MICRO USB connector SHOU HAN MICRO DNJ ZB designed to operate under wide temperature range and current
Manufacturer:
SHOU HAN
Description:
USB-Micro B Receptacle Connector 5 Position Surface Mount, Right Angle
Category:
USB, DVI, HDMI Connector Adapters/USB, DVI, HDMI Connector Assemblies
Specifications
Number Of Ports:
1
Number Of Contacts:
5P
Mounting Type:
卧贴
Current Rating:
1A
Detection Color:
黑色
Voltage Rating:
30V
Operating Temperature:
-30℃~+80℃
Connector Type:
Micro-B
Connect-Disconnect Life:
5千次
Gender:
母
Mfr. Part #:
MICRO DNJ ZB
Package:
SMD
Model Number:
MICRO DNJ ZB
Introduction
Product Overview
This specification document outlines the details for the MICRO DNJ ZB product, a Micro USB connector manufactured by SHENZHEN SHOUHAN TECHNOLOGY CO.,LTD. It details material specifications, mechanical, electrical, and environmental performance criteria.
Product Attributes
- Brand: MMICRO
- Origin: Shenzhen, China
- Manufacturer: (SHENZHEN SHOUHAN TECHNOLOGY CO.,LTD)
- Model: MICRO DNJ ZB
Technical Specifications
| Test Item | Specification and Standard | Test Method and Reference Standard |
| Material Details | ||
| Plastic Part | LCP UL94V-0 | |
| Contact Terminal Part | C5191-EH, Nickel base, Contact area Gold plated 1 | |
| Housing Part | H65, Housing Nickel base 50, Tin plated 80 | |
| Working Conditions | ||
| Working Current | 1.0 Ampere | |
| Operating Temperature | -30+80 | |
| Mechanical Performance | ||
| Insertion Force | 3.0kgf MAX | Reference: EIA 364-13A (Insertion speed: 25mm/min) |
| Withdrawal Force | 0.7~1.8 kgf | Reference: EIA 364-13A (Withdrawal speed: 25mm/min) |
| Single PIN Retention Force | 0.5 kgf MIN | Reference: EIA 364-23A (Force to withdraw contact pin from plastic at 25mm/min) |
| Durability Test | 3000 cycles | Uniform insertion/withdrawal at 600 cycles/hour. Reference: EIA 364-09A |
| Vibration Test | Amplitude 1.5mm, Frequency 10Hz-55Hz-10Hz cycle for 2 hours in X/Y/Z directions. | Reference: EIA 364-28A |
| Electrical Performance | ||
| Contact Resistance | 50m MAX | Tested with low power current. Reference: EIA 364-23A |
| Insulation Resistance | 100M MIN | Tested with low voltage current. Reference: EIA 364-23A |
| Withstanding Voltage | 300V AC 1 minute 0.5mA | Test impedance between adjacent contact pins. Reference: EIA 364-20A |
| Environmental Performance | ||
| Solderability | Tin dipping area 95% | Product welding area immersed in 2355 tin bath for 50.5 seconds. Reference: MIL STD-202F |
| High Temperature Resistance | Appearance: No obvious damage. Contact Resistance: 100m MAX. Insulation Resistance: 100M MIN. | Product placed in 85 oven for 96 hours, then at room temperature for 3 hours. Reference: MIL STD-1344A |
| Low Temperature Resistance | Appearance: No obvious damage. Contact Resistance: 100m MAX. Insulation Resistance: 100M MIN. | Product placed in -40 oven for 96 hours, then at room temperature for 3 hours. Reference: MIL STD-1344A |
| Humidity Resistance | Appearance: No obvious damage. Contact Resistance: 100m MAX. Insulation Resistance: 100M MIN. | Product placed in 402, 9095RH environment for 120 hours. Reference: EIA 364-31A |
| Corrosion Resistance | Appearance: No obvious corrosion. Contact Resistance: 50m MAX. | Product placed in salt spray chamber with 5% salt water concentration at 352 for 12 hours continuous spray, then at room temperature for 1 hour. Reference: EIA 364-26A |
| Solderability (Reflow) | Appearance: No obvious discoloration or blistering; Solder joints smooth. | Recommended reflow curve: [Data not fully specified in input] |
2510241428_SHOU-HAN-MICRO-DNJ-ZB_C6798378.pdf
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