Smd socket with gold plated contacts and electrostatic discharge protection Phoenix Contact 1156833
Manufacturer:
Phoenix Contact
Description:
Female Header 10 Position 1.27mm Pitch Dual Row Surface Mount -40℃~+125℃
Category:
Arrays, Edge Type, Mezzanine (Board to Board)/Headers, Receptacles, Female Sockets
Specifications
Pitch:
1.27mm
Row Spacing:
1.27mm
Number Of Rows:
双排
Number Of Pins:
10P
Voltage Rating (Max):
-
Contact Plating:
锡
Contact Material:
铜合金
Operating Temperature:
-40℃~+125℃
Current Rating:
-
Mounting Type:
立贴
Circular Hole / Square Hole:
方孔
Mfr. Part #:
1156833
Package:
SMD,P=1.27mm
Model Number:
1156833
Introduction
Product Overview
This SMD socket, featuring a reliable double-sided contact system, is designed for seamless integration into SMT soldering processes. It offers clear and cost-optimized design suitable for a multitude of applications, ensuring reliable mechanical and electrical connections. The female strip is manufactured with a gold-plated contact surface for enhanced conductivity and durability.
Product Attributes
- Brand: Phoenix Contact
- Product Type: SMD socket
- Product Family: FQ 1,27D/...-SV
- Contact Surface Material: Gold (Au)
- Housing Color: Black (9005)
- Insulating Material: PA
- Insulating Material Group: I
- CTI (Comparative Tracking Index): 600 (according to IEC 60112)
- Flammability Rating: V0 (according to UL 94)
- WEEE/RoHS-compliant: Yes
- Country of Origin: CN
- Approvals: cULus Recognized (Approval ID: E118976)
- ESD level: (D) electrostatically conductive (according to DIN EN 61340-5-1)
Technical Specifications
| Specification | Value |
|---|---|
| Item Number | 1156833 |
| Product Key | AAXAAF |
| GTIN | 4063151160517 |
| Number of Positions | 10 |
| Pitch | 1.27 mm |
| Number of Rows | 2 |
| Pin Layout | Linear pad geometry |
| Nominal Current (IN) | 1 A (at 20C 80-pos.) |
| Test Voltage | 500 V AC (IEC 60512-4-1:2003-05) |
| Contact Resistance | 20 m |
| Width [w] | 6.75 mm |
| Height [h] | 5.1 mm |
| Length [l] | 4.5 mm |
| Installed Height | 4.6 mm |
| Stack Height | 6.2 mm |
| Wipe Length | 1.3 mm |
| Pad Geometry | 0.76 x 2.05 mm |
| Contact Material | Cu alloy |
| Contact Surface (top layer) | Gold (Au) |
| Contact Surface (middle layer) | Nickel (Ni) |
| Soldering Area (top layer) | Tin (Sn) |
| Insulation Resistance (neighboring positions) | > 1 G (IEC 60512-3-1:2002-02) |
| Insertion Strength per pos. | approx. 1.2 N |
| Withdraw Strength per pos. | approx. 1.2 N |
| No. of cycles (Durability) | 100 |
| Ambient Temperature (operation) | -40 C ... 125 C |
| Ambient Temperature (storage/transport) | -40 C ... 70 C |
| Relative Humidity (storage/transport) | 30 % ... 70 % |
| Ambient Temperature (assembly) | -5 C ... 100 C |
| Mounting Type | SMD soldering |
| Processing Type | Reflow soldering |
| Moisture Sensitive Level (MSL) | 1 |
| Classification Temperature (Tc) | 260 C |
| Tape width [W] | 16 mm |
| Coil overall dimension [W2] | 22.4 mm |
| Coil diameter [A] | 330 mm |
| Nominal Voltage (UN) (cULus) | 30 V |
| Nominal Current (IN) (cULus) | 1 A |
| ECLASS-11.0 | 27460201 |
| ECLASS-12.0 | 27460201 |
| ECLASS-13.0 | 27460201 |
| ETIM 9.0 | EC002637 |
| UNSPSC 21.0 | 39121400 |
| EU RoHS | Fulfills EU RoHS substance requirements (Yes, No exemptions) |
| China RoHS EFUP | No hazardous substances above the limits |
| REACH SVHC | No substance above 0.1 wt% |
2501081432_Phoenix-Contact-1156833_C3322597.pdf
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