electronic connectors SHOU HAN 0.8-2PWT with defect free surface and oxidation resistant phosphor bronze contacts
Manufacturer:
SHOU HAN
Description:
Connector Header 2 position 0.8mm Pitch 0.5A Surface Mount, Right Angle -25℃~+85℃
Category:
Free Hanging, Panel Mount/Headers, Male Pins
Specifications
Number Of Rows:
1
Pins Structure:
1x2P
Mounting Type:
卧贴
Pitch:
0.8mm
Operating Temperature:
-25℃~+85℃
Number Of PINs:
2P
Contact Material:
铜合金
Color:
米色
Number Of PINs Per Row:
2
Contact Plating:
锡
Current Rating:
500mA
Voltage Rating (Max):
30V
Mfr. Part #:
0.8-2PWT
Package:
SMD,P=0.8mm,Surface Mount,Right Angle
Model Number:
0.8-2PWT
Introduction
Product Overview
This specification covers the production and inspection of Shenzhen Shouhan Technology Co., Ltd.'s standard series of strip connectors (pin headers). This product is designed for use within an ambient temperature range of -25 to +85 and is compatible with wire sizes AWG#28 to #32 and PC board thicknesses of 1.2 to 1.6 mm. The connector features a surface free from defects, dirt, cracks, and mechanical damage, with contacts free from rust and plating without oxidation or peeling. It is designed for interchangeability with products of the same specification.
Product Attributes
- Brand: (SHENZHEN SHOUHAN TECHNOLOGY CO., LTD)
- Origin: Shenzhen, China
- Certifications: UL94V-0 (for Housing and Plastic Shell materials)
Technical Specifications
| Part No. | Item | Type | Material | Finish | Requirement | Notes |
| 0.8-2PWT | Terminal | Contact | Phosphor bronze (0.15mm thick) | Tin Plating: 3~4 m | RoHS Compliant | |
| Housing | Plastic | Nylon66 | Color: White | UL94V-0 | ||
| Opening Wafer Contact | Contact | Phosphor bronze (0.30mm thick) | Tin Plating: 3~4 m | |||
| Opening Wafer Housing | Plastic | Nylon66 | Color: White | UL94V-0 | ||
| Lips Wafer Contact | Contact | Phosphor bronze (0.30mm thick) | Gold Plating: 3~4 m | |||
| Lips Wafer Housing | Plastic | PBT | Color: White | UL94V-0 | ||
| Tiepian Wafer Contact | Contact | Phosphor bronze (0.30mm thick) | Tin Plating: 3~4 m | |||
| Tiepian Wafer Solder tabs | Solder tabs | Phosphor bronze (0.25mm thick) | Tin Plating: 3~4 m | |||
| Tiepian Wafer Housing | Plastic | Nylon46 | Color: Beige | UL94V-0 | ||
| Contact | Contact | Phosphor bronze (0.30mm thick) | Tin Plating: 3~4 m | |||
| Housing | Plastic | Nylon46 | Color: Beige | UL94V-0 | ||
| Electrical Performance: Rated Voltage | 30V AC/DC | |||||
| Electrical Performance: Rated Current | 0.5A AC/DC | |||||
| Electrical Performance: Contact Resistance | 20m | |||||
| Electrical Performance: Insulation Resistance | 100M | |||||
| Electrical Performance: Dielectric Strength | AC 500V/minute | |||||
| Mechanical Performance: Female contact Retention force | 0.5N per pin | |||||
| Mechanical Performance: Male contact Retention force (PIN) | 10N per pin | |||||
| Mechanical Performance: Plug-in force | 3N per pin | |||||
| Mechanical Performance: Plug-out force | 10N per pin | |||||
| Endurance Characteristics: Requirement | 10N | |||||
| Endurance Characteristics: Time | 2.50.5S | |||||
| Endurance Characteristics: Temperature | 2605 | |||||
| Endurance Characteristics: Area of Soldering | 95% | |||||
| Soldering rest: Requirement | ||||||
| Soldering rest: Time | 51S | |||||
| Soldering rest: Temperature | 2605 | |||||
| Soldering rest: Appearance | No Damage | |||||
| Heat test: Time | 96h | |||||
| Heat test: Temperature | +853 | |||||
| Heat test: Appearance | No Damage | |||||
| Heat test: Contact resistance | 20 m | |||||
| Cold test: Time | 48h | |||||
| Cold test: Temperature | -253 | |||||
| Cold test: Appearance | No Damage | |||||
| Cold test: Contact resistance | 20 m | |||||
| Temperature Cycling: Low temperature | -25 3 | |||||
| Temperature Cycling: High temperature | 85 3 | |||||
| Temperature Cycling: Cycles | 5 cycles | Test after keeping in Normal Condition for 30 min. | ||||
| Temperature Cycling: Appearance | No Damage | |||||
| Temperature Cycling: Contact resistance | 20 m | |||||
| Constant humidity: Temperature | 60 2 | |||||
| Constant humidity: Relative humidity | 90%-96% RH | |||||
| Constant humidity: Time | 96h | |||||
| Constant humidity: Appearance | No Damage | |||||
| Constant humidity: Contact resistance | 20 m | |||||
| Constant humidity: Insulation Resistance | 100 M | |||||
| Salt Spray: Salt concentration | 5 1% | |||||
| Salt Spray: Temperature | 35 2 | |||||
| Salt Spray: Time | 162h | After salt is removed by running wafer and A drop is removed, it is measured. | ||||
| Salt Spray: Appearance | No Damage | |||||
| Salt Spray: Contact resistance | 20 m |
2407261043_SHOU-HAN-0-8-2PWT_C33960147.pdf
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