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Durable SHOU HAN MICRO 4P DIP JB featuring LCP UL94V0 plastic material and gold plated contact terminals

Manufacturer:
SHOU HAN
Description:
USB-Micro B Receptacle Connector 4 Position Surface Mount, Right Angle
Category:
USB, DVI, HDMI Connector Adapters/USB, DVI, HDMI Connector Assemblies
Specifications
Number Of Ports:
1
Number Of Contacts:
4P
Mounting Type:
卧贴
Current Rating:
1A
Detection Color:
黑色
Voltage Rating:
30V
Operating Temperature:
-30℃~+80℃
Connector Type:
Micro-B
Connect-Disconnect Life:
3千次
Gender:
Mfr. Part #:
MICRO 4P DIP JB
Package:
SMD
Model Number:
MICRO 4P DIP JB
Introduction

Product Overview

This document outlines the specifications for the MICRO 4P DIP JB product from SHENZHEN SHOUHAN TECHNOLOGY CO.,LTD. It details material composition, mechanical, electrical, and environmental performance criteria, along with testing methods and reference standards.

Product Attributes

  • Brand: SHOUHAN TECHNOLOGY
  • Origin: Shenzhen, China
  • Material (Plastic): LCP UL94V-0
  • Material (Contact Terminal): C5191R-H, Nickel base, Gold plated contact area 1
  • Material (Housing): C2680R-H, Nickel plated housing base 50, Nickel plated 80
  • Certifications: EIA 364-21A, EIA 364-20A, EIA 364-13A, EIA 364-09A, EIA 364-28A, MIL STD-202F, MIL STD-1344A, EIA 364-31A, EIA 364-26A

Technical Specifications

Test ItemSpecification and StandardTest Method and Reference Standard
Material DetailsPlastic: LCP UL94V-0
Contact Terminal: C5191R-H, Nickel base, Contact area Gold plated 1
Housing: C2680R-H, Housing Nickel plated base 50, Plated NI 80
Working ConditionsWorking Current: 1Ampere
Operating Temperature: -30+80
Mechanical PerformanceInsertion Force: 3.0kgf MAX
Extraction Force: 0.7~1.8 kgf
Terminal Single PIN Retention Force: 0.5 kgf MIN
Insertion Force Reference: EIA 364-13A
Extraction Force Reference: EIA 364-13A
Terminal Retention Force Reference: EIA 364-13A
Electrical PerformanceContact Resistance: 50m MAX
Insulation Resistance: 100M MIN
Withstand Voltage Test: 300V AC 1 minute 0.5mA
Contact Resistance Reference: EIA 364-23A
Insulation Resistance Reference: EIA 364-23A
Withstand Voltage Reference: EIA 364-20A
Environmental PerformanceTin Dipping: Tinning area 95%
High Temperature Resistance: No obvious damage, Contact Resistance 100m MAX, Insulation Resistance 100M MIN
Low Temperature Resistance: No obvious damage, Contact Resistance 100m MAX, Insulation Resistance 100M MIN
Moisture Resistance: No obvious damage, Contact Resistance 100m MAX, Insulation Resistance 100M MIN
Corrosion Resistance: No obvious corrosion, Contact Resistance 50m MAX
Solderability: No obvious discoloration or blistering; Solder foot tinning smooth
Tin Dipping Reference: MIL STD-202F
High Temperature Reference: MIL STD-1344A
Low Temperature Reference: MIL STD-1344A
Moisture Resistance Reference: EIA 364-31A
Corrosion Resistance Reference: EIA 364-26A
Solderability Reference: EIA 364-26A
Durability TestLife Test: 3000 cycles (plugging and unplugging at 600 cycles/hour)
Vibration Test: Frequency 10Hz to 55Hz and back to 10Hz per minute, 1.5mm amplitude, 2 hours each in X/Y/Z directions
Life Test Reference: EIA 364-09A
Vibration Test Reference: EIA 364-28A

2504101957_SHOU-HAN-MICRO-4P-DIP-JB_C668589.pdf

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