Compact 1.0mm pitch zif connector series including CAX CAX-AFA07-11XCB-H2.5 for fpc ffc applications
Manufacturer:
CAX
Description:
FFC/FPC Connector 11 Position 1mm Pitch Bottom Contact Surface Mount, Right Angle -25℃~+85℃
Category:
FFC, FPC (Flat Flexible) Connector Assemblies/FFC, FPC (Flat Flexible) Connector Housings
Specifications
Locking Feature:
抽屉式
Operating Temperature:
-25℃~+85℃
Number Of Contacts:
11P
Contact Type:
下接
FFC, FCB Thickness:
0.3mm
Pitch:
1mm
Mfr. Part #:
CAX-AFA07-11XCB-H2.5
Package:
SMD,P=1mm,Surface Mount,Right Angle
Model Number:
CAX-AFA07-11XCB-H2.5
Introduction
Product Overview
This specification covers the 1.0mm Pitch H=2.5 FPC/FFC ZIF R/A Type K SMT Connectors series. Designed for reliable electrical connections, these connectors are suitable for various applications requiring compact and robust interfaces.
Product Attributes
- Brand: CHUANG DU ELECTRONICS
- Origin: ZHE JIANG
- Housing Material: LCP (Natural Color, UL94V-0 Flammability Rating)
- Latch Material: LCP (Black Color, UL94V-0 Flammability Rating)
- Terminal Material: Phosphor Bronze
- Fitting Nail Material: Phosphor Bronze
- Packaging Options: Tube (Small Batch), Reel (Bulk Shipment Recommended)
Technical Specifications
| Category | Item | Test Condition | Specification |
|---|---|---|---|
| Ratings | Operating Voltage (Max.) | 50V AC | |
| Current Rating (Max.) | 0.5A DC | ||
| Operating Temperature Range | -55C ~ +85C | ||
| Environmental Ratings | Operating Humidity Range | Relative humidity 90% max. | |
| Storage Temperature Range | -40C ~ +50C | ||
| Electrical Performance | Contact Resistance | Mate applicable FPC/FFC, test voltage 20mV, current 100mA (EIA-364-23) | 40 m Max. |
| Insulation Resistance | Mate applicable FPC/FFC, apply 500V DC between adjacent terminals or ground (EIA-364-21) | 500 M Min. | |
| Dielectric Strength | Mate applicable FPC/FFC, apply 250V AC (rms) for 1 minute between adjacent terminals or ground (EIA-364-20) | No Breakdown | |
| Mechanical Performance | FPC Retention Force | Insert Latch, pull FPC at 253mm/min (EIA-364-13) | Pos.x 0.40N Min. |
| Terminal Retention Force | Apply axial pull out force at 253mm/min on terminal in housing (EIA-364-29) | 3.0N Min. | |
| Fitting Nail Retention Force | Apply axial pull out force at 253mm/min on fitting nail in housing (EIA-364-29) | 1.0N Min. | |
| Environmental Performance | Durability | Insert and withdraw actuator up to 20 cycles at < 10 cycles/min (EIA-364-09) | Contact Resistance: 60m Max. |
| Temperature Rise | Measure temperature rise at contact points when max rated current is passed (EIA-364-70 Method 2) | 30C Max. | |
| Vibration | DC 100mA, 1.5mm displacement, 10~55~10 Hz for 2 hours per axis (X,Y,Z) (EIA-364-28 Condition I) | Appearance: No Damage, Contact Resistance: 60m Max., Discontinuity: 1sec Max. | |
| Shock | DC 100 mA, 3 times per direction on 3 axes, 490m/s {50G} (EIA-364-27, Test condition A) | Appearance: No Damage, Contact Resistance: 60m Max., Discontinuity: 1sec Max. | |
| Heat Resistance | Expose to 852C for 96 hours, then condition at room temp 1-2 hours (EIA-364-17) | Appearance: No Damage, Contact Resistance: 60m Max. | |
| Environmental Performance (cont.) | Cold Resistance | Expose to -402C for 96 hours, then condition at room temp 1-2 hours (EIA-364-59) | Appearance: No Damage, Contact Resistance: 60m Max. |
| Humidity | Expose to 402C, 90-95% RH for 96 hours, then condition at room temp 1-2 hours (EIA-364-31) | Appearance: No Damage, Contact Resistance: 60m Max., Dielectric Strength: No Breakdown, Insulation Resistance: 20 M Min. | |
| Thermal Shock | 5 cycles of -553C (30 min) and +853C (30 min), then condition at room temp 1-2 hours (EIA-364-32) | Appearance: No Damage, Contact Resistance: 60m Max. | |
| Salt Spray | NaCl 51% soln, 352C. 244 hrs (1-2u" Au) or 484 hrs (3u" Au), then wash & dry (EIA-364-26) | Appearance: No Damage, Contact Resistance: 60m Max. | |
| Soldering Performance | Solderability | Immersion in molten solder at 2455C for 30.5 seconds (EIA-364-52) | Solder Wetting: 95% Min. wetting area, no voids/pinholes. |
| Resistance to Soldering Heat | Soldering iron method: 370~400C, 5 seconds Max. (EIA-364-56) | Appearance: No Damage. | |
| Reflow Soldering | Infrared Reflow Condition | (See graph in source document) Peak Temp: 250C Max. (3 sec or less), Pre-Heat: 150C Max. (60-90 sec), Time above 230C: 20-40 sec. |
2507091655_CAX-CAX-AFA07-11XCB-H2-5_C49274191.pdf
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