Secure Electrical Connection SHOU HAN 0.5-6PQFHY-H2.0 119 ZIF FPC Connector for FPC Integration
Specifications
Locking Feature:
翻盖式
Operating Temperature:
-25℃~+85℃
Number Of Contacts:
6P
Pitch:
0.5mm
Voltage Rating (Max):
50V
Contact Type:
双侧触点/上下接
Mounting Type:
卧贴
FFC, FCB Thickness:
0.3mm
Contact Plating:
金
Contact Material:
磷青铜
Mfr. Part #:
0.5-6PQFHY-H2.0 119
Package:
SMD,P=0.5mm,Surface Mount,Right Angle
Model Number:
0.5-6PQFHY-H2.0 119
Introduction
Product Overview
This specification covers the 0.5mm pitch, 2.0mm height ZIF FPC connector series. Designed for reliable electrical connections, these connectors are suitable for applications requiring compact and secure FPC/FFC integration.
Product Attributes
- Brand: SHENZHEN SHOUHAN TECHNOLOGY CO.,LTD
- Origin: Shenzhen, China
- Housing Material: Thermoplastic Without Halogen, UL94V-0
- Cover Material: Thermoplastic Without Halogen, UL94V-0
- Contact Material: Copper Alloy with Gold or Tin plating over Nickel underplating
- Peg Material: Copper Alloy with Tin plating over Nickel underplating
- Housing Color: Nature
- Cover Color: Black
Technical Specifications
| Item | Specification |
|---|---|
| Part No. | 0.5-6PQFHY-H2.0 |
| Series | 0.5PH 2.0H ZIF FPC |
| Operating Voltage | 50VAC/DC Max. |
| Current Rating | 0.5AAC/DC Max. |
| Operating Temperature Range | -25 to +85 (Including Terminal Temperature Rise) |
| Contact Resistance (Initial) | 30m Ohm Max. |
| Dielectric Withstanding Voltage | 250VAC for 1 minute (between adjacent circuits) |
| Insulation Resistance | 500 M Ohm Min. (500VDC between adjacent circuits) |
| Contact/Peg Retention Force | 0.250kgf Min. (Axial pull out force) |
| Actuator Retention Force | 0.200kgf/Pin Max. |
| FPC/FFC Retention Force | 0.030kgf/Pin Min. (for PIN 17) 0.500kgf Min. (for PIN < 17) |
| Durability Cycles | 20 Cycles |
| Contact Resistance (After Durability) | 60m Ohm Max. |
| Vibration Discontinuity | 1u sec. Max. |
| Mechanical Shock Discontinuity | 1u sec. Max. |
| Temperature Rising (Max Current) | 30 Max. |
| Solderability Wetting | 95% of immersed area |
| Resistance to Reflow Soldering Heat Peak Temp. | 260+0/-5, 10sec. Or less |
| Thermal Shock Contact Resistance | 60m Ohm Max. |
| Humidity-Temperature Cycle Insulation Resistance | 100M Ohm Min. |
| Temperature Life Contact Resistance | 60m Ohm Max. |
| Salt Spray Contact Resistance | 60m Ohm Max. |
2501101623_SHOU-HAN-0-5-6PQFHY-H2-0-119_C2858297.pdf
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