wire to board connector series BOOMELE Boom Precision Elec TJC2-3A with 7.5 to 5.0 millimeter pitch
Manufacturer:
BOOMELE(Boom Precision Elec)
Description:
Connector Header 3 position 4A Through Hole -25℃~+85℃
Category:
Free Hanging, Panel Mount/Headers, Male Pins
Specifications
Flame Retardant Rating:
UL94V-0
Pins Structure:
1x3P
Reference Series:
-
Contact Plating:
锡
Contact Material:
黄铜;PA66
Pitch:
-
Voltage Rating (Max):
250V
Number Of PINs Per Row:
3
Number Of Rows:
1
X-Length Of Bottom Edge On Board (Spacing Line):
12.75mm
Row Spacing:
-
Mounting Type:
直插
Operating Temperature:
-25℃~+85℃
Mfr. Part #:
TJC2-3A
Package:
Through Hole
Model Number:
TJC2-3A
Introduction
Product Overview
The TJC2 SERIES is a 7.5-5.0mm pitch wire-to-board connector series designed for reliable electrical connections. This series offers a range of components including terminals, housings, and SMT (Surface Mount Technology) wafer assemblies. It is suitable for applications requiring a rated voltage of up to 250V and a maximum rated current of 5A with AWG #18 to #24 wires. The connectors are engineered to perform under a wide ambient temperature range of -25 to +120, ensuring durability and consistent performance in various industrial environments.
Product Attributes
- Brand: BOOMELE
- Series: TJC2 SERIES
- Type: Wire to Board Connector
- Termination Style: SMT (Surface Mount Technology)
- Lead Free: Yes
Technical Specifications
| Item | Standard / Test Condition | Requirement |
|---|---|---|
| 1. Scope | ||
| This specification covers the 7.5-5.0mm PITCH WIRE TO BOARD CONNECTOR series. | ||
| 2. Product Name and Part Number | ||
| Product Name | Terminal (AWG #18-24 | TJC2 Terminal |
| Housing | TJC2-Y | |
| Wafer Assembly (R/A) Lead Free (Embossed Tape Package) | TJC2-A | |
| Wafer Assembly (R/A) Lead Free (Embossed Tape Package Silicagel Package) | Refer to the drawing | |
| 3. Ratings and Applicable Wires | ||
| Rated Voltage (MAX.) | 250 V | |
| Max. Insulation O.D. | 1.0mm | |
| Rated Current (MAX.) and Applicable wires | AWG. #18 | 5A |
| AWG. #24 | 5A | |
| Ambient Temperature Range | -25+120 | |
| 4. Performance | ||
| 4-1. Electrical Performance | ||
| Contact Resistance | Mate connectors, measure by dry circuit, 10mV MAX., 50mA. (JIS C5402 5.4) | 20 milliohm MAX. |
| Insulation Resistance | Apply 500V DC between adjacent terminals or terminal and ground. (JIS C5402 5.2/MIL-STD-202 Method 302) | 100 Megohm MIN. |
| Dielectric Strength | Apply 1500V AC(rms) between adjacent terminals or terminal and ground for 1 minute. (JIS C5402 5.1/MIL-STD-202 Method 301) | No Breakdown |
| Contact Resistance on Crimped Portion | Crimp the applicable wire to the terminal, and measure contact resistance by dry circuit, 10mV MAX., 50mA. | 5 milliohm MAX. |
| 4-2. Mechanical Performance | ||
| Insertion and Withdrawal Force | Insert and withdraw connectors at the speed rate of 25 3mm/minute. | Refer to paragraph 7 |
| Crimping Strength | Fix the crimped terminal, apply axial pull out force on the wire at the speed rate of 25 3mm/minute. | AWG. #18: 9.8 N (1.0kgf) MIN. AWG. #24: 4.9 N (0.5kgf) MIN. |
| Terminal Insertion Force | Insert the crimped terminal into the housing | 4.9 N (0.5kgf) MAX. |
