1.0mm Pitch SMT Connector CAX CAX-AFA07-05SCB-H2.5 Right Angle Type Designed for Flexible Flat Cable
Manufacturer:
CAX
Description:
FFC/FPC Connector 5 Position 1mm Pitch Top Contact Surface Mount, Right Angle -25℃~+85℃
Category:
FFC, FPC (Flat Flexible) Connector Assemblies/FFC, FPC (Flat Flexible) Connector Housings
Specifications
Locking Feature:
抽屉式
Operating Temperature:
-25℃~+85℃
Number Of Contacts:
5P
Contact Type:
上接
FFC, FCB Thickness:
0.3mm
Pitch:
1mm
Mfr. Part #:
CAX-AFA07-05SCB-H2.5
Package:
SMD,P=1mm,Surface Mount,Right Angle
Model Number:
CAX-AFA07-05SCB-H2.5
Introduction
Product Overview
This specification covers the 1.0mm Pitch H=2.5 FPC/FFC ZIF R/A Type K SMT Connectors series. These connectors are designed for various applications requiring a reliable connection for Flexible Printed Circuits (FPC) and Flexible Flat Cables (FFC).
Product Attributes
- Brand: CHUANG DU ELECTRONICS
- Origin: ZHE JIANG
- Housing Material: LCP (Natural Color, UL94V-0 Flammability Rating)
- Latch Material: LCP (Black Color, UL94V-0 Flammability Rating)
- Terminal Material: Phosphor Bronze
- Fitting Nail Material: Phosphor Bronze
- Pitch: 1.0mm
- Height: 2.5mm
- Type: SMT, Right Angle (R/A), K Type, Pull Tab
- Packaging Options: Tube (Small Batch), Reel (Bulk Order Recommended)
Technical Specifications
| Category | Item | Specifications | Test Conditions |
|---|---|---|---|
| Ratings | Operating Voltage (Max.) | 50V AC | - |
| Current Rating (Max.) | 0.5A DC | - | |
| Operating Temperature Range | -55C to +85C | - | |
| Operating Humidity Range | 90% RH | - | |
| Storage Temperature Range | -40C to +50C | - | |
| Storage Humidity Range | 90% RH | - | |
| Electrical Performance | Contact Resistance | 40 m (Initial) | Mate FPC/FFC, 20mV Max, 100mA (EIA-364-23) |
| Insulation Resistance | 500 M (Min.) | Mate FPC/FFC, 500V DC between adjacent terminals/ground (EIA-364-21) | |
| Dielectric Strength | No Breakdown | Mate FPC/FFC, 250V AC (rms) for 1 minute between adjacent terminals/ground (EIA-364-20) | |
| Mechanical Performance | FPC Retention Force | Pos.x 0.40N (Min.) | Insert Latch, pull FPC at 253mm/min (EIA-364-13) |
| Terminal Retention Force | 3.0N (Min.) | Axial pull out force on terminal in housing at 253mm/min (EIA-364-29) | |
| Fitting Nail Retention Force | 1.0N (Min.) | Axial pull out force on fitting nail in housing at 253mm/min (EIA-364-29) | |
| Environmental Performance & Others | Durability | Contact Resistance 60 m (Max.) | 20 cycles at < 10 cycles/min (EIA-364-09) |
| Temperature Rise | 30C (Max.) | Measure at contact point with max rated current (EIA-364-70 Method 2) | |
| Vibration | Appearance: No Damage Contact Resistance: 60 m (Max.) Discontinuity: 1sec (Max.) | DC 100mA, 1.5mm amplitude, 10-55-10 Hz for 2 hours in X,Y,Z axes (EIA-364-28 Condition I) | |
| - | Shock | Appearance: No Damage Contact Resistance: 60 m (Max.) Discontinuity: 1sec (Max.) | DC 100mA, 490m/s {50G} for 3 times in 6 directions (EIA-364-27, Test condition A) |
| - | Heat Resistance | Appearance: No Damage Contact Resistance: 60 m (Max.) | Mate FPC/FFC, exposed to 852C for 96 hours, conditioned at room temp (EIA-364-17) |
| - | Cold Resistance | Appearance: No Damage Contact Resistance: 60 m (Max.) | Mate FPC/FFC, exposed to -402C for 96 hours, conditioned at room temp (EIA-364-59) |
| - | Humidity | Appearance: No Damage Contact Resistance: 60 m (Max.) Dielectric Strength: No Breakdown Insulation Resistance: 20 M (Min.) | Mate FPC/FFC, exposed to 402C, 90-95% RH for 96 hours, conditioned at room temp (EIA-364-31) |
| - | Thermal Shock | Appearance: No Damage Contact Resistance: 60 m (Max.) | Mate FPC/FFC, 5 cycles of -553C (30min) to +853C (30min), conditioned at room temp (EIA-364-32) |
| - | Salt Spray | Appearance: No Damage Contact Resistance: 60 m (Max.) | 51% NaCl, 352C. 244 hrs (1-2u" Au), 484 hrs (3u" Au), rinsed and dried (EIA-364-26) |
| Soldering | Solderability / Wetting | 95% wetting area, no voids/pinholes | Immersion at 2455C for 30.5 sec, 0.1mm from housing bottom (EIA-364-52) |
| Resistance to Soldering Heat | Appearance: No Damage | Soldering iron: 370-400C, 5 sec max, 0.2mm from tip (EIA-364-56) |
Infrared Reflow Condition
Refer to the provided temperature graph for infrared reflow soldering conditions.
Temperature on Board Pattern Side:
- Pre-Heat: 150C MAX. (60 sec)
- Peak Temperature: 230C MIN. / 250C MAX. (20-40 sec)
- Soldering Time: 3 sec. or less
Note: The graph illustrates temperature over time, with specific ranges and durations for pre-heating and peak soldering.
2507091655_CAX-CAX-AFA07-05SCB-H2-5_C49274107.pdf
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