electronic flip top housing component Megastar ZX-1.0FPC-2H-QFX20P with LCP UL94V-0 material and copper alloy tin plating
Product Overview
This product is a component designed for electronic applications, featuring a flip-top housing style. It is compatible with 0.5mm pitch FPC (Flexible Printed Circuit) connectors and supports both PCB layout and flat cable connections. The component is constructed from LCP material and copper alloy with tin plating, ensuring reliable electrical performance and durability within a specified temperature range.
Product Attributes
- Material: LCP, Copper Alloy/Surface Tin Plated
- Housing Style: Front Flip-Top
- Color: Natural (for LCP), Black (for LCP)
- Certifications: UL94V-0
Technical Specifications
| Item | Description | Pitch | Height | Part Number |
|---|---|---|---|---|
| Housing (H2.0) | 0.5mm Flip-Top Housing (LCP UL94V-0, Natural) | 0.5 mm | 2.0 mm | ZX-1.0FPC-2H-QFX20P |
| Back Cover (H2.0) | 0.5mm Flip-Top Back Cover (LCP UL94V-0, Black) | 0.5 mm | 2.0 mm | ZX-1.0FPC-2H-QFX20P |
| Solder Tab (H2.0) | 0.5mm Flip-Top Solder Tab (Copper Alloy/Surface Tin Plated) | 0.5 mm | 2.0 mm | ZX-1.0FPC-2H-QFX20P |
| Terminal (H2.0) | 0.5mm Flip-Top Terminal (Copper Alloy/Surface Tin Plated) | 0.5 mm | 2.0 mm | ZX-1.0FPC-2H-QFX20P |
| General Technical Indicators: | ||||
| Surface Finish of Plastic Parts | Should be smooth, free of burrs, obvious shrinkage, defects, cracks, etc. | |||
| Temperature Range | -25C ~ 85C | |||
| Rated Voltage | 50V, AC/DC (equivalent) | |||
| Contact Resistance | 0.03 | |||
| Insulation Resistance | 500M | |||
2311221751_Megastar-ZX-1-0FPC-2H-QFX20P_C19191211.pdf