Compact 1.0mm pitch FPC FFC ZIF connector CAX CAX-A07-08SCB-H2.5 with LCP housing and phosphor bronze terminals
Product Overview
This specification covers the 1.0mm Pitch H=2.5 FPC/FFC ZIF R/A Type K SMT Connectors series. These connectors are designed for various electronic applications requiring a compact and reliable connection solution. They feature a robust construction with LCP housing and latch, and phosphor bronze terminals and fitting nails.
Product Attributes
- Brand: CHUANG DU ELECTRONICS CO.,LTD
- Origin: ZHE JIANG
- Housing Material: LCP (Natural Color, UL94V-0 Flammability Rating)
- Latch Material: LCP (Black Color, UL94V-0 Flammability Rating)
- Terminal Material: Phosphor Bronze
- Fitting Nail Material: Phosphor Bronze
- Available Packaging: Tube (Small Batch), Reel (Bulk Recommended)
Technical Specifications
| Category | Item | Specifications | Test Condition |
|---|---|---|---|
| Rating | Operating Voltage (Max.) | 50V AC | |
| Current Rating (Max.) | 0.5A DC | ||
| Operating Temperature Range | -55C ~ +85C | ||
| Operating Humidity Range | 90% RH Max. | Relative humidity below 90% | |
| Rating | Storage Temperature Range | -40C ~ +50C | |
| Storage Humidity Range | 90% RH Max. | Relative humidity below 90% | |
| Pitch | 1.0mm | ||
| Height | 2.5mm | ||
| Electrical Performance | Contact Resistance | 40 m Max. | Mate applicable FPC/FFC, test voltage 20mV, current 100mA (EIA-364-23) |
| Insulation Resistance | 500 M Min. | Mate applicable FPC/FFC, apply 500V DC between adjacent terminals or ground (EIA-364-21) | |
| Dielectric Strength | No Breakdown | Mate applicable FPC/FFC, apply 250V AC (rms) for 1 minute between adjacent terminals or ground (EIA-364-20) | |
| Mechanical Performance | FPC Retention Force | Pos. x 0.40N Min. | Insert latch, pull FPC at 253mm/min (EIA-364-13) |
| Terminal Retention Force | 3.0N Min. | Apply axial pull out force at 253mm/min on terminal in housing (EIA-364-29) | |
| Fitting Nail Retention Force | 1.0N Min. | Apply axial pull out force at 253mm/min on fitting nail in housing (EIA-364-29) | |
| Environmental Performance | Durability | Contact Resistance: 60m Max. | Insert and withdraw actuator up to 20 cycles at <10 cycles/min (EIA-364-09) |
| Temperature Rise | 30C Max. | Measure temperature rise at contact point when passing max rated current (EIA-364-70 Method 2) | |
| Environmental Performance | Vibration | Appearance: No Damage Contact Resistance: 60m Max. Discontinuity: 1sec Max. | Mate connectors, pass DC 100mA, Amplitude 1.5mm P-P, Frequency 10~55~10 Hz/min for 2 hours in X,Y,Z axes (EIA-364-28 Condition I) |
| Shock | Appearance: No Damage Contact Resistance: 60m Max. Discontinuity: 1sec Max. | Mate applicable FPC/FFC, pass DC 100mA, 3 times per 6 directions (X,Y,Z axes), 490m/s {50G} (EIA-364-27, Test condition A) | |
| Heat Resistance | Appearance: No Damage Contact Resistance: 60m Max. | Mate applicable FPC/FFC, expose to 852C for 96 hours, then condition at room temp 1-2 hours (EIA-364-17) | |
| Environmental Performance | Cold Resistance | Appearance: No Damage Contact Resistance: 60m Max. | Mate applicable FPC/FFC, expose to -402C for 96 hours, then condition at room temp 1-2 hours (EIA-364-59) |
| Humidity | Appearance: No Damage Contact Resistance: 60m Max. Dielectric Strength: No Breakdown Insulation Resistance: 20 M Min. | Mate applicable FPC/FFC, expose to 402C, 90-95% RH for 96 hours, then condition at room temp 1-2 hours (EIA-364-31) | |
| Environmental Performance | Thermal Shock | Appearance: No Damage Contact Resistance: 60m Max. | Mate applicable FPC/FFC, subject to 5 cycles of -553C (30min) and +853C (30min), then condition at room temp 1-2 hours (EIA-364-32) |
| Salt Spray | Appearance: No Damage Contact Resistance: 60m Max. | Mate applicable FPC/FFC, expose to 51% NaCl solution at 352C for 244 hours (1-2m gold) or 484 hours (3m gold), then rinse and dry (EIA-364-26) | |
| Other Performance | Solderability | 95% wetting area, no voids or pinholes. | Dip conductive terminals into molten solder at 2455C up to 0.1mm from housing bottom for 30.5 sec (EIA-364-52) |
| Resistance to Soldering Heat | Appearance: No Damage | Soldering iron method: 0.2mm from terminal tip, 5 sec Max., 370-400C (EIA-364-56) |
Infrared Reflow Condition
Refer to paragraph 7 for infrared reflow temperature profile.
Temperature Conditions (Temperature on Board Pattern Side):
- Pre-Heat: 150C MAX. (60 sec)
- Soak: 20-40 sec at 230C MIN.
- Peak Temperature: 250C MAX. (3 sec or less)
2506041705_CAX-CAX-A07-08SCB-H2-5_C49023331.pdf
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