.25N/AN/AN/AN/AN/AN/AN/A
HY2.0A7P12.014.916.03.5 0.20.5 0.050.7 +0.1 / 00.20.20.20.350.150.25N/AN/AN/AN/AN/AN/AN/A
HY2.0A8P14.016.918.03.5 0.20.5 0.050.7 +0.1 / 00.20.20.20.350.150.25N/AN/AN/AN/AN/AN/AN/A
HY2.0A9P16.018.920.03.5 0.20.5 0.050.7 +0.1 / 00.20.20.20.350.150.25N/AN/AN/AN/AN/AN/AN/A
HY2.0A10P18.020.922.03.5 0.20.5 0.050.7 +0.1 / 00.20.20.20.350.150.25N/AN/AN/AN/AN/AN/AN/A
HY2.0A11P20.022.924.03.5 0.20.5 0.050.7 +0.1 / 00.20.20.20.350.150.25N/AN/AN/AN/AN/AN/AN/A
HY2.0A12P22.024.926.03.5 0.20.5 0.050.7 +0.1 / 00.20.20.20.350.150.25N/AN/AN/AN/AN/AN/AN/A
HY2.0A13P24.026.928.03.5 0.20.5 0.050.7 +0.1 / 00.20.20.20.350.150.25N/AN/AN/AN/AN/AN/AN/A
HY2.0A14P26.028.930.03.5 0.20.5 0.050.7 +0.1 / 00.20.20.20.350.150.25N/AN/AN/AN/AN/AN/AN/A
HY2.0A15P28.030.932.03.5 0.20.5 0.050.7 +0.1 / 00.20.20.20.350.150.25N/AN/AN/AN/AN/AN/AN/A

Technical Requirements:
1) Material: See attached table;
2) Plating: See attached table;
3) Plastic parts surface should be flat, smooth, free from burrs, bubbles, scorch marks, deformation, and defects such as pulling, overfilling, or short-filling at gate areas.


2512151700_LXWCONN-HY-8A_C53055453.pdf

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