DIP Socket TE Connectivity 540-AG11D-ES Featuring Beryllium Copper and Phosphorous Bronze Contacts for PCB
Manufacturer:
TE Connectivity
Description:
40P DIP Through Hole IC Sockets
Category:
IC Sockets/IC Sockets
Specifications
Number Of Positions:
40P
Adaptation Package Type:
DIP
Mfr. Part #:
540-AG11D-ES
Package:
Through Hole
Model Number:
540-AG11D-ES
Introduction
DIP Sockets
Our extensive range of DIP sockets, available from 6 to 48 contacts, offers a highly reliable connection for integrated circuit (IC) devices on PCBs. With termination options including through-hole and surface mounting, and contact types such as four-finger and dual leaf, alongside various plating choices, these sockets provide quick IC mating/unmating, easy field IC replacement, and flexibility for system upgrades. They are ideal for applications in industrial controls, intelligent buildings, medical devices, military, and other embedded systems.
Product Attributes
- Brand: TE Connectivity
- Certifications: UL94 V-0 (Insulator)
Technical Specifications
| Feature | Four-Fingered Contacts | Dual Leaf Contacts |
| Insulator Material | Thermoplastic polyester, UL94 V-0 30% glass filled | PBT, thermoplastic, black |
| Contact Material | Beryllium copper (Sleeve), Phosphorous bronze (Contact) | Phosphorous bronze (Contact) |
| Contact Plating Options | Gold, low gold, tin | Tin |
| Insertion Force | Machined: 179 Grams AVG Stamped: 134 Grams AVG | 300 Grams max. |
| Withdrawal Force | 63 Grams AVG | 20 Grams min. |
| Accepted IC PIN Size | .009 x .015 through .011 x .020, OR .016 to .021 diameter, .150/.105 long | .008 - .012 |
| Contact Rating | 3 Amps/pin | 1 Amp/pin |
| Contact Resistance | 10 Milliohms max. | 20 Milliohms max. |
| Dielectric Withstanding Voltage | Open frame: 1,000 Volts RMS Closed frame: 1,000 Volts RMS | 1000V AC min. |
Product Matrix (Partial Example - Four-Fingered Contacts)
| Position | RoHS Compliant | Not RoHS Compliant |
| 6 | Tin (Open Frame, Stamped Contact): 1571551-1 Tin (Closed Frame, Stamped Contact): 1571550-1 | Gold Flash (Open Frame, Stamped Contact): 2-1571551-1 Gold (Closed Frame, Machined Contact): 1437535-7 |
| 8 | Tin (Open Frame, Stamped Contact): 1571551-2 Tin (Closed Frame, Stamped Contact): 1571550-2 | Gold Flash (Open Frame, Stamped Contact): 2-1571551-2 Gold (Closed Frame, Machined Contact): 1437537-8 |
| 14 | Tin (Open Frame, Stamped Contact): 1571551-3 Tin (Closed Frame, Stamped Contact): 1571550-3 | Gold Flash (Open Frame, Stamped Contact): 2-1571551-3 Gold (Closed Frame, Machined Contact): 1-1437535-4 |
Product Matrix (Partial Example - Dual Leaf Contacts)
| Part Number | Description | Position | Centerline (mm) | Solder Type | Contact Plating** |
| 1-2199298-1 | 6P, DIP SKT, 300 CL, LDR, PB FREE | 6 | 7.62 | Through Hole | Tin |
| 1-2199298-2 | 8P, DIP SKT, 300 CL, LDR, PB FREE | 8 | 7.62 | Through Hole | Tin |
| 1-2199298-3 | 14P, DIP SKT, 300 CL, LDR, PB FREE | 14 | 7.62 | Through Hole | Tin |
| 1-2199298-4 | 16P, DIP SKT, 300 CL, LDR, PB FREE | 16 | 7.62 | Through Hole | Tin |
2412161844_TE-Connectivity-540-AG11D-ES_C6693770.pdf
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