Dip sockets with gold low gold and tin plating options TE Connectivity 828-AG11D-ESL supports flexible system upgrades
Manufacturer:
TE Connectivity
Description:
28P DIP Through Hole IC Sockets
Category:
IC Sockets/IC Sockets
Specifications
Number Of Positions:
28P
Adaptation Package Type:
DIP
Mfr. Part #:
828-AG11D-ESL
Package:
Through Hole
Model Number:
828-AG11D-ESL
Introduction
DIP Sockets
Our extensive range of DIP sockets, from 6 to 48 contacts, ensures a highly reliable connection between integrated circuit (IC) devices and PCBs. Available with various termination options including through-hole and surface mounting, four-finger and dual leaf contacts, and multiple plating choices, these sockets offer quick IC mating/unmating, easy field IC replacement, and flexibility for system upgrades. They are ideal for industrial controls, intelligent buildings, medical devices, military applications, and other embedded systems.
Product Attributes
- Brand: TE Connectivity
- Certifications: UL94 V-0 (Insulator)
Technical Specifications
| Feature | Four-Fingered Contacts | Dual Leaf Contacts |
| Insulator | Thermoplastic polyester, UL94 V-0, 30% glass filled | PBT, thermoplastic, black |
| Contact Sleeve | Copper | -- |
| Contact | Beryllium copper | Phosphorous bronze |
| Contact Plating | Gold, low gold, tin | Tin |
| Insertion Force | Machined: 179 Grams AVG, Stamped: 134 Grams AVG | 300 Grams max. |
| Withdrawal Force | 63 Grams AVG | 20 Grams min. |
| Accepted IC PIN | .009 x .015 through .011 x .020, OR .016 to .021 diameter, .150/.105 long | .008 - .012 |
| Contact Rating | 3 Amps/pin | 1 Amp/pin |
| Contact Resistance | 10 Milliohms max. | 20 Milliohms max. |
| Dielectric Withstanding | Open frame: 1,000 Volts RMS per MIL-STD-1344, Method 3001.1 Closed frame: 1,000 Volts RMS per EIA-364-20 | 1000V AC min. |
Product Matrix
| Position | RoHS Compliant - Open Frame | RoHS Compliant - Closed Frame | Not RoHS Compliant - Open Frame | Not RoHS Compliant - Closed Frame |
| 6 | Tin (Stamped) | N/A | 1571551-1 (Gold Flash) | N/A |
| 8 | Tin (Stamped) | N/A | 2-1571551-2 (Gold Flash) | N/A |
| 14 | Tin (Stamped) | N/A | 2-1571552-3 (Gold Flash) | N/A |
| 16 | Tin (Stamped) | N/A | 2-1571552-4 (Gold Flash) | N/A |
| 18 | Tin (Stamped) | N/A | 2-1571552-5 (Gold Flash) | N/A |
| 20 | Tin (Stamped) | N/A | 2-1571552-6 (Gold Flash) | N/A |
| 22 | Tin (Stamped) | N/A | 2-1571552-7 (Gold Flash) | N/A |
| 24 | Tin (Stamped) | N/A | 2-1571552-8 (Gold Flash) | N/A |
| 28 | Tin (Stamped) | N/A | 2-1571552-9 (Gold Flash) | N/A |
| 32 | Tin (Stamped) | N/A | 3-1571552-0 (Gold Flash) | N/A |
| 36 | Tin (Stamped) | N/A | 3-1571552-1 (Gold Flash) | N/A |
| 40 | Tin (Stamped) | N/A | 3-1571552-2 (Gold Flash) | N/A |
| 48 | Tin (Stamped) | N/A | 3-1571552-4 (Gold Flash) | N/A |
DIP Sockets with Dual Leaf Contact
| Part Number | Description | Position | Centerline (mm) | Solder Type | Contact Plating |
| 1-2199298-1 | 6P, DIP SKT, 300 CL, LDR, PB FREE | 6 | 7.62 | Through Hole | Tin |
| 1-2199298-2 | 8P, DIP SKT, 300 CL, LDR, PB FREE | 8 | 7.62 | Through Hole | Tin |
| 1-2199298-3 | 14P, DIP SKT, 300 CL, LDR, PB FREE | 14 | 7.62 | Through Hole | Tin |
| 1-2199298-4 | 16P, DIP SKT, 300 CL, LDR, PB FREE | 16 | 7.62 | Through Hole | Tin |
| 1-2199298-5 | 18P, DIP SKT, 300 CL, LDR, PB FREE | 18 | 7.62 | Through Hole | Tin |
| 1-2199298-6 | 20P, DIP SKT, 300 CL, LDR, PB FREE | 20 | 7.62 | Through Hole | Tin |
| 1-2199298-8 | 24P, DIP SKT, 300 CL, LDR, PB FREE | 24 | 7.62 | Through Hole | Tin |
| 1-2199298-9 | 28P, DIP SKT, 300 CL, LDR, PB FREE | 28 | 7.62 | Through Hole | Tin |
| 1-2199299-2 | 28P, DIP SKT, 600 CL, LDR, PB FREE | 28 | 15.24 | Through Hole | Tin |
| 1-2199300-2 | 32P, DIP SKT, 600 CL, OTC, PB FREE | 32 | 15.24 | Through Hole | Tin |
| 1-2199299-5 | 40P, DIP SKT, 600 CL, LDR, PB FREE | 40 | 15.24 | Through Hole | Tin |
2412161845_TE-Connectivity-828-AG11D-ESL_C7198845.pdf
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