PCB header with 3 connections and 25 millimeter pitch Phoenix Contact 1814922 in tape on reel packaging
Manufacturer:
Phoenix Contact
Description:
2.5mm 1x3P 1 White 3 Non-Latching -40℃~+100℃ Solid State Lighting Connector Assemblies RoHS
Category:
Solid State Lighting Connector Assemblies/Solid State Lighting Connector Assemblies
Specifications
Pitch:
2.5mm
Number Of Positions Or Pins:
1x3P
With Wings:
不带翅
Plastic Material:
PA
Number Of Rows:
1
Color:
白色
Number Of PINs Per Row:
3
With Locker:
不带锁扣
Operating Temperature:
-40℃~+100℃
Mfr. Part #:
1814922
Model Number:
1814922
Introduction
Product Overview
The PTSM 0,5/ 3-HH0-2,5-SMD WH R32 is a PCB header designed for integration into the SMT soldering process. It features a white design for stable color during welding and use, and is supplied in tape-on-reel packing according to IEC 60286-3 for automated mounting. Additional solder anchors enhance mechanical strain relief on soldering spots.
Product Attributes
- Brand: Phoenix Contact
- Product Range: PTSM 0,5/.. -HH-SMD WH
- Color: Signal White
- Country of Origin: IN
- Certifications: UL Recognized (E118976-20130619), cULus Recognized (E60425-20110108), VDE Zeichengenehmigung (40048497)
- Environmental Compliance: EU RoHS compliant, China RoHS compliant, EU REACH SVHC compliant
Technical Specifications
| Specification | Value |
|---|---|
| Product Type | PCB header |
| Product Family | PTSM 0,5/..-HH-SMD WH |
| Product Line | COMBICON Connectors XS |
| Type | Standard |
| Number of Positions | 3 |
| Pitch | 2.5 mm |
| Number of Connections | 3 |
| Number of Rows | 1 |
| Number of Potentials | 3 |
| Mounting Type | SMD soldering |
| Pin Layout | Linear pad geometry |
| Solder Pins per Potential | 1 |
| Nominal Current (IN) | 6 A |
| Nominal Voltage (UN) | 160 V |
| Contact Resistance | 3 m |
| Rated Voltage (III/3) | 125 V |
| Rated Surge Voltage (III/3) | 2.5 kV |
| Rated Voltage (III/2) | 160 V |
| Rated Surge Voltage (III/2) | 2.5 kV |
| Rated Voltage (II/2) | 320 V |
| Rated Surge Voltage (II/2) | 2.5 kV |
| Process | Reflow soldering |
| Moisture Sensitive Level (MSL) | 1 |
| Classification Temperature (Tc) | 260 C |
| Solder Cycles in Reflow | 3 |
| Contact Material | Cu alloy |
| Surface Characteristics | Tin-plated |
| Metal Surface Contact Area (Top Layer) | Tin (3 - 5 m Sn) |
| Metal Surface Contact Area (Middle Layer) | Nickel (1.3 - 3 m Ni) |
| Metal Surface Soldering Area (Top Layer) | Tin (3 - 5 m Sn) |
| Metal Surface Soldering Area (Middle Layer) | Nickel (1.3 - 3 m Ni) |
| Housing Color | Signal white (9003) |
| Insulating Material | PA |
| Insulating Material Group | I |
| CTI according to IEC 60112 | 600 |
| Flammability Rating according to UL 94 | V0 |
| Width [w] | 13.1 mm |
| Height [h] | 5 mm |
| Length [l] | 9.5 mm |
| Installed Height | 5 mm |
| PCB Pad Geometry | 1.2 x 3.2 mm |
| Insertion Strength per Pos. (approx.) | 5 N |
| Withdraw Strength per Pos. (approx.) | 4 N |
| Insulation Resistance (neighboring positions) | > 5 M |
| Minimum Clearance Value (III/3) | 1.5 mm |
| Minimum Creepage Distance (III/3) | 1.9 mm |
| Minimum Clearance Value (III/2) | 1.5 mm |
| Minimum Creepage Distance (III/2) | 1.5 mm |
| Minimum Clearance Value (II/2) | 1.5 mm |
| Minimum Creepage Distance (II/2) | 1.6 mm |
| Vibration Test Frequency | 10 - 150 - 10 Hz |
| Vibration Test Amplitude | 0.35 mm (10 Hz ... 60.1 Hz) |
| Vibration Test Acceleration | 5g (60.1 Hz ... 150 Hz) |
| Durability Test Cycles | 10 |
| Climatic Test Corrosive Stress | 0.2 dm3 SO2 on 300 dm3/40 C/1 cycle |
| Climatic Test Thermal Stress | 100 C/168 h |
| Ambient Temperature (Operation) | -40 C ... 100 C (dependent on derating curve) |
| Ambient Temperature (Storage/Transport) | -40 C ... 70 C |
| Relative Humidity (Storage/Transport) | 30 % ... 70 % |
| Ambient Temperature (Assembly) | -5 C ... 100 C |
| Type of Packaging | 32 mm wide tape |
| Tape Width [W] | 32 mm |
| Coil Overall Dimension [W2] | 38.4 mm |
| Coil Diameter [A] | 330 mm |
2410311118_Phoenix-Contact-1814922_C21875013.pdf
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