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Micro USB Connector SHOU HAN MICRO 5.9ZB5.0 WZ with Gold Plated Contact Area and Mechanical Strength

Manufacturer:
SHOU HAN
Description:
USB-Micro B Receptacle Connector 5 Position Surface Mount, Right Angle
Category:
USB, DVI, HDMI Connector Adapters/USB, DVI, HDMI Connector Assemblies
Specifications
Number Of Ports:
1
Number Of Contacts:
5P
Mounting Type:
卧贴
Current Rating:
1A
Detection Color:
黑色
Voltage Rating:
30V
Operating Temperature:
-30℃~+80℃
Connector Type:
Micro-B
Connect-Disconnect Life:
5千次
Gender:
Mfr. Part #:
MICRO 5.9ZB5.0 WZ
Package:
SMD
Model Number:
MICRO 5.9ZB5.0 WZ
Introduction

Product Overview

This document outlines the specifications for the MICRO 5.9ZB5.0 WZ, a Micro USB connector manufactured by SHENZHEN SHOUHAN TECHNOLOGY CO.,LTD. It details material composition, mechanical, electrical, and environmental performance standards.

Product Attributes

  • Brand: MICRO
  • Model: 5.9ZB5.0 WZ
  • Origin: Shenzhen, China
  • Manufacturer: SHENZHEN SHOUHAN TECHNOLOGY CO.,LTD
  • Certifications: UL94V-0 (for LCP plastic)

Technical Specifications

CategoryItemSpecificationTest Method/Reference
Material DetailsPlastic PartLCP UL94V-0
Contact Terminal PartC5191R-H, Nickel base, Gold plated contact area 1
Shell PartC2680, Nickel base 50, Tin plated 80
Mechanical PerformanceInsertion Force3.0kgf MAXEIA 364-13A (Insertion speed: 25mm/min)
Extraction Force0.7~1.8 kgfEIA 364-13A (Extraction speed: 25mm/min)
Single PIN Retention Force0.5 kgf MINEIA 364-09A (Retraction force of contact pin from plastic at 25mm/min)
Durability3000 cyclesEIA 364-28A (Plug/unplug speed: 600 cycles/hour)
Vibration Test1.5mm Amplitude, 10Hz-55Hz-10Hz cycle, 2 hours each in X/Y/Z directions
Electrical PerformanceContact Resistance50m MAXEIA 364-23A (Tested with low power current)
Insulation Resistance100M MIN (at 100V DC)
Withstanding Voltage Test300V AC 1 minute, 0.5mAEIA 364-20A (High voltage resistance between adjacent contact pins)
Plastic Impedance Between Adjacent Contact Pins100m MAX (at 0.5mA)EIA 364-21A
Working Current1.0 Ampere
Operating Temperature-30+80
SolderabilityTin dipping area 95%Immersion in 2355 tin bath for 50.5 seconds (MIL STD-202F)
Environmental PerformanceHigh Temperature ResistanceAppearance: No obvious damage. Contact Resistance: 100m MAX. Insulation Resistance: 100M MIN.96 hours in 85 oven, then 3 hours at room temp. (MIL STD-1344A)
Low Temperature ResistanceAppearance: No obvious damage. Contact Resistance: 100m MAX. Insulation Resistance: 100M MIN.96 hours in -40 oven, then 3 hours at room temp. (MIL STD-1344A)
Humidity ResistanceAppearance: No obvious damage. Contact Resistance: 100m MAX. Insulation Resistance: 100M MIN.120 hours in 402, 9095RH environment. (EIA 364-31A)
Corrosion ResistanceAppearance: No obvious corrosion. Contact Resistance: 50m MAX.12 hours continuous spray in salt fog box (5% salt water concentration, 352), then 1 hour at room temp. (EIA 364-26A)
Solder Heat ResistanceAppearance: No obvious discoloration or blistering. Solderable pins: Smooth tin dipping.Reflow curve recommended (details not provided in source)
Tin AdhesionTin dipping area 95%Product welding area immersed in 2355 tin bath for 50.5 seconds (MIL STD-202F)

2510241428_SHOU-HAN-MICRO-5-9ZB5-0-WZ_C6798309.pdf

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