| Terminal/ Housing Retention Force | Apply axial pull out force to the terminal assembled in the housing at the speed rate of 25 3mm/minute. | 4.9 N (0.5kgf) MIN. |
| Pin Retention Force | Apply axial push force at the speed rate of 25 3mm/minute. | 4.9 N (0.5kgf) MIN. |
| 4-3. Reliability Performance | ||
| Repeated Insertion/ Withdrawal | When mated up to 30 cycles repeatedly by the rate of 10 cycles per minute. | Contact Resistance: 40 milliohm MAX. |
| Temperature Rise | Carrying rated current load. (UL 498) | 30 MAX. |
| Vibration | Amplitude 1.5mm P-P, Sweep Time: 10-55-10 Hz in 1 minute, Duration: 2 hours in each x.y.z. axes (MIL-STD-202 Method 201) | Appearance: No Damage Contact Resistance: 40 milliohm MAX. Discontinuity: 1.0 microsecond MAX. |
| Shock | 490m/s {50G}, 3 strokes in each X.Y.Z. axes. (JIS C60068-2-27/MIL-STD-202 Method 213) | Appearance: No Damage Contact Resistance: 40 milliohm MAX. Discontinuity: 1.0 microsecond MAX. |
| Heat Resistance | 85 2, 96 hours (JIS C60068-2-2/MIL-STD-202 Method 108) | Appearance: No Damage Contact Resistance: 40 milliohm MAX. |
| Cold Resistance | -40 3, 96 hours (JIS C60068-2-1) | Appearance: No Damage Contact Resistance: 40 milliohm MAX. |
| Humidity | Temperature 58-62, Relative Humidity 90-95%, Duration: 96 hours (JIS C60068-2-3/MIL-STD-202 Method 103) | Appearance: No Damage Contact Resistance: 40 milliohm MAX. Dielectric Strength: Must meet 4-1-3 Insulation Resistance: 10 Megohm MIN. |
| Temperature Cycling | 5 cycles of: a) 55 30min b) +105 30min (JIS C0025) | Appearance: No Damage Contact Resistance: 40 milliohm MAX. |
| Salt Spray | 48 4 hours exposure to a salt spray from 5 1% solution at 35 2. (JIS C5028/MIL-STD-202 Method 101) | Appearance: No Damage Contact Resistance: 40 milliohm MAX. |
| SO2 Gas | 24 hours expose to 50 5ppm SO2 gas at 40 2. | Appearance: No Damage Contact Resistance: 40 milliohm MAX. |
| NH3 Gas | 40 minutes exposure to NH3 gas evaporating from 28% Ammonia solution. | Appearance: No Damage Contact Resistance: 40 milliohm MAX. |
| Solderability | Soldering Time 2-3 sec. Solder Temperature 2453, 0.5mm from terminal tip and fitting nail tip. | Solder Wetting: 95% of immersed area must show no voids, pin holes. |
| Resistance To Soldering Heat | Soldering iron method: Soldering time: 3 1 sec. Solder temperature 370-400, 0.5mm from terminal tip and fitting nail tip. | No Damage |
| 5. Product Shape, Dimensions and Materials | ||
| Refer to the drawing | ||
| 6. Infrared Reflow Condition | ||
| Peak Temp: 250 MAX. Time above 230: 30 SEC. MIN. Pre-heat (150200): 120 SEC. | ||
| 7. Insertion / Withdrawal Force (Unit: N) | ||
| Housing and Wafer | Insertion force (Sample 1-5) | 14N - 16N |
| Withdrawal force (Sample 1-5) | 15N - 17.5N | |
| Housing and Terminal | Insertion force (Sample 1-5) | 7.4N - 7.7N |
| Withdrawal force (Sample 1-5) | 50N - 56N | |
| Note | Insertion and withdrawal forces for housing and wafer are measured after terminals are crimped and assembled with housing and wafer. | |
2410121247_BOOMELE-Boom-Precision-Elec-TJC2-3A_C47543.pdf
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