Robust SHOU HAN MicroQTJ connector with full surface crimped contacts and corrosion resistant nickel plating
Product Overview
This specification sheet details the MICRO full-surface crimped connector from Shenzhen Shouhan Technology Co., Ltd. Designed for reliable electrical and mechanical performance, it features LCP UL94V-0 plastic, C5191R-H copper alloy terminals with nickel and gold plating, and a C2680R-H housing with nickel plating. It operates at up to 30VAC RMS and 1.8A, with a temperature range of -30 to +80. The product is suitable for applications requiring robust connectivity and durability, as evidenced by its extensive mechanical and environmental testing standards.
Product Attributes
- Brand: SHOUHAN
- Origin: Shenzhen, China
- Material (Plastic): LCP UL94V-0
- Material (Contact Terminals): C5191R-H, Nickel base, 1 Gold plated contact area
- Material (Housing): C2680R-H, Nickel base 50, NI 80 plated housing
- Certifications: Not explicitly stated, but references EIA and MIL STD testing standards.
Technical Specifications
| Item | Specification | Test Method/Standard |
| Product Code | MICRO (MICRO QTJ) | - |
| Working Voltage | 30VAC RMS Max | - |
| Working Current | 1.8 Ampere | - |
| Operating Temperature | -30+80 | - |
| Contact Resistance | 30m MAX | Test with low power current on contact area. Ref: EIA 364-23A |
| Insulation Resistance | 100M MIN | Test plastic impedance between adjacent contact pins. Ref: EIA 364-21A |
| Withstand Voltage | 100V DC / 100V AC 1 minute, 0.5mA | Test plastic withstand voltage between contact pins. Ref: EIA 364-20A |
| Insertion Force | 3.57kgf MIN (matched with wire end) | Wire end inserted at 25mm/min. Ref: EIA 364-13A |
| Withdrawal Force | 1.00kgf MIN (matched with wire end) | Wire end withdrawn at 25mm/min. Ref: EIA 364-13A |
| Terminal Retention Force | 0.3 kgf MIN | Force for contact pin to withdraw from plastic at 25mm/min. |
| Durability | 3000 cycles (600 cycles/hour) | Continuous plug/unplug at uniform speed. Ref: EIA 364-09A |
| Vibration Test | Amplitude 1.5mm, 10Hz-55Hz-10Hz cycle, 2 hours per X/Y/Z axis | Ref: EIA 364-28A |
| Solderability | 95% or more tin coverage | Product welding area immersed in 2355 tin bath for 50.5 seconds. Ref: MIL STD-202F |
| High Temperature Resistance | Appearance no obvious damage, Contact Resistance 100m MAX, Insulation Resistance 100M MIN | Product placed in 85 oven for 96 hours, then at room temp for 3 hours. Ref: MIL STD-1344A |
| Low Temperature Resistance | Appearance no obvious damage, Contact Resistance 100m MAX, Insulation Resistance 100M MIN | Product placed in -40 oven for 96 hours, then at room temp for 3 hours. Ref: MIL STD-1344A |
| Humidity Resistance | Appearance no obvious damage, Contact Resistance 100m MAX, Insulation Resistance 100M MIN | Product placed in 402, 9095RH environment for 120 hours. Ref: EIA 364-31A |
| Corrosion Resistance | Appearance no obvious corrosion, Contact Resistance 50m MAX | Product placed in 5% salt water, 352 salt spray chamber for 12 hours, then at room temp for 1 hour. Ref: EIA 364-26A |
| Solder Heat Resistance | Appearance no obvious discoloration/blistering, solder joint smooth tinning | Recommended Reflow Curve: (Data not fully provided in source) |
2507171700_SHOU-HAN-MicroQTJ_C404968.pdf