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SMT Push-Push Memory Card Socket with 1.5mm Height for Micro-SIM Cards in Consumer Electronics

Manufacturer:
SOFNG
Description:
Card Connector MICRO SIM Push-Push Surface Mount
Category:
PC Card Sockets/PC Card Sockets
Specifications
Operating Temperature:
-25℃~+85℃
Card Connection Mode:
自弹式
Height Above Board:
1.5mm
Connector Type:
卡座
Card Type:
MicroSIM卡
Mfr. Part #:
SMO-1511B-P8
Package:
SMD
Highlight:

SMT Push-Push Operation Memory Card Socket

,

1.5mm Height Above Board SIM Card Socket

,

Micro-SIM Card Compatible Micro-SIM Socket

Model Number:
SMO-1511B-P8
Introduction
SMT Push-Push Memory Card Socket for SIM and Micro-SIM Cards
The SOFNG SMO-1511B-P8 is a surface-mount memory card socket featuring push-push operation, designed specifically for consumer electronics applications. This robust connector supports both standard SIM and Micro-SIM card formats with excellent electrical properties and reliable performance.
Product Attributes
  • Brand: SOFNG
  • Model: SMO-1511B-P8
  • Operation Type: SMT & Push-Push
  • Application: Consumer Electronics
  • Card Type: SIM Card & Micro-SIM Card
  • RoHS Compliance: Yes
Technical Specifications
Specification Value Notes
Contact Rating 25mA, 24V DC
Initial Contact Resistance 50mΩ max. (A) / 80mΩ max. (B)
Insulation Resistance 100MΩ min. 500V DC
Withstand Voltage 500V AC for 1 minute (A) / 350V AC for 1 minute (B)
Durable Performance (No Load) 5,000 Cycles (A) / 3,500 Cycles (B)
Durable Performance (Rated Load) 3,500 Cycles (A) / 2,500 Cycles (B)
Storage Temperature -25°C to +85°C Operating Temp: Not specified
Operating Force (Inward) 8.0-10.0N 1N = 100 gram-force
Operating Force (Exiting) 8.0-10.0N 1N = 100 gram-force
Solder-ability (IR Reflow) 250°C, 5sec. (Max.)
Solder-ability (Manual) 350°C, 3sec. (Max.)
Dimensions (L x W x H) 17.17mm x 15.75mm x 1.5mm
Pin Definition for Micro-SIM Card
  • Pin 1: VCC (Card Power)
  • Pin 2: RST (Reset)
  • Pin 3: CLK (Clock)
  • Pin 4: Reserved
  • Pin 5: GND (Ground)
  • Pin 6: VPP
  • Pin 7: I/O (Input/Output)
  • Pin 8: Reserved
Material Composition
Component Material Details
Base (A) LCP 30%G/F (Black) Heat-resistant plastic
Contact Terminal (B) C5191R-H (t=0.15mm) Phosphor Bronze Tin 30μ" base plating, Gold 1μ" plating
Shell (C) SUS301-3/4H (t=0.15mm) Stainless Steel Solder spot gold plating 1μ"
Slider (D) PA6T 30%G/F (Black) Heat-resistant nylon
Wire Spring (E) Piano wire OD=0.21mm
Spring (F) SUS304 (t=0.30mm) Stainless Steel
Download Product Datasheet (PDF)
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