0.5mm pitch ZIF FPC connector SHOU HAN 0.5-6PQFHY-H1.0 119 with thermoplastic housing and copper alloy contacts
Product Overview
This specification covers the 0.5mm pitch, 1.0mm height ZIF FPC connector series. Designed for reliable connections, these connectors feature thermoplastic housings and covers, copper alloy contacts with gold or tin plating, and copper alloy pegs with tin plating. They are rated for 50VAC/DC and 0.5AAC/DC, operating within a temperature range of -25 to +85. The series is suitable for applications requiring robust electrical and mechanical performance, as detailed in the comprehensive test conditions and procedures outlined.
Product Attributes
- Brand: SHENZHEN SHOUHAN TECHNOLOGYCO.,LTD
- Origin: Shenzhen, China
- Housing Material: Thermoplastic Without Halogen, UL94V-0
- Housing Color: Nature
- Cover Material: Thermoplastic Without Halogen, UL94V-0
- Cover Color: Black
- Contact Material: Copper Alloy, Gold or Tin plating over Nickel under plating Overall
- Peg Material: Copper Alloy, Tin Plating over Nickel under plating overall
- Certifications/Standards Referenced: JIS COO41/MIL-STD-202 Method 213, EIA-364-31A, EIA-364-26A
Technical Specifications
| Item | Specification | Details |
|---|---|---|
| Product Part Number | FPC0509-xxRL-TAG | |
| Product Name | FPC Connector | 0.5PH 1.0H ZIF FPC series |
| General Tolerance | 0.5-6PQFHY- H1.0 119 | |
| Material Code | 119 | (Metal mask) |
| Ratings | Operating Voltage | 50VAC/DC Max |
| Current Rating | 0.5AAC/DC Max | |
| Operating Temperature | -25+85 (Including Terminal Temperature Rise) | |
| Test Conditions | Standard Conditions | Temp: 15-35, RH: 25-85%, Pressure: 86-106KPa |
| Doubtful Conditions | Temp: 202, RH: 60-70%, Pressure: 86-106KPa | |
| Test Requirements and Procedures | Product Examination | Visual inspection. Meets requirements of Product drawing, NO Breakdown |
| Contact Resistance | 30m Ohm Max (at 20Mv Max, 10mA) | |
| Dielectric Withstanding Voltage | 250VAC for 1 minute (between adjacent circuits) NO Breakdown | |
| Insulation Resistance | 500 M Ohm Min. (at 500VDC between adjacent circuits) | |
| Contact/Peg Retention Force | 0.250kgf Min. (Axial pull out force at 25.43mm/min) | |
| Actuator Retention Force | 0.200kgf/Pin Max. (Operation Speed: 25.43 mm/min) | |
| FPC/FFC Retention Force | 0.030kgf/Pin Min. (PIN17); 0.500kgf Min. (PIN<17) (Operation Speed: 25.43 mm/min) | |
| Durability | 20 Cycles (Max speed: 10 cycles/min). Contact Resistance: 60m Ohm Max. Appearance: No damage. | |
| Vibration | Amplitude: 1.52m; Frequency: 10~55~10Hz; Time: 2 hours/axis (6 hours total). Discontinuity: 1u sec. Max. Appearance: No damage. Contact Resistance: 60mOhm Max. | |
| Mechanical Shock | Acceleration: 50G. Time: 11ms (half sine wave). Cycle: 3 cycles/axis (9 cycles total). Discontinuity: 1u sec. Max. | |
| Temperature Rising | 30 Max (when maximum AC mated current is applied) | |
| Solder ability | Solder wetting: 95% of immersed area must show no voids, Pinholes. (Solder at 245 5 for 30.05sec) | |
| Resistance to Reflow Soldering Heat | Refer to Fig.4. Appearance: No damage. | Pre Heat: 150~180, 9030sec. Heat: 230 Min., 3010sec. Peak Temp.: 260+0/-5, 10sec. or less. Duration: 3 cycles. |
| Thermal Shock | Contact Resistance: 60mOhm Max. Appearance: No damage. | Temp range: -55 to +85. Change time 30 seconds. 5 cycles. |
| Humidity-Temperature Cycle | Insulation Resistance: 100M Ohm Min. | 40 20C, 90~95%RH for 96 hours. Post-test: 1-2 hours at room ambient. |
| Temperature Life | Contact Resistance: 60mOhm Max. Appearance: No damage. | Mated, Connector at 85 for 250 hours. |
| Salt Spray | Contact Resistance: 60mOhm Max. | Salt concentration: 5%/ Temperature: 3520C, Testing time: 242 hours. |
2510161748_SHOU-HAN-0-5-6PQFHY-H1-0-119_C2858296.pdf