Durable Micro USB connector SHOU HAN MICRO 7.2 JBWZ with copper alloy contacts and RoHS compliance
Specifications
Number Of Ports:
1
Number Of Contacts:
5P
Mounting Type:
卧贴
Current Rating:
1A
Detection Color:
黑色
Operating Temperature:
-30℃~+80℃
Connector Type:
Micro-B
Connect-Disconnect Life:
5千次
Gender:
母
Mfr. Part #:
MICRO 7.2 JBWZ
Package:
SMD
Model Number:
MICRO 7.2 JBWZ
Introduction
Product Overview
This product is a Micro USB connector designed for reliable and durable performance. It meets RoHS compliance and is process capable. The connector is constructed with high-temperature thermoplastic, copper alloy contacts, and a copper alloy shell, ensuring robust mechanical and electrical characteristics suitable for various electronic applications.
Product Attributes
- Brand: MICRO 7.2 JBWZ
- Origin: (SHENZHEN SHOUHAN TECHNOLOGY CO.,LTD)
- Certifications: Pb RoHS Compliant 2002/95/EC
Technical Specifications
| Specification | Details | Test Method/Reference |
| Material | Housing: High temperature thermoplastic with g.f, UL94v-0 / LCP UL94V-0 | |
| Contact: copper alloy, t=0.20mm / C5191R-H, nickel base, gold plated 1 | ||
| Shell: copper alloy, t=0.25mm / C2680, nickel plated base 50, tin plated 80 | ||
| Electrical Specifications | Current rating: 1.0A Max / Working Current: 1.0 Ampere | |
| Dielectric withstanding voltage: 100V(AC) for 1 min. / Withstanding voltage: 100V AC for 1 minute | EIA 364-20A | |
| Contact resistance: 50m Max. / Contact resistance: 50m MAX | EIA 364-23A | |
| Insulation resistance: 100m min. / Insulation resistance: 100M MIN | 100V DC | |
| Total mating force: 3.57 Kgf Max. / Insertion force: 3.57kgf | EIA 364-13A | |
| Total unmating force: 1.0 Kgf Min. 0.81~2.05 Kgf Min. after 3,000 insertion/extraction cycles / Unmating force: 1.0kgf MIN | EIA 364-13A | |
| Mechanical Specifications | Terminal single PIN retention force: 0.5 kgf MIN | |
| Mating cycles: 3,000 cycles | EIA 364-09A | |
| Temperature range: -30C~80C / Working Temperature: -30C~+80C | ||
| Environmental Specifications | Soldering heat resistance: Dip in 2355 tin bath for 50.5 seconds | MIL STD-202F |
2510241428_SHOU-HAN-MICRO-7-2-JBWZ_C6798364.pdf
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