SHOU HAN MICRO 180 ZB2 USB Connector Supporting 1 Ampere Current with Durable Nickel Base Components
Specifications
Number Of Ports:
1
Number Of Contacts:
5P
Mounting Type:
直插
Current Rating:
1.8A
Detection Color:
黑色
Voltage Rating:
30V
Operating Temperature:
-30℃~+80℃
Connector Type:
Micro-B
Gender:
母
Mfr. Part #:
MICRO 180°ZB2
Package:
Through Hole
Model Number:
MICRO 180°ZB2
Introduction
MICRO 180ZB2 - USB Connector Specification
This document outlines the specifications for the MICRO 180ZB2 USB connector manufactured by SHENZHEN SHOUHAN TECHNOLOGY CO.,LTD. It details material composition, mechanical, electrical, and environmental performance criteria.
Product Attributes
- Brand: MICRO
- Origin: Shenzhen, China
- Manufacturer: SHENZHEN SHOUHAN TECHNOLOGY CO.,LTD
Technical Specifications
| Item | Specification | Test Method/Reference Standard |
| 1. Material Details | ||
| 1.1 Plastic Part | LCP UL94V-0 | |
| 1.2 Contact Terminal Part | C5191R-H, Nickel base, Gold plated contact area 1 | |
| 1.3 Shell Part | SUS201, Nickel base 50, Tin plated 80 | |
| 2. Working Conditions | ||
| 2.1 Working Current | 1.0 Ampere | |
| 2.2 Operating Temperature | -30+80 | |
| 3. Electrical Performance | ||
| 3.1 Contact Resistance | 50m MAX | Low power current test on contact area. Ref: EIA 364-23A |
| 3.2 Insulation Resistance | 100M MIN | 100V DC. Ref: EIA 364-21A |
| 3.3 Withstand Voltage Test | 300V AC 1 minute 0.5mA | Test plastic impedance between adjacent contact pins. Ref: EIA 364-20A |
| 4. Mechanical Performance | ||
| 4.1 Insertion Force | 3.0kgf MAX | Force when mating end is inserted at 25mm/min. Ref: EIA 364-13A |
| 4.2 Withdrawal Force | 0.7kgf MIN | Force when mating end is withdrawn at 25mm/min. Ref: EIA 364-13A |
| 4.3 Terminal Single PIN Retention Force | 0.5 kgf MIN | Force to withdraw contact pin from plastic at 25mm/min. |
| 4.4 Durability Test | 3000 cycles | Uniform speed plugging/unplugging at 600 cycles/hour. Ref: EIA 364-09A |
| 4.5 Vibration Test | 1.5mm amplitude, 10Hz-55Hz-10Hz cycle, 2 hours per X/Y/Z direction | Ref: EIA 364-28A |
| 5. Environmental Performance | ||
| 5.1 Solderability | Tin coverage 95% | Product welding area immersed in 2355 solder bath for 50.5 seconds. Ref: MIL STD-202F |
| 5.2 High Temperature Resistance | Appearance: No obvious damage. Contact Resistance: 100m MAX. Insulation Resistance: 100M MIN. | After placing product in 85 oven for 96 hours, then at room temperature for 3 hours. Ref: MIL STD-1344A |
| 5.3 Low Temperature Resistance | Appearance: No obvious damage. Contact Resistance: 100m MAX. Insulation Resistance: 100M MIN. | After placing product in -40 oven for 96 hours, then at room temperature for 3 hours. Ref: MIL STD-1344A |
| 5.4 Humidity Resistance | Appearance: No obvious damage. Contact Resistance: 100m MAX. Insulation Resistance: 100M MIN. | After placing product in 402, 9095%RH environment for 120 hours. Ref: EIA 364-31A |
| 5.5 Corrosion Resistance | Appearance: No obvious corrosion. Contact Resistance: 50m MAX. | Continuous spray in 5% salt solution at 352 for 12 hours, then at room temperature for 1 hour. Ref: EIA 364-26A |
| 5.6 Solderability (Reflow) | Appearance: No obvious discoloration or blistering. Solder joints: Smooth. | Recommended reflow curve: (Refer to provided graph, not extractable into text) |
2510241428_SHOU-HAN-MICRO-180-ZB2_C6798381.pdf
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