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2.5mm Pitch Wire to Board Connector BOOMELE Boom Precision Elec XH-4AWD Terminal Housing Wafer Assembly

Manufacturer:
BOOMELE(Boom Precision Elec)
Description:
Connector Header 4 position 2.5mm Pitch Right Angle
Category:
Free Hanging, Panel Mount/Headers, Male Pins
Specifications
Y-Width Of Bottom Edge On Board:
7mm
Reference Series:
XH
Pins Structure:
1x4P
Contact Plating:
-
Contact Material:
-;-
Operating Temperature:
-55℃~+105℃
Flame Retardant Rating:
-
Supplementary Features:
-
Pitch:
2.5mm
Voltage Rating (Max):
250V
Number Of PINs Per Row:
4
Number Of Rows:
1
X-Length Of Bottom Edge On Board (Spacing Line):
-
Z-Height Of The Board:
5.8mm
Row Spacing:
7.5mm
Mounting Type:
弯插
Mfr. Part #:
XH-4AWD
Package:
Through Hole,Right Angle,P=2.5mm
Model Number:
XH-4AWD
Introduction

Product Overview

This specification covers the 2.5mm Pitch Wire to Board Connector series. Designed for reliable electrical connections, these connectors are suitable for a wide range of applications requiring secure wire-to-board termination. The series includes terminals, housings, and right-angle surface mount (SMT) wafer assemblies, all manufactured to meet stringent performance and durability standards.

Product Attributes

  • Brand: BOOMELE
  • Product Series: XH SERIES
  • Certifications: LEAD FREE

Technical Specifications

Category Item Specification Details
Product Identification Product Name Terminal, Housing, Wafer Assembly
Part Number XH-PT (Terminal), XH-Y (Housing), XH-A/AW/AWD/AWD(K) (Wafer Assembly)
Packaging Quantity Terminal: 6K, Housing: 1K, Wafer Assembly: 1K
Ratings Rated Voltage (MAX.) 250V
Rated Current (MAX.) 3A (AWG #22 to #32)
Ambient Temperature Range -25 to +85
Applicable Wire AWG #22 to #32
Max. Insulation O.D. 1.0mm
Electrical Performance Contact Resistance (mated) 20 milliohm MAX. Test Condition: Mate connectors, measure by dry circuit, 20mV MAX., 30mA.
Insulation Resistance 100 Megohm MIN. Test Condition: Apply 500V DC between adjacent terminals or terminal and ground.
Dielectric Strength No Breakdown Test Condition: Apply 1000V AC(rms) between adjacent terminals or terminal and ground for 1 minute.
Contact Resistance (crimped portion) 5 milliohm MAX. Test Condition: Crimp applicable wire to terminal, measure by dry circuit, 20mV MAX., 30mA.
Mechanical Performance Insertion and Withdrawal Force (Connector) Refer to paragraph 7 Test Condition: Insert and withdraw connectors at 25+3mm/minute.
Crimping Strength AWG #22: 9.8 N (1.0kgf) MIN.
AWG #32: 4.9 N (0.5kgf) MIN.
Test Condition: Fix crimped terminal, apply axial pull out force on wire at 25+3mm/minute.
Terminal Insertion Force (into Housing) 4.9 N (0.5kgf) MAX. Test Condition: Insert crimped terminal into housing.
Terminal/Housing Retention Force 4.9 N (0.5kgf) MIN. Test Condition: Apply axial pull out force to terminal in housing at 25+3mm/minute.
Pin Retention Force 4.9 N (0.5kgf) MIN. Test Condition: Apply axial push force at 25+3mm/minute.
Durability & Environmental Performance Mechanical Life (Repeated Insertion/Withdrawal) Contact Resistance: 40 milliohm MAX. Test Condition: 30 cycles at 10 cycles/minute.
Temperature Rise (at rated current) 30 MAX. Test Condition: Carrying rated current load (UL 498).
Vibration Appearance: No Damage
Contact Resistance: 40 milliohm MAX.
Discontinuity: 1.0 microsecond MAX.
Test Condition: 1.5mm P-P, 10-55-10 Hz/min, 2 hours each axis (MIL-STD-202 Method 201).
Shock Appearance: No Damage
Contact Resistance: 40 milliohm MAX.
Discontinuity: 1.0 microsecond MAX.
Test Condition: 490m/s {50G}, 3 strokes each axis (JIS C60068-2-27/MIL-STD-202 Method 213).
Heat Resistance Appearance: No Damage
Contact Resistance: 40 milliohm MAX.
Test Condition: 96 hours at 83-87 (JIS C60068-2-2/MIL-STD-202 Method 108).
Cold Resistance Appearance: No Damage
Contact Resistance: 40 milliohm MAX.
Test Condition: 96 hours at -37 to -43 (JIS C60068-2-1).
Humidity Appearance: No Damage
Contact Resistance: 40 milliohm MAX.
Dielectric Strength: Must meet 4-1-3
Insulation Resistance: 10 Megohm MIN.
Test Condition: 96 hours at 58-62, 90-95% RH (JIS C60068-2-3/MIL-STD-202 Method 103).
Soldering Performance Solderability Solder Wetting: 95% of immersed area must show no voids, pin holes. Test Condition: Soldering Time 2-3 sec, Solder Temp 242-248, 0.5mm from tip.
Resistance To Solder Heat No Damage Test Condition: Soldering iron method, Time 2-4 sec, Temp 370-400, 0.5mm from tip.
Infrared Reflow Condition Peak Temp: 250 MAX.
Time (above 230): 30 SEC.
Total Time: 120 SEC.
(Pre-heat: 150200)
Note: Conditions may vary based on soldering equipment and PC boards.

2410121247_BOOMELE-Boom-Precision-Elec-XH-4AWD_C8877.pdf

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